Abstract: A method for manufacturing a light-emitting module includes: providing a light-emitting element including a semiconductor layered body, a first electrode part, second electrode parts, and an insulating part disposed in areas between the first electrode part and the second electrode parts and at least one of areas between adjacent second electrode parts on the first surface, the insulating part protruding further away from the first surface than the first electrode part and the second electrode parts; providing an intermediate structure including a wiring substrate, a first conductive part, second conductive parts, and a holding part disposed in areas between the first conductive part and the second conductive parts and at least one of areas between adjacent second conductive parts on the second surface; disposing the light-emitting element on the intermediate structure; and forming the first bonding part and the second bonding part.

Abstract: A light-emitting module including a first wiring substrate, a second wiring substrate located on the first wiring substrate, a plurality of light-emitting elements located on the second wiring substrate, a wire connecting a first terminal of the first wiring substrate and a second terminal of the second wiring substrate, a first resin located on the first wiring substrate and on the second wiring substrate, and a protective member located on the first resin. The first resin covers the wire and surrounds the plurality of light-emitting elements when viewed in plan view. The protective member includes a light-transmitting member covering the first resin when viewed in plan view, and a light-shielding film located at a surface of the light-transmitting member. The light-shielding film covers the first resin when viewed in plan view.

Abstract: A light-emitting device includes: a substrate including a base material and a Cu wiring line disposed on an upper surface side of the base material; an insulating layer disposed on the substrate and having an opening on at least a part of an upper surface of the Cu wiring line; a Ti layer covering at least the upper surface of the Cu wiring line; a TiN layer disposed on the Ti layer; a TiW layer disposed on the TiN layer; a metal layer disposed on the TiW layer and containing at least one of Au, Pt, Ru, Pd, or Rh; a conductive member disposed on the metal layer and containing Au; and a light-emitting element including an electrode disposed on the conductive member.

Abstract: A light emitting device includes: a wiring substrate including: a substrate, and a first wiring and a second wiring disposed on the substrate; a light emitting element located above the wiring substrate and including a first electrode and a second electrode; a first conductive member connecting the first wiring and the first electrode; and a second conductive member connecting the second wiring and the second electrode. An outer lateral surface of the first conductive member protrudes outward from a straight line that connects an outer end of the first wiring and an outer end of the first electrode in a cross-sectional view.

Abstract: A method for manufacturing a light emitting module includes: providing an intermediate body including: a wiring substrate including a metal layer, a first conductive member, and a second conductive member; disposing a resist layer on the intermediate body; disposing a light-emitting element on the resist layer, the light-emitting element comprising: a first electrode, and a second electrode; forming on the metal layer: a first bonding member in contact with the first conductive member and the first electrode, and a second bonding member separated from the first conductive member and in contact with the second conductive member and the second electrode; and removing the resist layer.

Abstract: A method of manufacturing a light emitting device includes: providing a light emitting element including a p-side electrode and a n-side electrode on a same surface side; providing a substrate on which first and second wiring seed layers are formed; forming a resist pattern within an area on the substrate where the light emitting element is to be placed; placing the light emitting element on the resist pattern such that the p-side electrode and the first wiring seed layer are separated from and face each other, and the n-side electrode and the second wiring seed layer are separated from and face each other; joining the first wiring seed layer with the p-side electrode, and joining the second wiring seed layer with the n-side electrode, by plating using the resist pattern as a mask; and removing the resist pattern.

Abstract: An optical member includes a first light guide member having an elongated shape and comprising an end surface and a lateral surface extending in a longitudinal direction from the end surface; and a wavelength conversion layer disposed on the lateral surface of the first light guide member and containing a phosphor.

Abstract: A method for estimating a temperature of a light emitting module having a plurality of light emitting elements is provided. The method includes based on a lighting pattern of the light emitting module, which represents an intensity of light emitted from each of the plurality of light emitting elements, determining an amount of electric power to be supplied to the light emitting module for obtaining the lighting pattern and based on the lighting pattern and the determined amount of electric power, calculating estimated temperatures of the plurality of light emitting elements that are operated in accordance with the lighting pattern.

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

Abstract: A light emitting device includes: a base; a first terminal and a second terminal located at a surface of the base; a light emitting element array chip mounted on the base, the light emitting element array chip including: a support substrate, a plurality of first wirings and a plurality of second wirings disposed on the support substrate, and a plurality of light emitting elements, each of the light emitting elements arranged on the first wiring and the second wiring and electrically connected to the first wiring and the second wiring; and a plurality of wires including a first wire connecting the first wiring to the first terminal, and a second wire connecting the second wiring to the second terminal.

