Patents by Inventor Daisuke Muto

Daisuke Muto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11450450
    Abstract: An insulated wire comprising a conductor and a bubble-containing insulating layer, directly or indirectly coating the outer periphery of the conductor and containing a thermosetting resin, wherein the bubbles in the bubble-containing insulating layer include flattened bubbles whose oblateness in the cross-section perpendicular to the longitudinal direction of the insulated wire (lateral length of the bubble cross-sectional shape/vertical length of the bubble cross-sectional shape) is 1.5 or more and 5.0 or less.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 20, 2022
    Assignee: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
    Inventors: Natsuko Hara, Keisuke Ikeda, Daisuke Muto
  • Patent number: 11420997
    Abstract: The present invention has an object of shortening the process time and reducing use of a poor solvent for solidifying a carrier (Tag)-peptide component, by removing impurities without conducting solid-liquid separation (condensation, solid-liquid separation and drying operation) of a Tag-peptide component, in an Fmoc method using a Tag for liquid phase peptide synthesis.
    Type: Grant
    Filed: April 13, 2019
    Date of Patent: August 23, 2022
    Inventors: Hideaki Suzuki, Susumu Muto, Shuji Fujita, Daisuke Kubo
  • Publication number: 20220165451
    Abstract: Provided is an electrical conducting wire in which eddy current loss is effectively suppressed, mechanical strength is excellent, and electrical conductivity is also excellent while aluminum strands that are not coated with insulating resin are used as strands constituting a split conductor. An electrical conducting wire, including: a split conductor composed of multiple aluminum strands arranged in parallel to each other or multiple aluminum strands twisted into a helix, wherein each of the strands contains 0.01 to 0.4 mass % of Fe, 0.3 to 0.5 mass % of Cu, 0.04 to 0.3 mass % of Mg, 0.02 to 0.3 mass % of Si, and 0.001 to 0.01 mass % of Ti and V in total, with the balance being Al and inevitable impurities; and wherein each of the strands is not coated with an insulating resin.
    Type: Application
    Filed: February 10, 2022
    Publication date: May 26, 2022
    Applicant: Essex Furukawa Magnet Wire Japan Co., Ltd.
    Inventors: Keiichi TOMIZAWA, Akira TACHIBANA, Daisuke MUTO
  • Patent number: 11217364
    Abstract: An insulated wire containing a thermoplastic resin layer (A) as a covering layer directly or indirectly on a rectangular conductor, in which the insulated wire has at least one protruding part which is continuous in a longitudinal direction of said insulated wire, on a surface of a portion of the thermoplastic resin layer (A), which portion corresponds to at least one side of a cross-section of the insulated wire, said protruding part and a flat part of the surface having the protruding part forms a curved portion with a radius of curvature of 0.01 to 0.75 mm in the cross-section of the insulated wire, and a lateral face of the protruding part has a slope of less than 90° to the flat part of the surface having the protruding part in the cross-section of the insulated wire, a coil produced by processing the insulated wire by winding, and an electric/electronic equipment comprising the coil.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: January 4, 2022
    Assignee: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
    Inventors: Keiichi Tomizawa, Daisuke Muto, Satoshi Saito
  • Publication number: 20210343446
    Abstract: An insulated wire including: a conductor; and an insulating film provided on an outer periphery of the conductor, wherein the insulating film satisfies the following relation between a relative permittivity (?) of the insulating film at 0.2 atm and a relative permittivity (?0) of an outermost layer of the insulating film at 0.2 atm. ??3.0 and ?0/??1.2.
    Type: Application
    Filed: July 8, 2021
    Publication date: November 4, 2021
    Applicant: Essex Furukawa Magnet Wire Japan Co., Ltd.
    Inventors: Daisuke MUTO, Keiichi TOMIZAWA, Hideo FUKUDA
  • Patent number: 11145436
    Abstract: An assembled wire has a substantially rectangular cross section, and is formed by assembling a plurality of strands. Each strand has a conductor portion and a strand insulating layer covering the conductor portion. At least a part of the assembled plurality of strands in the longitudinal direction is covered with an outer insulating layer. The strand is formed as follows. First, the strand insulating layer is coated on the outer periphery of the conductor portion. A large number of voids are formed in a resin constituting the strand insulating layer. From this state, the strand is formed, for example, by collapsing the strand insulating layer by heating and pressurizing. At this time, it is possible to uniformly collapse the strand insulating layer by crushing the internal voids. Therefore, the voids in the strand are crushed and flattened in the thickness direction of the strand insulating layer over the entire periphery.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: October 12, 2021
    Assignee: ESSEX FURUKAWA MAGNET WIRE JAPAN COL, LTD.
    Inventors: Keisuke Ikeda, Keiichi Tomizawa, Daisuke Muto, Hideo Fukuda
  • Patent number: 11105016
    Abstract: A crystal growth apparatus, comprising a crucible, a heat-insulating material which covers a circumference of the crucible, and a heating member which is located on the outside of the heat-insulating material and is configured to perform induction heating of the crucible, wherein the heat-insulating material has a movable part, wherein the movable part forms an opening in the heat-insulating material by the movement of the movable part to control an opening ratio of the opening in the heat-insulating material.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: August 31, 2021
    Assignee: SHOWA DENKO K.K.
    Inventor: Daisuke Muto
  • Patent number: 10978219
    Abstract: Provided is an assembled wire 10 having a substantially rectangular cross section, and is formed by assembling a plurality of strands 7. Each strand 7 has a conductor portion 11 and a strand insulating layer 13 covering the conductor portion 11. The strand insulating layer 13 preferably contains at least one kind of resin in which 50% weight loss in Tg-DTA occurs at from 300° C. to 500° C. The strand insulating layer 13 contains particles. The particles are particles having volume resistivity of 1×106 ?·cm or more, and, for example, inorganic substances such as silica, titania, alumina, aluminum nitride, magnesium oxide, silicon nitride, and silicon carbide; and resins such as silicone are applicable.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: April 13, 2021
    Assignee: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
    Inventors: Keiichi Tomizawa, Akira Tachibana, Keisuke Ikeda, Daisuke Muto, Hideo Fukuda
  • Publication number: 20210012926
    Abstract: An insulated wire comprising a conductor and a bubble-containing insulating layer, directly or indirectly coating the outer periphery of the conductor and containing a thermosetting resin, wherein the bubbles in the bubble-containing insulating layer include flattened bubbles whose oblateness in the cross-section perpendicular to the longitudinal direction of the insulated wire (lateral length of the bubble cross-sectional shape/vertical length of the bubble cross-sectional shape) is 1.5 or more and 5.0 or less.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 14, 2021
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Natsuko HARA, Keisuke IKEDA, Daisuke MUTO
  • Publication number: 20210005346
    Abstract: An insulated wire containing a thermoplastic resin layer (A) as a covering layer directly or indirectly on a rectangular conductor, in which the insulated wire has at least one protruding part which is continuous in a longitudinal direction of said insulated wire, on a surface of a portion of the thermoplastic resin layer (A), which portion corresponds to at least one side of a cross-section of the insulated wire, said protruding part and a flat part of the surface having the protruding part forms a curved portion with a radius of curvature of 0.01 to 0.75 mm in the cross-section of the insulated wire, and a lateral face of the protruding part has a slope of less than 90° to the flat part of the surface having the protruding part in the cross-section of the insulated wire, a coil produced by processing the insulated wire by winding, and an electric/electronic equipment comprising the coil.
    Type: Application
    Filed: July 22, 2020
    Publication date: January 7, 2021
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Keiichi TOMIZAWA, Daisuke MUTO, Satoshi SAITO
  • Patent number: 10865500
    Abstract: A SiC epitaxial wafer having a SiC epitaxial layer formed on a SiC single crystal substrate having an offset angle of 4 degrees or less in a<11-20>direction from a (0001) plane. A trapezoidal defect included in the SiC epitaxial wafer includes an inverted trapezoidal defect in which a length of a lower base on a downstream side of a step flow is equal to or less than a length of an upper base on an upstream side of the step flow. Also disclosed is a method for manufacturing the SiC epitaxial wafer.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: December 15, 2020
    Assignee: SHOWA DENKO K.K.
    Inventors: Jun Norimatsu, Akira Miyasaka, Yoshiaki Kageshima, Koji Kamei, Daisuke Muto
  • Publication number: 20200365294
    Abstract: Provided is an assembled wire 10 having a substantially rectangular cross section, and is formed by assembling a plurality of strands 7. Each strand 7 has a conductor portion 11 and a strand insulating layer 13 covering the conductor portion 11. The strand insulating layer 13 preferably contains at least one kind of resin in which 50% weight loss in Tg-DTA occurs at from 300° C. to 500° C. The strand insulating layer 13 contains particles. The particles are particles having volume resistivity of 1×106 ?·cm or more, and, for example, inorganic substances such as silica, titania, alumina, aluminum nitride, magnesium oxide, silicon nitride, and silicon carbide; and resins such as silicone are applicable.
    Type: Application
    Filed: May 28, 2020
    Publication date: November 19, 2020
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Keiichi TOMIZAWA, Akira TACHIBANA, Keisuke IKEDA, Daisuke MUTO, Hideo FUKUDA
  • Patent number: 10774444
    Abstract: This method of producing a SiC epitaxial wafer having an epitaxial layer on a SiC single crystal substrate, and includes: when performing crystal growth of the epitaxial layer, a step of forming a part of an epitaxial layer under first conditions at an initial stage where the crystal growth is started; and a step of forming a part of a SiC epitaxial layer under second conditions in which a Cl/Si ratio is decreased and a C/Si ratio is increased in comparison to those in the first conditions, wherein the C/Si ratio is equal to or less than 0.6 and the Cl/Si ratio is equal to or more than 5.0 in the first conditions.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: September 15, 2020
    Assignee: SHOWA DENKO K.K.
    Inventors: Daisuke Muto, Akira Miyasaka
  • Publication number: 20200211734
    Abstract: Provided are an insulated wire material including: a conductor including a single core conductor or a plurality of divided conductors placed in parallel to each other or helically placed; a peripheral insulating layer with which a periphery of the conductor is coated; and a welding member provided at at least one end portion of the conductor and joined, via a welded portion welded to the single core conductor or divided conductors, to at least a peripheral surface of the welded portion, a manufacturing method thereof, a coil including the insulated wire material, and electrical/electronic equipment including the coil.
    Type: Application
    Filed: March 12, 2020
    Publication date: July 2, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Akira TACHIBANA, Daisuke MUTO, Hirofumi OSHIMA
  • Publication number: 20200126688
    Abstract: An assembled wire has a substantially rectangular cross section, and is formed by assembling a plurality of strands. Each strand has a conductor portion and a strand insulating layer covering the conductor portion. At least a part of the assembled plurality of strands in the longitudinal direction is covered with an outer insulating layer. The strand is formed as follows. First, the strand insulating layer is coated on the outer periphery of the conductor portion. At this time, a large number of voids are formed in a resin constituting the strand insulating layer. From this state, the strand is formed, for example, by collapsing the strand insulating layer by heating and pressurizing. At this time, it is possible to uniformly collapse the strand insulating layer by crushing the internal voids. Therefore, the voids in the strand are crushed and flattened in the thickness direction of the strand insulating layer over the entire periphery.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Inventors: Keisuke Ikeda, Keiichi Tomizawa, Daisuke Muto, Hideo Fukuda
  • Patent number: 10566109
    Abstract: An insulated wire, containing: a conductor having a rectangular cross-section; and an insulating coated film having at least two insulating layers laminated together on the conductor, wherein the laminated insulating coated film is composed of: an enamel insulating layer formed from a thermosetting resin on the outer periphery of the conductor, and an extruded insulating layer formed from a thermoplastic resin on the outer side of the enamel insulating layer, wherein the thickness of the enamel insulating layer is 50 ?m or more, and wherein the total thickness (T) and the relative permittivity (?) at 100° C. of the laminated insulating coated film; and the maximum thickness (Tmax), and the maximum value (?max) and the minimum value (?min) of the relative permittivity at 100° C. of one layer among the laminated insulating layers; satisfy all of the following relations: T?100 ?m??(1.1) Tmax?100 ?m??(1.2) 1.5???3.5??(2.1) 1.0??max/?min?1.2??(2.2) a coil; and an electrical or electronic equipment.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: February 18, 2020
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Daisuke Muto, Makoto Oya, Keiichi Tomizawa, Hideo Fukuda, Tsuneo Aoi
  • Publication number: 20200032414
    Abstract: A crystal growth apparatus, comprising a crucible, a heat-insulating material which covers a circumference of the crucible, and a heating member which is located on the outside of the heat-insulating material and is configured to perform induction heating of the crucible, wherein the heat-insulating material has a movable part, wherein the movable part forms an opening in the heat-insulating material by the movement of the movable part to control an opening ratio of the opening in the heat-insulating material.
    Type: Application
    Filed: July 23, 2019
    Publication date: January 30, 2020
    Applicant: SHOWA DENKO K.K.
    Inventor: Daisuke MUTO
  • Patent number: 10519566
    Abstract: Provided is a manufacturing device capable of effectively and sufficiently reducing an edge crown. The wafer support is used in a chemical vapor phase growth device in which an epitaxial film is grown on a main surface of a wafer using a chemical vapor deposition method, the wafer support including: a wafer mounting surface having an upper surface on which a substrate is mounted; and a wafer support portion that rises to surround a wafer to be mounted, in which a height from an apex of the wafer support portion to a main surface of the wafer mounted on the wafer mounting surface is 1 mm or more.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: December 31, 2019
    Assignee: SHOWA DENKO K.K.
    Inventors: Daisuke Muto, Jun Norimatsu
  • Patent number: 10483818
    Abstract: An insulated wire, having at least one thermosetting resin layer and at least one thermoplastic resin layer in this order, as covering layers, on a conductor having a quadrilateral cross-section, wherein, in a coating thickness of the covering layers, in each side to be formed on 4 sides of the quadrilateral cross-section of said insulated wire, a difference between the maximum value and the minimum value is each 20 ?m or less, and a value of the maximum value divided by the minimum value of the whole sides is 1.3 or more; a motor coil; and an electrical or electronic equipment.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: November 19, 2019
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Makoto Oya, Daisuke Muto, Dai Fujiwara
  • Patent number: 10418151
    Abstract: An inverter surge-resistant insulated wire comprising a conductor and an enamel resin-insulating laminate that has a foamed region including cells and a non-foamed region including no cells on at least one surface of the foamed region on the conductor, wherein the foamed region is configured such that a non-cell layer including no cells has cell layers formed of closed cells on both surface sides of the non-cell layer, a thickness of the non-cell layer is larger than a thickness of a partition wall among the closed cells, and 5 to 60% of a thickness of the foamed region, and at least 10 the cell layer in the foamed region is formed of a thermosetting resin; an inverter surge-resistant insulated wire having a conductor and the enamel resin-insulating laminate; and electric/electronic equipment.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: September 17, 2019
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Daisuke Muto, Makoto Oya, Keiichi Tomizawa