Patents by Inventor Daisuke Kimura
Daisuke Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11962329Abstract: The technology relates to an encoding device, an encoding method, a decoding device, a decoding method, and a program enabling encoding with favorable transmission efficiency with a controlled running disparity. A calculation section divides inputted data into N or M bits to calculate a first running disparity of an N or M bit data string. A determination section determines whether the data string is inverted based on the first running disparity calculated by the calculation section and a second running disparity calculated therebefore. An addition section inverts or non-inverts the data string based on a determination result by the determination section to add a flag indicating the determination result for outputting. The determination section determines not to perform inversion when the data string is a control code. The addition section adds the flag assigned to the control code. The technology is applicable to a device communicating in an SLVS-EC specification.Type: GrantFiled: June 30, 2020Date of Patent: April 16, 2024Assignee: Sony Semiconductor Solutions CorporationInventors: Tatsuya Sugioka, Toshihisa Hyakudai, Masayuki Unuma, Daisuke Okazawa, Aritoshi Kimura, Hiroshi Shiroshita
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Patent number: 11954276Abstract: A touch panel including an oxide semiconductor film having conductivity is provided. The touch panel includes a transistor, a second insulating film, and a touch sensor. The transistor includes a gate electrode; a gate insulating film; a first oxide semiconductor film; a source electrode and a drain electrode; a first insulating film; and a second oxide semiconductor film. The second insulating film is over the second oxide semiconductor film so that the second oxide semiconductor film is positioned between the first insulating film and the second insulating film. The touch sensor includes a first electrode and a second electrode. One of the first and second electrodes includes the second oxide semiconductor film.Type: GrantFiled: May 11, 2021Date of Patent: April 9, 2024Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei Yamazaki, Hajime Kimura, Masami Jintyou, Yasuharu Hosaka, Naoto Goto, Takahiro Iguchi, Daisuke Kurosaki, Junichi Koezuka
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Publication number: 20240098962Abstract: A semiconductor device including a first electrode, a second electrode, an oxide semiconductor disposed between the first electrode and the second electrode, and a first oxide layer containing a predetermined element, oxygen, and an additional element and disposed between the first electrode and the oxide semiconductor, wherein the predetermined element is at least one of tantalum, boron, hafnium, silicon, zirconium, or niobium, and the additional element is at least one of phosphorus, sulfur, copper, zinc, gallium, germanium, arsenic, selenium, silver, indium, tin, antimony, tellurium, or bismuth.Type: ApplicationFiled: February 7, 2023Publication date: March 21, 2024Applicant: Kioxia CorporationInventors: Daisuke WATANABE, Akifumi GAWASE, Takeshi IWASAKI, Kazuhiro KATONO, Yusuke MUTO, Yusuke MIKI, Akinori KIMURA
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Patent number: 11920874Abstract: A heat exchange member includes: a honeycomb structure including: an outer peripheral wall; an inner peripheral wall; and partition walls arranged between the outer peripheral wall and the inner peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path for a first fluid; and a covering member for covering an outer peripheral surface of the outer peripheral wall. In a cross section of the honeycomb structure orthogonal to a flow path direction for the first fluid, the partition walls extend in a radial direction. Each of the cells is formed from the outer peripheral wall, the inner peripheral wall, and the partition walls.Type: GrantFiled: November 1, 2021Date of Patent: March 5, 2024Assignee: NGK INSULATORS, LTD.Inventors: Daisuke Kimura, Tatsuo Kawaguchi
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Publication number: 20240047590Abstract: A method of manufacturing a light-receiving element of the present disclosure includes forming a first contact layer at one surface of a substrate, forming a light receiving layer on the first contact layer, forming a second contact layer on the light receiving layer, removing a portion of each of the second contact layer, the light receiving layer, and the first contact layer and forming a first groove at which the first contact layer is exposed, filling the first groove with a resin, and after filling the first groove with the resin, removing the second contact layer and forming a second groove separating pixels.Type: ApplicationFiled: May 12, 2023Publication date: February 8, 2024Applicant: Sumitomo Electric Industries, Ltd.Inventor: Daisuke KIMURA
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Publication number: 20230362035Abstract: The present disclosure provides a frequency deviation estimation device for estimating a frequency deviation upon receiving a digitally modulated non-repetitive signal. The frequency deviation estimation device is equipped with an instantaneous frequency measurement module, a minimum frequency detection module, and a frequency deviation calculation module. The instantaneous frequency measurement module measures the instantaneous frequency of the received communication signal. The minimum frequency detection module detects the minimum frequency of the instantaneous frequency. The frequency deviation calculation module calculates the frequency deviation between the received communication signal and the reference signal for coarse adjustment using the reference minimum frequency and the minimum frequency when the frequency deviation is zero Hertz.Type: ApplicationFiled: July 13, 2023Publication date: November 9, 2023Applicant: FURUNO ELECTRIC CO., LTD.Inventors: Daisuke KIMURA, Yusuke TOYODA
