Patents by Inventor Daisuke Hayashi

Daisuke Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7435938
    Abstract: There is provided a PD-TIA module that can be used for recognition of an address of an optical packet signal in a system having variation in mark rate all the time, such as an optical packet communication system. An optical communication module comprises a photoelectric converter for converting an optical signal into a current signal, a current/voltage conversion means connected to the photoelectric converter, for converting the current signal into a voltage signal, and a limiting amplifier for receiving and amplifying an electric signal subjected to voltage conversion by the current/voltage conversion means while comparing the electric signal as amplified with a predetermined threshold value, thereby outputting a signal for “0” or “1”.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: October 14, 2008
    Assignee: Yokogawa Electric Corporation
    Inventors: Daisuke Hayashi, Masayuki Suehiro, Hirotoshi Kodaka, Yasukazu Akasaka, Shinji Iio, Morio Wada, Toshimasa Umezawa, Toshiyasu Izawa, Hiroshi Shimizu
  • Publication number: 20080239173
    Abstract: A projector includes an illumination device that emits an illumination light flux, a color-separating optical system that separates light from the illumination device into plural color lights and directs the color lights to an illuminated area, and a plurality of liquid crystal light valves that have liquid crystal panels. The crystal light valves are configured to maximize light utilization efficiency.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 2, 2008
    Applicant: Seiko Epson Corporation
    Inventor: Daisuke Hayashi
  • Publication number: 20080210680
    Abstract: A substrate processing apparatus of which through holes in a mounting stage can be properly sealed. A substrate processing apparatus comprises a plate-like mounting stage having a plurality of first through holes, a base member including a plurality of second through holes that have female thread portions, a plurality of pin-shaped members being passed through and fitted into the first and second through holes and including flange portions, a plurality of sealing surfaces, and a plurality of sealing members disposed such as to enclose openings of the first through holes. One ends of the pin-shaped members project out from the sealing surfaces, and the other ends have male thread portions capable of engaging with female thread portions of the base member. When the base member moves away from the mounting stage, an end of each of the female thread portions comes into abutment with an end of each of the male thread portions.
    Type: Application
    Filed: January 28, 2008
    Publication date: September 4, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Daisuke HAYASHI, Morihiro TAKANASHI
  • Publication number: 20080178914
    Abstract: A substrate processing apparatus that can reduce the number of parts. A first gas introduction hole through which the hydrogen fluoride gas is introduced into a GDP is formed in an upper lid. A second gas introduction hole through which hydrogen fluoride gas is introduced from a hydrogen fluoride gas source is formed in a processing vessel. When the upper lid engages the upper portion of the processing vessel, one end of the first gas introduction hole is joined with one end of the second gas introduction hole to form an introduction path through which the hydrogen fluoride gas is introduced into a chamber.
    Type: Application
    Filed: January 25, 2008
    Publication date: July 31, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Daisuke HAYASHI
  • Publication number: 20080182423
    Abstract: A substrate processing apparatus that can prevent formation of deposit in openings of a plurality of gas supply holes leading into a processing chamber. Each of the gas supply holes is configured to uniformly supply a processing gas, whose molecules are turned into clusters, into the processing chamber and to prevent liquefaction of processing gas when the processing gas is supplied into the processing chamber.
    Type: Application
    Filed: January 15, 2008
    Publication date: July 31, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Daisuke Hayashi, Morihiro Takanashi
  • Publication number: 20080181825
    Abstract: A substrate mounting structure that can maintain the temperature uniformity of a substrate mounted on a mounting stage. The substrate mounting structure disposed in a pressure reduced space has a base portion, a pillar portion mounted in a standing manner on the base portion and having an internal space, and a mounting stage supported on the pillar portion and having a substrate mounted thereon. The mounting stage has a heating element that heats the mounted substrate, and a thermal breaking unit that mechanically breaks an electrical power supply line connected to the heating element depending on the temperature of the substrate. The pillar portion is comprised of a thin-walled cylinder. The thermal breaking unit is disposed on the pillar portion's internal space side in the mounting stage, and the pressure in the internal space is reduced.
