Abstract: A medication delivery module is mounted to a patient care device, and a first graphic representative of the first medication delivery module is displayed on a display screen of the device, wherein the first graphic includes an information display area for display of infusion information associated with the first medication delivery module, and a status indicator for display of status information associated with the medication delivery module. Responsive to the indication, the status indicator is dynamically orienting such that the status indicator is displayed on a side of the first graphic nearest the coupling of the first medication delivery module. Infusion information from the first medication delivery module is displayed within the display area of the first graphic.

Abstract: A mobile machine for separation and recovery of spent shot, the machine including a drive unit to provide self-propelled mobility to the machine, a charged soil collection assembly mounted relative to the drive unit to collect soil charged with spent shot, and at least one separation assembly to separate spent shot from other collected material, the spent shot conveyed to a collection vessel for disposal.

Abstract: Delivery of a modularly reconfigurable vehicle may include receiving a request for the modularly reconfigurable vehicle, including a desired configuration associated with the modularly reconfigurable vehicle and a location associated with the request.

Abstract: A medication delivery module is mounted to a patient care device, and a first graphic representative of the first medication delivery module is displayed on a display screen of the device, wherein the first graphic includes an information display area for display of infusion information associated with the first medication delivery module, and a status indicator for display of status information associated with the medication delivery module. Responsive to the indication, the status indicator is dynamically orienting such that the status indicator is displayed on a side of the first graphic nearest the coupling of the first medication delivery module. Infusion information from the first medication delivery module is displayed within the display area of the first graphic.

Abstract: A method for making an interconnection component includes forming a mask layer that covers a first opening in a sheet-like element that includes a first opening extending between the first and second surfaces of the element. The element consists essentially of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. The first opening includes a central opening and a plurality of peripheral openings open to the central opening that extends in an axial direction of the central opening. A conductive seed layer can cover an interior surface of the first opening. The method further includes forming a first mask opening in at least a portion of the mask layer overlying the first opening to expose portions of the conductive seed layer within the peripheral openings; and forming electrical conductors on exposed portions of the conductive seed layer.

Abstract: A method including receiving, in a main frame of a patient care unit, an infusion information from a medication delivery module coupled with the main frame is provided. The medication delivery module being mounted on a plug-in port associated with the main frame. The method also includes displaying, on a display in the main frame, an individual channel card including at least a portion of the infusion information from the medication delivery module and orienting an edge of the individual channel card toward a location of the plug-in port relative to the main frame, the edge having a visual indicator that visually indicates an orientation of the module associated with the individual channel card. The method also includes expanding the individual channel card to display a detailed portion of the infusion information upon receipt of a user selection. A system and a non-transitory, computer readable medium including instructions to perform the above method are also provided.

Abstract: A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a microelectronic element having a top surface adjacent the inner surface, a bottom surface remote from the top surface, and a plurality of contacts at the top surface. The microelectronic unit can also include terminals electrically connected with the contacts of the microelectronic element. The terminals can be electrically insulated from the carrier structure. The microelectronic unit can also include a dielectric region contacting at least the bottom surface of the microelectronic element. The dielectric region can define a planar surface located coplanar with or above the front surface of the carrier structure.

Abstract: A brake system for a vehicle comprises a driver operable brake pedal coupled to control a brake pressure generating unit to supply hydraulic brake pressure to front and rear hydraulically actuated wheel brakes, and wherein the rear wheel brakes are also configured to be electrically actuated; a sensor arrangement for monitoring the driver's braking intent; the brake system operable in a first mode wherein the front and rear brakes are both hydraulically actuated, and a second mode wherein the front brakes are hydraulically actuated and the rear brakes are electrically actuated, the rear brakes include a caliper assembly including brake pads operable to engage a brake rotor to brake the vehicle, the caliper assembly including a hydraulic actuating mechanism and an electric actuating mechanism, a control connected to the sensor arrangement for operating the electric actuating mechanism to actuate the rear brakes as a function of the driver's braking demand.

Abstract: A method including receiving, in a main frame of a patient care unit, an infusion information from a medication delivery module coupled with the main frame is provided. The medication delivery module being mounted on a plug-in port associated with the main frame. The method also includes displaying, on a display in the main frame, an individual channel card including at least a portion of the infusion information from the medication delivery module and orienting an edge of the individual channel card toward a location of the plug-in port relative to the main frame, the edge having a visual indicator that visually indicates an orientation of the module associated with the individual channel card. The method also includes expanding the individual channel card to display a detailed portion of the infusion information upon receipt of a user selection. A system and a non-transitory, computer readable medium including instructions to perform the above method are also provided.

Abstract: Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.

Abstract: A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface, forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces, and forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad.

Abstract: A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connect an additional microelectronic element to the active elements of the first chip. The structure may have a volume comparable to that of the first chip alone and yet provide the functionality of a multi-chip assembly. A composite chip incorporating a body and a layer of semiconductor material mounted on a front surface of the body similarly may have a cavity extending into the body from the rear surface and may have an additional microelectronic element mounted in such cavity.

Abstract: A method for making an interconnection component includes forming a mask layer that covers a first opening in a sheet-like element that includes a first opening extending between the first and second surfaces of the element. The element consists essentially of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. The first opening includes a central opening and a plurality of peripheral openings open to the central opening that extends in an axial direction of the central opening. A conductive seed layer can cover an interior surface of the first opening. The method further includes forming a first mask opening in at least a portion of the mask layer overlying the first opening to expose portions of the conductive seed layer within the peripheral openings; and forming electrical conductors on exposed portions of the conductive seed layer.

Abstract: Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.

Abstract: A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a microelectronic element having a top surface adjacent the inner surface, a bottom surface remote from the top surface, and a plurality of contacts at the top surface. The microelectronic unit can also include terminals electrically connected with the contacts of the microelectronic element. The terminals can be electrically insulated from the carrier structure. The microelectronic unit can also include a dielectric region contacting at least the bottom surface of the microelectronic element. The dielectric region can define a planar surface located coplanar with or above the front surface of the carrier structure.

Abstract: Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a top surface and portions of the side walls of the interconnect structure covered in a dissimilar material. In some embodiments, the dissimilar material can be a conductive material or a nano-alloy. The interconnect structure can be formed by removing a portion of the interconnect structure, and covering the interconnect structure with the dissimilar material. The interconnect structure can comprise a damascene structure, such as a single or dual damascene structure, or alternatively, can comprise a silicon-through via (TSV) structure.

Abstract: A method is disclosed for making an interconnection component. The steps include forming a mask layer covering a first opening in a sheet-like element that has first and second opposed surfaces; forming a plurality of mask openings in the mask layer, wherein the first opening and a portion of the first surface are partly aligned with each mask opening; and forming electrical conductors on spaced apart portions of the first surface and on spaced apart portions of the interior surface within the first opening which are exposed by the mask openings. The element may consist essentially of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. Each conductor may extend along an axial direction of the first opening and the first conductors may be fully separated from one another within the first opening.

Abstract: Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.

Abstract: A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connect the additional microelectronic element to the active elements of the first chip. The structure may have a volume comparable to that of the first chip alone and yet provide the functionality of a multi-chip assembly. A composite chip incorporating a body and a layer of semiconductor material mounted on a front surface of the body similarly may have a cavity extending into the body from the rear surface and may have an additional microelectronic element mounted in such cavity.