Abstract: A mark (10A) is formed by focused laser beam inside a spectacle lens (L1). The mark is formed approximately parallel to an optical axis of the spectacle lens (L1). An optical reference position (L0) of a spectacle lens (L2) is aligned with a reference position (T) of marking apparatus (3) for alignment, and the spectacle lens (L2) is attached to a holder (11) of the marking apparatus (3). Then, positioning is carried out based on the optical reference position (L0) of the spectacle lens (L2). Subsequently, the spectacle lens (L2) is shifted to a marking start position for conducting marking. The optical reference position (L0) can be aligned with the reference position (T) of the marking apparatus (3) by adjusting the position of the spectacle lens (L2) based on a pair of concealed marks formed on the spectacle lens (L2).

Abstract: A liquid dispense head is provided which can be manufactured at a reduced manufacturing cost, will not react with dispense liquid containing biomolecules, and can dispense liquid droplets having a constant amount from individual nozzles. The liquid dispense head has reservoirs used as reservoirs for containing liquid, pressure chambers for applying a pressure to dispense the liquid, flow passages connecting the pressure chambers and the respective reservoirs. In the liquid dispense head described above, a part of the flow passage is formed of a minute through-hole provided in a glass substrate, and the inside diameter of the minute through-hole is continuously decreased or increased.

Abstract: A method of laser processing for processing a laminated member where a metal thin film is protruded from an end portion of a silicon substrate at the bottom of the silicon substrate, wherein; a laser beam of which wavelength has the light absorption coefficient of the metal thin film being higher than the light absorption coefficient of the silicon substrate, is irradiated onto an boundary between an end of the silicon substrate and the metal thin film so as to cut the metal thin film.

Abstract: A plurality of penetrating holes are formed in a substrate, each of the penetrating holes connecting a first opening and a second opening larger than the first opening. An etching resistant film is formed on a first surface of the substrate avoiding areas in which the first openings will be formed, part of the second surface in which the penetrating holes are formed being exposed so as to expose areas each of which includes two or more of the second openings. Small holes are formed in the formation regions for each of the penetrating holes. Etching having crystal orientation dependence is performed from both the first and second surfaces of the substrate.