    Type: Application
    Filed: January 28, 2008
    Publication date: July 31, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Daisuke HAYASHI
  • Publication number: 20080149598
    Abstract: A substrate processing apparatus that can accurately control the temperature of a focus ring without causing abnormal electric discharge and the back-flow of radio frequency electrical power during the application of radio frequency electrical power. A wafer is mounted on a mounting stage disposed in a housing chamber. An annular focus ring is mounted on the mounting stage in such a manner as to surround the peripheral portion of the mounted wafer. The pressure in the housing chamber is reduced, radio frequency electrical power is applied to the mounting stage, and the focus ring generates heat by itself.
    Type: Application
    Filed: December 5, 2007
    Publication date: June 26, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Daisuke HAYASHI, Kazuya Nagaseki
  • Publication number: 20080110719
    Abstract: A torque fluctuation absorbing apparatus includes a hub member with a flange portion, first and second side-plates provided at both axial sides of the flange portion, respectively, a damper mechanism absorbing a fluctuation of a relative torque generated between the flange portion of the hub member and the first and second side-plates, a thrust member provided between the first side-plate and the flange portion of the hub member, and a first disc spring provided between the first side-plate and the thrust member and biasing the thrust member towards the flange portion of the hub member. The first side plate includes a bent portion bent towards the flange portion of the hub member and a bore formed at the bent portion, and the thrust member is formed with an engagement portion extending through the bore of the first side-plate and engaged with the bore of the first side-plate.
    Type: Application
    Filed: November 9, 2007
    Publication date: May 15, 2008
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Tomohiro Saeki, Masanori Suzuki, Daisuke Hayashi, Makoto Takeuchi
  • Publication number: 20080099440
    Abstract: A substrate processing method capable of preventing a reduction in productivity of the fabrication of a semiconductor device from a substrate. An HF gas is supplied toward a wafer having a thermally-oxidized film, a BPSG film, and a deposit film, to thereby selectively etch the BPSG film and the deposit film using fluorinated acid. A residual matter of H2SiF6 produced at the time of etching is decomposed into HF and SiF4 by being heated.
    Type: Application
    Filed: October 9, 2007
    Publication date: May 1, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Daisuke HAYASHI
  • Patent number: 7338576
    Abstract: Each magnet segment 22 of a magnetic field forming mechanism 21 is constructed such that, after the magnetic pole of each magnet segment 22 set to face a vacuum chamber 1 as shown in FIG. 3A, adjoining magnet segments 22 are synchronously rotated in opposite directions, and hence every other magnet element 22 is rotated in the same direction as shown in FIGS. 3B, 3C to thereby control the status of a multi-pole magnetic field formed in the vacuum chamber 1 and surrounding a semiconductor wafer W. Therefore, the status of a multi-pole magnetic field can be easily controlled and set appropriately according to a type of plasma processing process to provide a good processing easily.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: March 4, 2008
    Assignee: Tokyo Electron Limited
    Inventors: Hiroo Ono, Koichi Tateshita, Masanobu Honda, Kazuya Nagaseki, Daisuke Hayashi
  • Patent number: 7339119
    Abstract: A harness outlet structure of an engine permitting a reliable shield at a harness outlet of the engine. The structure includes a wiring harness is clamped by a shield cover and an engine main body via a grommet bracket. The grommet bracket includes a groove having a width equivalent to the thickness of the shield cover disposed circumferentially between two flange portions of the grommet bracket. A harness overall for shielding the wiring harness is mounted externally on a proximal end of the grommet bracket. The harness overall is a shield outer jacket body formed from braided metal fibers. The harness overall is inserted over an outside of the proximal end of the grommet bracket until one end of the harness overall contacts the flange portion. The harness overall is then joined by a coupling ring.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: March 4, 2008
    Assignee: Honda Motor Co., Ltd.