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Publication number: 20230344464Abstract: A timing detection device includes a main reference code generation module, an auxiliary reference code generation module, a first correlation processing module, a second correlation processing module, and a subtraction module. The main reference code generation module generates a main reference code consisting of the same code for synchronization included in a received signal. Using a portion of the same code as the code for synchronization, the auxiliary reference code generation module generates an auxiliary reference code consisting of a code configuration different from the main reference code and without generating a main lobe during correlation processing. The first correlation processing module correlates the received signal with the main reference code and outputs a first correlation result. The second correlation processing module correlates the received signal with the auxiliary reference code and outputs a second correlation result.Type: ApplicationFiled: June 28, 2023Publication date: October 26, 2023Applicant: FURUNO ELECTRIC CO., LTD.Inventors: Daisuke KIMURA, Yusuke TOYODA
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Publication number: 20230343371Abstract: According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.Type: ApplicationFiled: July 5, 2023Publication date: October 26, 2023Applicant: KIOXIA CORPORATIONInventors: Masato SUGITA, Naoki KIMURA, Daisuke KIMURA
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Publication number: 20230336124Abstract: A demodulation device includes a phase rotation module, a phase adjustment module, a phase comparison module, and a reference signal generation module. The phase rotation module rotates phases of an I-Phase signal and a Q-Phase signal in a received signal of a multilevel PSK signal using a reference signal. The phase adjustment module adjusts the phases of the phase rotated I-Phase signal and the phase rotated Q-Phase signal output from the phase rotation module by multiplying the phases of the I-Phase signal and the Q-Phase signal with an integer value to generate a phase adjusted I-Phase signal and a phase adjusted Q-Phase signal. The phase comparison module compares the phase of the phase adjusted I-Phase signal with the phase of the phase adjusted Q-Phase signal to generate a phase comparison result. Also, the reference signal generation module generates a reference signal using the phase comparison result.Type: ApplicationFiled: June 21, 2023Publication date: October 19, 2023Applicant: FURUNO ELECTRIC CO., LTD.Inventor: Daisuke KIMURA
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Publication number: 20230298882Abstract: Provided is a method of manufacturing a Si—SiC-based composite structure capable of improving the manufacturing efficiency of the Si—SiC-based composite structure. The method of manufacturing a Si—SiC-based composite structure includes a step of impregnating a molten metal containing Si into a molded body containing SiC by heating a supply body containing Si under a state in which the supply body is in contact with the molded body, wherein a contact portion of the supply body with the molded body is a part of a surface of the supply body facing the molded body.Type: ApplicationFiled: February 8, 2023Publication date: September 21, 2023Applicants: NGK Insulators, Ltd., NGKADREC CompanyInventors: Sora GOTO, Shuhei KUNO, Daisuke KIMURA, Hiroomi MATSUBA
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Patent number: 11735230Abstract: According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.Type: GrantFiled: December 30, 2021Date of Patent: August 22, 2023Assignee: Kioxia CorporationInventors: Masato Sugita, Naoki Kimura, Daisuke Kimura
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Patent number: 11719489Abstract: A heat exchanger 100, including: an inner cylinder 10 through which a first fluid can flow, the inner cylinder 10 being configured to house a heat recovery member 30; and an outer cylinder 20 disposed so as to be spaced on a radially outer side of the inner cylinder 10 such that a second fluid can flow between the outer cylinder 20 and the inner cylinder 10. In the heat exchanger 100, at least a part of the outer cylinder 20 and/or the inner cylinder 10 has at least one continuous irregular structure 40.Type: GrantFiled: February 5, 2020Date of Patent: August 8, 2023Assignee: NGK INSULATORS, LTD.Inventors: Yutaro Fumoto, Tatsuo Kawaguchi, Daisuke Kimura
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Patent number: 11601074Abstract: An actuator capable of attaining high output. The actuator includes a frame structure part that forms a frame structure surrounding a housing part, and a volume change part housed in the housing part. The volume change part increases a volume thereof by input of external energy. The frame structure part has a higher Young's modulus than a Young's modulus of the volume change part. The housing part has an anisotropic shape, with a maximum width in first direction of the housing part longer than a maximum width in second direction different from the first direction of the housing part.Type: GrantFiled: March 24, 2021Date of Patent: March 7, 2023Assignees: DENSO CORPORATION, TOKYO INSTITUTE OF TECHNOLOGY, NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEMInventors: Daichi Sakurai, Seiichiro Washino, Shota Chatani, Haruhiko Watanabe, Masatoshi Shioya, Daisuke Kimura, Toshihira Irisawa, Kentaro Takagi, Takashi Hasegawa
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Patent number: 11591950Abstract: A heat exchanging member including a hollow pillar shaped honeycomb structure having partition walls defining cells, the cells penetrating from a first end face to a second end face to form flow paths for a first fluid, an inner peripheral wall, and an outer peripheral wall; and a covering member being configured to cover the outer peripheral wall of the pillar shaped honeycomb structure. The heat exchanging member is configured to perform heat exchange between the first fluid and a second fluid flowing through an outer side of the covering member. In the heat exchanging member, in a cross section of the pillar shaped honeycomb structure perpendicular to a flow path direction of the first fluid, the cells are radially provided, and each of the inner peripheral wall and the outer peripheral wall has a thickness larger than that of each of the partition walls.Type: GrantFiled: May 21, 2019Date of Patent: February 28, 2023Assignee: NGK Insulators, Ltd.Inventors: Tatsuo Kawaguchi, Takeshi Sakuma, Daisuke Kimura, Yutaro Fumoto
