Abstract: A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface, forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces, and forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad.

Abstract: Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.

Abstract: A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connect the additional microelectronic element to the active elements of the first chip. The structure may have a volume comparable to that of the first chip alone and yet provide the functionality of a multi-chip assembly. A composite chip incorporating a body and a layer of semiconductor material mounted on a front surface of the body similarly may have a cavity extending into the body from the rear surface and may have an additional microelectronic element mounted in such cavity.

Abstract: A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface, forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces, and forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad.

Abstract: A method and system for controlling temperatures in a driveline assembly of a vehicle are provided. In one embodiment, the method includes determining an operating temperature associated with the driveline assembly of the vehicle, the driveline assembly comprising forward and rear axles and a power transfer device configured to transmit power from a power source of the vehicle to the forward and rear axles. The method further includes computing a gain factor responsive to the operating temperature, adjusting a control parameter value of a traction control system of the vehicle responsive to the gain factor, and generating a control signal from the traction control system responsive to the control parameter value, the control signal configured to adjust at least one of an output torque of the power source and a braking force of a brake of the vehicle.

Abstract: A method and system for controlling temperatures in a driveline assembly of a vehicle are provided. In one embodiment, the method includes determining an operating temperature associated with the driveline assembly of the vehicle, the driveline assembly comprising forward and rear axles and a power transfer device configured to transmit power from a power source of the vehicle to the forward and rear axles. The method further includes computing a gain factor responsive to the operating temperature, adjusting a control parameter value of a traction control system of the vehicle responsive to the gain factor, and generating a control signal from the traction control system responsive to the control parameter value, the control signal configured to adjust at least one of an output torque of the power source and a braking force of a brake of the vehicle.

Abstract: Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a top surface and portions of the side walls of the interconnect structure covered in a dissimilar material. In some embodiments, the dissimilar material can be a conductive material or a nano-alloy. The interconnect structure can be formed by removing a portion of the interconnect structure, and covering the interconnect structure with the dissimilar material. The interconnect structure can comprise a damascene structure, such as a single or dual damascene structure, or alternatively, can comprise a silicon-through via (TSV) structure.

Abstract: A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a microelectronic element having a top surface adjacent the inner surface, a bottom surface remote from the top surface, and a plurality of contacts at the top surface. The microelectronic unit can also include terminals electrically connected with the contacts of the microelectronic element. The terminals can be electrically insulated from the carrier structure. The microelectronic unit can also include a dielectric region contacting at least the bottom surface of the microelectronic element. The dielectric region can define a planar surface located coplanar with or above the front surface of the carrier structure.

Abstract: Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a top surface and portions of the side walls of the interconnect structure covered in a dissimilar material. In some embodiments, the dissimilar material can be a conductive material or a nano-alloy. The interconnect structure can be formed by removing a portion of the interconnect structure, and covering the interconnect structure with the dissimilar material. The interconnect structure can comprise a damascene structure, such as a single or dual damascene structure, or alternatively, can comprise a silicon-through via (TSV) structure.

Abstract: A vehicle lighting assembly and method includes an LED light source mounted on a vehicle and a multi-tube condensing structure arranged to condense light from the LED light source. The multi-tube condensing structure has a first end face for receiving light from the LED light source and a second end face spaced apart from the first end face for dispersing the light received from the LED light source. The first end face has a first end face surface area and the second end face has a second end face surface area. The second end face surface area is less than the first end face surface area to thereby condense the light received from the LED light source.

Abstract: An alert system within a vehicle including a sensor and at least one speaker that generates at least one air thrust when a sensor detects a hazardous condition. The frequency and strength of the at least one air thrust varies based on the awareness level of the driver. In one embodiment, at least one air thrust is directed towards the driver from the direction of the hazardous condition. The hazardous condition may include, but is not limited to the driver falling asleep or a vehicle running a red light.

Abstract: A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a microelectronic element having a top surface adjacent the inner surface, a bottom surface remote from the top surface, and a plurality of contacts at the top surface. The microelectronic unit can also include terminals electrically connected with the contacts of the microelectronic element. The terminals can be electrically insulated from the carrier structure. The microelectronic unit can also include a dielectric region contacting at least the bottom surface of the microelectronic element. The dielectric region can define a planar surface located coplanar with or above the front surface of the carrier structure.

Abstract: A method of fabricating a microelectronic unit includes providing a semiconductor element having a front surface and a rear surface remote from the front surface, forming at least one first opening extending from the rear surface partially through the semiconductor element towards the front surface by directing a jet of fine abrasive particles towards the semiconductor element, and forming at least one conductive contact and at least one conductive interconnect coupled thereto. The semiconductor element can include a plurality of active semiconductor devices therein. The semiconductor element can include a plurality of conductive pads exposed at the front surface. Each conductive interconnect can extend within one or more of the first openings and can be coupled directly or indirectly to at least one of the conductive pads. Each of the conductive contacts can be exposed at the rear surface of the semiconductor element for electrical connection to an external device.

Abstract: Electrical contacts comprising a surface with a plurality of cavities therein and their methods of manufacture and use.

Abstract: A microelectronic assembly is provided which includes a first element consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface facing and attached to a major surface of a microelectronic element at which a plurality of conductive pads are exposed, the microelectronic element having active semiconductor devices therein. A first opening extends from an exposed surface of the first element towards the surface attached to the microelectronic element, and a second opening extends from the first opening to a first one of the conductive pads, wherein where the first and second openings meet, interior surfaces of the first and second openings extend at different angles relative to the major surface of the microelectronic element. A conductive element extends within the first and second openings and contacts the at least one conductive pad.

Abstract: An electrical connection structure includes a variable-composition nickel alloy layer with a minor constituent selected from a group consisting of boron, carbon, and tungsten, wherein at least over a portion of a conductive substrate, the concentration of the minor constituent varies throughout the variable-composition nickel alloy layer in a direction from the bottom surface of the variable-composition nickel alloy layer to the top surface of the variable-composition nickel alloy layer.

Abstract: An alert system within a vehicle including a sensor and at least one speaker that generates at least one air thrust when a sensor detects a hazardous condition. The frequency and strength of the at least one air thrust varies based on the awareness level of the driver. In one embodiment, at least one air thrust is directed towards the driver from the direction of the hazardous condition. The hazardous condition may include, but is not limited to the driver falling asleep or a vehicle running a red light.

Abstract: An electrical connection structure includes a variable-composition nickel alloy layer with a minor constituent selected from a group consisting of boron, carbon, phosphorus, and tungsten, wherein at least over a portion of a conductive substrate, the concentration of the minor constituent decreases throughout the variable-composition nickel alloy layer in a direction from the bottom surface of the variable-composition nickel alloy layer to the top surface of the variable-composition nickel alloy layer.

Abstract: Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a top surface and portions of the side walls of the interconnect structure covered in a dissimilar material. In some embodiments, the dissimilar material can be a conductive material or a nano-alloy. The interconnect structure can be formed by removing a portion of the interconnect structure, and covering the interconnect structure with the dissimilar material. The interconnect structure can comprise a damascene structure, such as a single or dual damascene structure, or alternatively, can comprise a silicon-through via (TSV) structure.

Abstract: A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface, forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces, and forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad.