Patents by Inventor Daisuke Sawaki

Daisuke Sawaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080304153
    Abstract: An optical element, includes: a diffractive functional layer which diffracts at least part of incident light; and a grid formed on a first surface of the diffractive functional layer, the grid including a plurality of fine wires and having a polarization separation function; wherein the optical element reflects a part of the incident light while transmitting another part of the incident light, the first surface of the diffractive functional layer including a plurality of first regions; a plurality of second regions, a height thereof relative to a second surface of the diffractive functional layer being different from that of the first regions, the second surface being an opposite surface to the first surface; and a step provided at a border between the first regions and the second regions.
    Type: Application
    Filed: June 4, 2008
    Publication date: December 11, 2008
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Jun AMAKO, Daisuke SAWAKI
  • Publication number: 20080276676
    Abstract: A soil improvement material comprising a ground burned product A and gypsum, the burned product A having a hydraulic modulus (H.M.) of 1.8 to 2.3, a silica modulus (S.M.) of 1.3 to 2.3, and an iron modulus (I.M.) of 1.3 to 2.8. The soil improvement material is useful for improving the ground, especially through solidifying soft soil, such as water-rich soil or organic-rich soil.
    Type: Application
    Filed: October 4, 2004
    Publication date: November 13, 2008
    Applicant: TAIHEIYO CEMENT CORPORATION
    Inventors: Daisuke Sawaki, Susumu Sano, Kenichi Homma, Kouki Ichitsubo, Kenichi Matsumoto, Makihiko Ichikawa
  • Publication number: 20080274338
    Abstract: A method for manufacturing a wiring substrate includes the steps of: (a) forming a sacrificial layer in a first pattern on a substrate; (b) forming a catalyst layer in a second pattern on the substrate; (c) immersing the substrate in an electroless plating liquid, thereby depositing a metal layer on the catalyst layer in the second pattern; and (d) heating to remove the sacrificial layer and to form a metal layer in a third pattern, wherein the third pattern is a region where the first pattern and the second pattern overlap each other.
    Type: Application
    Filed: March 27, 2008
    Publication date: November 6, 2008
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Toshihiko KANEDA, Satoshi KIMURA, Hidemichi FURIHATA, Jun AMAKO, Daisuke SAWAKI, Takeshi KIJIMA
  • Publication number: 20080173471
    Abstract: An element substrate including a substrate and a metal layer formed on the substrate by electroless plating and including a linear portion having a width of 10 nm to 100 nm.
    Type: Application
    Filed: January 16, 2008
    Publication date: July 24, 2008
    Inventors: Toshihiko Kaneda, Satoshi Kimura, Hidemichi Furihata, Jun Amako, Daisuke Sawaki, Takeshi Kijima
  • Patent number: 7387739
    Abstract: A plurality of penetrating holes are formed in a substrate, each of the penetrating holes connecting a first opening and a second opening larger than the first opening. An etching resistant film is formed on a first surface of the substrate avoiding areas in which the first openings will be formed, part of the second surface in which the penetrating holes are formed being exposed so as to expose areas each of which includes two or more of the second openings. Small holes are formed in the formation regions for each of the penetrating holes. Etching having crystal orientation dependence is performed from both the first and second surfaces of the substrate.
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: June 17, 2008
    Assignee: Seiko Epson Corporation
    Inventors: Shinichi Yotsuya, Kazushige Umetsu, Daisuke Sawaki
  • Publication number: 20080081155
    Abstract: A method of manufacturing a plated substrate using electroless plating to form a metal layer, the method including: forming a resin section having a predetermined pattern on a substrate; forming a catalyst layer on the resin section; and depositing a metal on the catalyst layer by immersing the substrate in an electroless plating solution to form a metal layer.
    Type: Application
    Filed: October 2, 2007
    Publication date: April 3, 2008
    Inventors: Toshihiko Kaneda, Satoshi Kimura, Hidemichi Furihata, Jun Amako, Daisuke Sawaki, Takeshi Kijima
  • Patent number: 7339734
    Abstract: A manufacturing method of a polarization control element which is placed in a first medium and used and which is provided with a striped structure of a period shorter than a wavelength of light to be subject to control, the manufacturing method of a polarization control including: a first process which sets element conditions such as to meet a relationship Re[e1]>0, fRe[e1]+(1?f)Re[e2]<0, and Im[e2]>0, where a complex dielectric constant of the first medium is e1, a complex dielectric constant of a second medium constituting the striped structure is e2, a fill factor of the second medium is f(0<f<1), a real part of the complex number is Re, and an imaginary part is Im, and a second process selecting the second medium such as to meet the element conditions set in the first process and forming the striped structure.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: March 4, 2008
    Assignee: Seiko Epson Corporation
    Inventors: Jun Amako, Daisuke Sawaki
  • Patent number: 7267436
    Abstract: A mark (10A) is formed by focused laser beam inside a spectacle lens (L1). The mark is formed approximately parallel to an optical axis of the spectacle lens (L1). An optical reference position (L0) of a spectacle lens (L2) is aligned with a reference position (T) of marking apparatus (3) for alignment, and the spectacle lens (L2) is attached to a holder (11) of the marking apparatus (3). Then, positioning is carried out based on the optical reference position (L0) of the spectacle lens (L2). Subsequently, the spectacle lens (L2) is shifted to a marking start position for conducting marking. The optical reference position (L0) can be aligned with the reference position (T) of the marking apparatus (3) by adjusting the position of the spectacle lens (L2) based on a pair of concealed marks formed on the spectacle lens (L2).
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: September 11, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Ayumu Ito, Daisuke Sawaki
  • Publication number: 20070205187
    Abstract: A laser processing apparatus is provided including: a laser generator generating a light beam; a branching means for branching out the light beam to a plurality of beams arranged at equal intervals; a shifting means for shifting the plurality of beams at a pitch equal to a multiple of natural number of the arranged intervals relatively over a target; and a control means for controlling the intensity of the beam synchronously with the shifting pitch of the plurality of beams.
    Type: Application
    Filed: May 9, 2007
    Publication date: September 6, 2007
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Kazushige Sawaki, Daisuke SAWAKI
  • Publication number: 20070193477
    Abstract: A hydraulic composition including: a ground burned product A having a hydraulic modulus (H.M.) of 1.8 to 2.3, a silica modulus (S.M.) of 1.3 to 2.3 and an iron modulus (I.M.) of 1.3 to 2.8; and a gypsum. The hydraulic composition is capable of reducing heat of hydration and producing a mortar or a concrete excellent in flowability and strength development.
    Type: Application
    Filed: September 30, 2004
    Publication date: August 23, 2007
    Applicant: TAIHEIYO CEMENT CORPORATION
    Inventors: Daisuke Sawaki, Susumu Sano, Kenichi Homma, Kouki Ichitsubo, Kenichi Matsumoto, Makihiko Ichikawa
  • Patent number: 7240855
    Abstract: A liquid dispense head is provided which can be manufactured at a reduced manufacturing cost, will not react with dispense liquid containing biomolecules, and can dispense liquid droplets having a constant amount from individual nozzles. The liquid dispense head has reservoirs used as reservoirs for containing liquid, pressure chambers for applying a pressure to dispense the liquid, flow passages connecting the pressure chambers and the respective reservoirs. In the liquid dispense head described above, a part of the flow passage is formed of a minute through-hole provided in a glass substrate, and the inside diameter of the minute through-hole is continuously decreased or increased.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: July 10, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Fumio Takagi, Ryuichi Kurosawa, Daisuke Sawaki
  • Publication number: 20060249053
    Abstract: A burned product containing 100 parts by weight of C2S and 10 to 100 parts by weight in total of C3A and C4AF, a cement admixture obtained by grinding the burned product, and a cement containing 100 parts by weight of a ground Portland cement clinker and 5 to 100 parts by weight of the burned product. The cement is good in both initial strength and long-term strength.
    Type: Application
    Filed: March 3, 2003
    Publication date: November 9, 2006
    Applicant: TAIHEIYO CEMENT CORPORATION
    Inventors: Hideyuki Sugaya, Kenichi Honma, Makihiko Ichikawa, Daisuke Sawaki, Shuuichi Harasawa
  • Publication number: 20060185983
    Abstract: A method for manufacturing an optical element having a metal wire grid containing a plurality of metal wires on a substrate includes forming the metal wire grid using an electrolytic plating process.
    Type: Application
    Filed: February 14, 2006
    Publication date: August 24, 2006
    Inventors: Yoshitomo Kumai, Daisuke Sawaki
  • Publication number: 20060177571
    Abstract: A method for manufacturing an optical element having a metal wire grid containing a plurality of metal wires on a substrate includes forming the metal wire grid with an LSP (Liquid Self-patterning Process).
    Type: Application
    Filed: February 6, 2006
    Publication date: August 10, 2006
    Inventors: Yoshitomo Kumai, Daisuke Sawaki
  • Publication number: 20060146231
    Abstract: A manufacturing method of a polarization control element which is placed in a first medium and used and which is provided with a striped structure of a period shorter than a wavelength of light to be subject to control, the manufacturing method of a polarization control including: a first process which sets element conditions such as to meet a relationship Re[e1]>0, fRe[e1]+(1?f)Re[e2]<0, and Im[e2]>0, where a complex dielectric constant of the first medium is e1, a complex dielectric constant of a second medium constituting the striped structure is e2, a fill factor of the second medium is f(0<f<1), a real part of the complex number is Re, and an imaginary part is Im, and a second process selecting the second medium such as to meet the element conditions set in the first process and forming the striped structure.
    Type: Application
    Filed: November 14, 2005
    Publication date: July 6, 2006
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Jun Amako, Daisuke Sawaki
  • Patent number: 7070700
    Abstract: A method of laser processing for processing a laminated member where a metal thin film is protruded from an end portion of a silicon substrate at the bottom of the silicon substrate, wherein; a laser beam of which wavelength has the light absorption coefficient of the metal thin film being higher than the light absorption coefficient of the silicon substrate, is irradiated onto an boundary between an end of the silicon substrate and the metal thin film so as to cut the metal thin film.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: July 4, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Daisuke Sawaki, Masato Shimada, Kazushige Umetsu
  • Publication number: 20060046156
    Abstract: Aspects of the invention can provide a method for manufacturing a microstructure, including forming a photosensitive film above a work piece, exposing the photosensitive film, as a first exposure, by irradiating interference light generated by intersecting two laser beams having a wavelength shorter than a wavelength of visible light, developing the exposed photosensitive film so as to develop a shape corresponding to a pattern of the interference light to the photosensitive film, and etching the work piece using the developed photosensitive film as an etching mask.
    Type: Application
    Filed: June 16, 2005
    Publication date: March 2, 2006
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Jun Amako, Atsushi Takakuwa, Daisuke Sawaki
  • Patent number: 6997984
    Abstract: A burned product containing 100 parts by weight of C2S, 10 to 100 parts by weight of C2AS, and 20 parts by weight or less of C3A; a cement admixture prepared by grinding the burned product; and a cement containing 100 parts by weight of ground portland cement clinker and 5 to 100 parts by weight of a ground product of the burned product.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: February 14, 2006
    Assignee: Taiheiyo Cement Corporation
    Inventors: Daisuke Sawaki, Shuuichi Harasawa, Kenichi Honma, Makihiko Ichikawa
  • Publication number: 20050115465
    Abstract: A burned product containing 100 parts by weight of C2S, 10 to 100 parts by weight of C2AS, and 20 parts by weight or less of C3A; a cement admixture prepared by grinding the burned product; and a cement containing 100 parts by weight of ground portland cement clinker and 5 to 100 parts by weight of a ground product of the burned product. Through use of a cement admixture produced by grinding the burned product of the present invention, cement products exhibiting low heat of hydration and good fluidity can be obtained.
    Type: Application
    Filed: March 19, 2003
    Publication date: June 2, 2005
    Applicant: Taiheiyo Cement Corp.
    Inventors: Daisuke Sawaki, Shuuichi Harasawa, Kenichi Honma, Makihiko Ichikawa
  • Publication number: 20050115938
    Abstract: A laser processing apparatus is provided including: a laser generator generating a light beam; a branching means for branching out the light beam to a plurality of beams arranged at equal intervals; a shifting means for shifting the plurality of beams at a pitch equal to a multiple of natural number of the arranged intervals relatively over a target; and a control means for controlling the intensity of the beam synchronously with the shifting pitch of the plurality of beams.
    Type: Application
    Filed: November 9, 2004
    Publication date: June 2, 2005
    Inventors: Kazushige Sawaki, Daisuke Sawaki