    Inventors: Akira Hamazu, Mamoru Mikame, Daisuke Hayashi, Kiyoaki Yokoyama, Hiroshi Uruno
  • Patent number: 7331307
    Abstract: A thermally sprayed member or an electrode includes a basic material, a thermally sprayed film formed on the surface of the basic material, the thermally sprayed film being made of an insulating ceramic and a metallic intermediate layer provided between the basic material and the thermally sprayed film for increasing a bonding force therebetween, wherein the thermally sprayed film side of the member is exposed to a high frequency plasma atmosphere and the electrode is intended to form a high frequency plasma on the side of the thermally sprayed film. The basic material includes a base portion made of a conductive material and a dielectric portion provided to include a part of a surface of the basic material. Further, the intermediate layer is comprised of a plurality of island-shaped parts isolated from each other.
    Type: Grant
    Filed: February 11, 2005
    Date of Patent: February 19, 2008
    Assignee: Tokyo Electron Limited
    Inventor: Daisuke Hayashi
  • Publication number: 20080007680
    Abstract: The present invention provides a liquid crystal panel having a high contrast ratio in the front direction. The liquid crystal panel includes a first polarizing plate, a second polarizing plate, and a liquid crystal cell, in which the first polarizing plate is arranged on a display surface side and the second polarizing plate is arranged on a back surface side of the liquid crystal cell. The first polarizing plate includes a first polarizer and a first retardation layer arranged between the first polarizer and the liquid crystal cell. The second polarizing plate includes a second polarizer and a second retardation layer arranged between the second polarizer and the liquid crystal cell. An index ellipsoid of the first retardation layer satisfies nx>ny?nz, and an index ellipsoid of the second retardation layer satisfies nx=ny>nz. The transmittance of the second polarizing plate is greater than that of the first polarizing plate.
    Type: Application
    Filed: July 9, 2007
    Publication date: January 10, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takeharu KITAGAWA, Naotaka KINJOU, Daisuke HAYASHI, Takeshi NISHIBE, Hideki ISHIDA
  • Publication number: 20070284085
    Abstract: Disclosed herein is a plasma processing apparatus that introduces a process gas into an airtight processing container, that applies a radio frequency power to generate plasma, and that conducts a plasma process to an object to be processed arranged in the processing container. The plasma processing apparatus includes: an electrode unit arranged in the processing container, the electrode unit having an electrode for applying the radio frequency power, and a space portion arranged in the electrode unit, the space portion insulating the electrode and the processing container from each other. The space portion communicates with atmospheric air outside the processing container.
    Type: Application
    Filed: May 4, 2007
    Publication date: December 13, 2007
    Inventors: Daisuke Hayashi, Kazuya Nagaseki, Shinji Himori, Atsushi Matsuura, Ryo Nonaka
  • Publication number: 20070281757
    Abstract: A receiving device performs reception in a service period of a broadcast signal and switches to a power saving mode in a non-service period. The service period is composed of a first period during which an application data table of an MPE-FEC frame is transmitted and a second period, following the first period, during which an RS data table of the MPE-FEC frame is transmitted. An error correction unit 12 performs one of error correction that uses the whole RS data table according to MPE-FEC, and erasure correction that uses a same number of parity bytes as bytes having bit errors. When the bit errors are corrected by the error correction unit 12 performing erasure correction, a power control unit 30 switches a receiving circuit to a power saving mode before the second period ends.
    Type: Application
    Filed: December 2, 2005
    Publication date: December 6, 2007
    Inventors: Noritaka Iguchi, Ryosuke Mori, Tetsuya Yagi, Koji Setoh, Daisuke Hayashi, Ippei Kanno
  • Publication number: 20070217356
    Abstract: The present invention aims to provide a reception apparatus that receives and demodulates a signal transmitted by using time-division multiplexing, with reduced power consumption. In detail, a receiving unit including a tuner operates to receive a signal only during a time period for which a desired signal is transmitted. The received signal is converted into digital data, and the digital data is stored into a memory. With the use of the digital data stored in the memory, a PLL performs all of the necessary operations from synchronization establishment to demodulation.
    Type: Application
    Filed: May 11, 2005
    Publication date: September 20, 2007
    Inventors: Ippei Kanno, Ryosuke Mori, Daisuke Hayashi, Kouji Setoh, Tetsuyu Yagi, Noritaka Iguchi
  • Publication number: 20070210037
    Abstract: The present invention is a cooling block that forms an electrode for generating a plasma for use in a plasma process, and includes a channel for a cooling liquid, the cooling block comprising: a first base material and a second base material respectively made of aluminum, at least one of the first and second base materials having a recess for forming a channel for a cooling liquid; and a diffusion bonding layer, in which zinc is diffused in aluminum, and an anti-corrosion layer of a zinc oxide film, the layers being formed by interposing zinc between the first and second base materials, and by bonding the first and second base materials with zinc interposed therebetween in a heating atmosphere containing oxygen.
    Type: Application
    Filed: February 21, 2007
    Publication date: September 13, 2007
    Inventors: Toshifumi Ishida, Daisuke Hayashi
  • Patent number: RE39939
    Abstract: A processing system has an upper electrode with gas discharge holes of a shape corresponding to the external we of insulating members. The insulating members are formed of a poly(ether etherketone) resin, a polyimide resin, a poly (ether imide) resin or the like. Each insulating member has a step at its outer surface and an internal longitudinal through hole tapered to expand toward the processing chamber. The insulating members are pressed in the gas discharge holes to bring the steps into contact with shoulders formed in the sidewalls of the gas discharge holes. A part of each insulting member, as fitted in the gas discharge hole, projects from a surface of the upper electrode that faces a susceptor.
    Type: Grant
    Filed: April 8, 1998
    Date of Patent: December 18, 2007
    Assignee: Tokyo Electron Limited
    Inventors: Nobuyuki Okayama, Hidehito Saegusa, Jun Ozawa, Daisuke Hayashi, Naoki Takayama, Koichi Kazama
  • Patent number: RE39969
    Abstract: A processing system has an upper electrode with gas discharge holes of a shape corresponding to the external we of insulating members. The insulating members are formed of a poly(ether etherketone) resin, a polyimide resin, a poly (ether imide) resin or the like. Each insulating member has a step at its outer surface and an internal longitudinal through hole tapered to expand toward the processing chamber. The insulating members are pressed in the gas discharge holes to bring the steps into contact with shoulders formed in the sidewalls of the gas discharge holes. A part of each insulating member, as fitted in the gas discharge hole, projects from a surface of the upper electrode that faces a susceptor.
    Type: Grant
    Filed: April 8, 1998
    Date of Patent: January 1, 2008
    Assignee: Tokyo Electron Limited
    Inventors: Nobuyuki Okayama, Hidehito Saegusa, Jun Ozawa, Daisuke Hayashi, Naoki Takayama, Koichi Kazama
  • Patent number: RE40046
    Abstract: A processing system has an upper electrode with gas discharge holes of a shape corresponding to the external we of insulating members. The insulating members are formed of a poly(ether etherketone) resin, a polyimide resin, a poly(ether imide) resin or the like. Each insulating member has a step at its outer surface and an internal longitudinal through hole tapered to expand toward the processing chamber. The insulating members are pressed in the gas discharge holes to bring the steps into contact with shoulders formed in the sidewalls of the gas discharge holes. A part of each insulating member, as fitted in the gas discharge hole, projects from a surface of the upper electrode that faces a susceptor.
    Type: Grant
    Filed: April 8, 1998
    Date of Patent: February 12, 2008
    Assignee: Tokyo Electron Limited
    Inventors: Nobuyuki Okayama, Hidehito Saegusa, Jun Ozawa, Daisuke Hayashi, Naoki Takayama, Koichi Kazama