Abstract: An optical member includes a first light guide member having an elongated shape and comprising an end surface and a lateral surface extending in a longitudinal direction from the end surface; and a wavelength conversion layer disposed on the lateral surface of the first light guide member and containing a phosphor.

Abstract: A light-emitting module including a first wiring substrate, a second wiring substrate located on the first wiring substrate, a plurality of light-emitting elements located on the second wiring substrate, a wire connecting a first terminal of the first wiring substrate and a second terminal of the second wiring substrate, a first resin located on the first wiring substrate and on the second wiring substrate, and a protective member located on the first resin. The first resin covers the wire and surrounds the plurality of light-emitting elements when viewed in plan view. The protective member includes a light-transmitting member covering the first resin when viewed in plan view, and a light-shielding film located at a surface of the light-transmitting member. The light-shielding film covers the first resin when viewed in plan view.

Abstract: A method for estimating a temperature of a light emitting module having a plurality of light emitting elements is provided. The method includes, based on a lighting pattern of the light emitting module, which represents an intensity of light emitted from each of the light emitting elements, estimating respective temperatures of at least a part of the light emitting elements that are operated in accordance with the lighting pattern.

Abstract: A method for manufacturing a light emitting module includes: providing an intermediate body including: a wiring substrate including a metal layer, a first conductive member, and a second conductive member; disposing a resist layer on the intermediate body; disposing a light-emitting element on the resist layer, the light-emitting element comprising: a first electrode, and a second electrode; forming on the metal layer: a first bonding member in contact with the first conductive member and the first electrode, and a second bonding member separated from the first conductive member and in contact with the second conductive member and the second electrode; and removing the resist layer.

Abstract: A method of manufacturing a light emitting device includes: providing a light emitting element including a p-side electrode and a n-side electrode on a same surface side; providing a substrate on which first and second wiring seed layers are formed; forming a resist pattern within an area on the substrate where the light emitting element is to be placed; placing the light emitting element on the resist pattern such that the p-side electrode and the first wiring seed layer are separated from and face each other, and the n-side electrode and the second wiring seed layer are separated from and face each other; joining the first wiring seed layer with the p-side electrode, and joining the second wiring seed layer with the n-side electrode, by plating using the resist pattern as a mask; and removing the resist pattern.

Abstract: A light emitting device includes: a base; a first terminal and a second terminal located at a surface of the base; a light emitting element array chip mounted on the base, the light emitting element array chip including: a support substrate, a plurality of first wirings and a plurality of second wirings disposed on the support substrate, and a plurality of light emitting elements, each of the light emitting elements arranged on the first wiring and the second wiring and electrically connected to the first wiring and the second wiring; and a plurality of wires including a first wire connecting the first wiring to the first terminal, and a second wire connecting the second wiring to the second terminal.

Abstract: A method for manufacturing a light emitting device includes: providing a wafer that includes, successively from an upper face side, an electrode structure that includes multilayer wiring, a semiconductor layer electrically connected to the electrode structure, and a growth substrate; bonding the wafer to a support substrate; exposing the semiconductor layer by removing the growth substrate from the wafer; separating the semiconductor layer into a plurality of light emitting elements, which comprises forming grooves on a semiconductor layer side surface of the wafer; and forming a phosphor layer having protrusions and recesses at a surface thereof such that the phosphor layer covers surfaces of the light emitting elements, which comprises: forming a coating film on surfaces of the light emitting elements by applying a slurry comprising phosphor particles contained in a solvent, and vaporizing the solvent in the coating film to form the phosphor layer.

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

Abstract: A light emitting device includes: light emitting cells arranged in column and row directions, each including a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first insulation layer continuously disposed on the light emitting cells and having, in each light emitting cell, a first hole on the first semiconductor layer exposed from the second semiconductor layer and a second hole on the second semiconductor layer; a wiring electrode having light reflectivity, covering the first insulation layer, and electrically connected with the first semiconductor layer at the first hole in each light emitting cell; and a second electrode disposed in each light emitting cell and electrically connected with the second semiconductor layer at the second hole. The first insulation layer is exposed from the first semiconductor layer between the light emitting cells. The lower face of the first semiconductor layer has a roughened surface.