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Patent number: 11555661Abstract: A heat exchanging member includes: a pillar shape honeycomb structure having an outer peripheral wall and partition walls extending through the honeycomb structure from a first end face to a second end face to define a plurality of cells forming a through channel of a first fluid, and a covering member for covering the outer peripheral wall of the honeycomb structure. In a cross section of the honeycomb structure perpendicular to a flow direction of the first fluid, the partition walls includes: a plurality of first partition walls extending in a radial direction from the side of a center portion of the cross section; and a plurality of second partition walls extending in a circumferential direction, and a number of the first partition walls on the side of the central portion is less than a number of the first partition walls on the side of the outer peripheral wall.Type: GrantFiled: December 21, 2018Date of Patent: January 17, 2023Assignee: NGK Insulators, Ltd.Inventors: Tatsuo Kawaguchi, Daisuke Kimura
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Patent number: 11482046Abstract: [Problem] To provide an action-estimating device with which an action of a subject appearing in a plurality of time-series images can be precisely estimated. [Solution] In the action-estimating device 1, an estimating-side detecting unit 13 detects a plurality of articulations A appearing in each time-series image Y on the basis of a reference having been stored in an estimating-side identifier 11 and serving to identify the plurality of articulations A. An estimating-side measuring unit 14 measures the coordinates and the depths of the plurality of articulations A appearing in each of the time-series images Y. On the basis of displacement in the plurality of time-series images Y of the measured coordinate and depth of each of the articulations A, a specifying unit 15 specifies, from among the plurality of articulations A, an articulation group B which belongs to a given subject.Type: GrantFiled: April 9, 2019Date of Patent: October 25, 2022Assignee: ASILLA, INC.Inventor: Daisuke Kimura
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Publication number: 20220275740Abstract: A heat exchange member includes: a honeycomb structure including: an outer peripheral wall; and partition walls arranged on an inner side of the outer peripheral wall, the partition walls defining a plurality of cells each extending from a first end face to a second end face to form a flow path for a first fluid; and a covering member being configured to cover an outer peripheral surface of the outer peripheral wall. In a cross section of the honeycomb structure orthogonal to a flow path direction for the first fluid, the partition walls include first partition walls extending in a radial direction and second partition walls extending in a circumferential direction. A part of at least one of the outer peripheral wall and the second partition walls includes at least one slit 30.Type: ApplicationFiled: December 22, 2021Publication date: September 1, 2022Applicant: NGK INSULATORS, LTD.Inventors: Daisuke KIMURA, Tatsuo KAWAGUCHI
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Publication number: 20220252353Abstract: A heat exchange member includes: a honeycomb structure including: an outer peripheral wall; an inner peripheral wall; and partition walls arranged between the outer peripheral wall and the inner peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path for a first fluid; and a covering member for covering an outer peripheral surface of the outer peripheral wall. In a cross section of the honeycomb structure orthogonal to a flow path direction for the first fluid, the partition walls extend in a radial direction. Each of the cells is formed from the outer peripheral wall, the inner peripheral wall, and the partition walls.Type: ApplicationFiled: November 1, 2021Publication date: August 11, 2022Applicant: NGK INSULATORS, LTD.Inventors: Daisuke KIMURA, Tatsuo KAWAGUCHI
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Publication number: 20220170757Abstract: The present disclosure provides more appropriate information for vehicles. An information processing apparatus of the present disclosure receives pieces of probe data from a plurality of vehicles having traveled through a predetermined point, each of the pieces of probe data indicating a traveling environment at the point, and generates information for other vehicles to pass through the point, for each of attributes of vehicles, based on the pieces of probe data.Type: ApplicationFiled: November 26, 2021Publication date: June 2, 2022Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yasuhiro HAYASHI, Kazunori FUJIMORI, Takuji YAMADA, Naoya OKA, Daisuke KIMURA, Yumiko YAMASHITA
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Patent number: 11342287Abstract: A semiconductor device includes a substrate, a semiconductor chip, and a sealing member. The semiconductor chip is disposed on the substrate. The semiconductor chip includes a first principal surface on a side of the substrate and a second principal surface on a side opposite to the first principal surface. The sealing member seals the semiconductor chip. The sealing member includes a first sealing member and a second sealing member. The second sealing member faces at least a part of the second principal surface. A permittivity of the second sealing member is lower than a permittivity of the first sealing member.Type: GrantFiled: September 3, 2020Date of Patent: May 24, 2022Assignee: KIOXIA CORPORATIONInventor: Daisuke Kimura