Abstract: A light emitting diode (LED) structure has semiconductor layers, including a p-type layer, an active layer, and an n-type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface though which light is emitted. A copper layer has a first portion electrically connected to and opposing the bottom surface of the p-type layer. A dielectric wall extends through the copper layer to isolate a second portion of the copper layer from the first portion. A metal shunt electrically connects the second portion of the copper layer to the top surface of the n-type layer. P-metal electrodes electrically connect to the first portion, and n-metal electrodes electrically connect to the second portion, wherein the LED structure forms a flip chip. Other embodiments of the methods and structures are also described.

Abstract: A light emitting diode (LED) structure has semiconductor layers, including a p-type layer, an active layer, and an n-type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface through which light is emitted. Portions of the p-type layer and active layer are etched away to expose the n-type layer. The surface of the LED is patterned with a photoresist, and copper is plated over the exposed surfaces to form p and n electrodes electrically contacting their respective semiconductor layers. There is a gap between the n and p electrodes. To provide mechanical support of the semiconductor layers between the gap, a dielectric layer is formed in the gap followed by filling the gap with a metal. The metal is patterned to form stud bumps that substantially cover the bottom surface of the LED die, but do not short the electrodes. The substantially uniform coverage supports the semiconductor layer during subsequent process steps.

Abstract: A gouging box for safely removing debris and exhaust from the site of arc gouging work. The gouging box is a rigid open-bottomed frame having at least one access opening for insertion of a user's arm, a transparent viewing window, air inlet means, and an exhaust port. Fire retardant materials may cover the arm openings, and extend below the lower edges of the frame. A slag containment and air filtration unit may be added to the exhaust port to collect slag and reduce smoke in the work area.

Abstract: The invention relates to a common carrier munition ammunition device, more particularly to common carrier payload delivery shell. There is provided a common carrier munition comprising a tail unit, a main body which comprises a payload cavity for receiving a payload, a fuze, and located between said main body and the fuze an ogive element, wherein the tail unit and main body comprise cooperatively engaging male and female threaded portions, wherein at least one of the threads is a shearable thread.

Abstract: Pulse controlled linear actuator comprising a working cylinder (9) for receiving a medium introduced through a valve system by a compressor/pump, a piston, the shank (13) of which represents the output of the actuator. It also comprises a central solenoid (1) and alternately moved iron cores (3). The central solenoid (1) and the iron cores (3) are arranged between upper and lower solenoids (2). The iron cores (3) have two separate medium spaces (14, 15). The first medium space (14) leads into the portion of the working cylinder (9) above the piston (10) and under the piston (10). The second medium space (15) is separated from the space between the iron cores (3) by the iron cores (3) and leads into the portion of the working cylinder (9) above the piston (10) and under the piston (10). The valves (4, 8) are counter-phase or phase pulse controlled.

Abstract: The present disclosure includes various assemblies to be used with one or more energy storage devices. In one embodiment, an energy storage device assembly can include a plurality of energy storage devices, and each of these energy storage devices can include a first projecting electrode and a second projecting electrode. The energy storage devices can be connected to each other through a weld, which can directly bond the adjacent first and second projecting electrodes of adjacent energy storage devices to one another. This configuration can allow each of the energy storage devices to be connected together in series.

Abstract: A light emitting diode (LED) structure has semiconductor layers, including a p-type layer, an active layer, and an n-type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface though which light is emitted. A copper layer has a first portion electrically connected to and opposing the bottom surface of the p-type layer. A dielectric wall extends through the copper layer to isolate a second portion of the copper layer from the first portion. A metal shunt electrically connects the second portion of the copper layer to the top surface of the n-type layer. P-metal electrodes electrically connect to the first portion, and n-metal electrodes electrically connect to the second portion, wherein the LED structure forms a flip chip. Other embodiments of the methods and structures are also described.

Abstract: A light emitting diode (LED) structure has semiconductor layers, including a p-type layer, an active layer, and an n-type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface through which light is emitted. Portions of the p-type layer and active layer are etched away to expose the n-type layer. The surface of the LED is patterned with a photoresist, and copper is plated over the exposed surfaces to form p and n electrodes electrically contacting their respective semiconductor layers. There is a gap between the n and p electrodes. To provide mechanical support of the semiconductor layers between the gap, a dielectric layer is formed in the gap followed by filling the gap with a metal. The metal is patterned to form stud bumps that substantially cover the bottom surface of the LED die, but do not short the electrodes. The substantially uniform coverage supports the semiconductor layer during subsequent process steps.

Abstract: A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate.

Abstract: Multi-player board games are described that include a playing board that comprises a collection of playing spaces and home spaces, groups of stackable tokens, and playing dice, Also described are methods of playing the games in which players roll the dice to determine how many spaces they may move their respective token(s). Players strategically stack or split their tokens and try to return to their home space in order to collect tokens from other players. The winner is determined by which player has the greatest number of tokens.

Abstract: A beverage or food additive for improving an individual's mental and physiological performance, the dietary composition comprising medium chain triglycerides oil, Ginko Biloba, Panax Ginseng, phosphatidylserine, Bacopa Monnieri, and Polygala Tenuifolia. In addition, the dietary composition may optionally contain docosahexaenoic acid (DHA), eicosapentaenoic acid (EPA), and/or epigallocatechin gallate (EGCG).

Abstract: A generic transaction generator framework for testing a network-based production service may work in conjunction with a product-specific transaction creator module that executes transactions on the service. The transaction creator module may include runtime-discoverable information to communicate product specific details to the framework. Runtime-discoverable information may identify initialization methods, terminate methods, transaction types, transaction methods, transaction dependencies as well as testing parameters, such as transaction rate, testing period and a desired distribution of transaction types. The framework may generate and execute various test transactions and collect performance metrics regarding how well the service performed the test transactions.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to evaluate advertising campaigns. An example method disclosed herein includes identifying, by executing an instruction with a processor, a lift value and a qualification score associated respective first and second advertising campaigns, the qualification score to indicate a capability of a target audience to act on a message in the respective advertising campaign. For each of the first and second advertising campaigns a first and second coordinate value based on respective ones of the lift value and the qualification score. Calculating (a) a coordinate value for an apex score indicative of a maximum normalized qualification score and a maximum normalized lift score, (b) a first coordinate distance value between the apex score and the first coordinate value, and (c) a second coordinate distance value between the apex score and the second coordinate value.

Abstract: Provided are methods for detecting a target molecule or particle suspected to be present in a sample, comprising (a) contacting the sample with (i) a fusion molecule comprising a ligand capable of binding to the target molecule or particle and a binding domain, and (ii) a polymer scaffold comprising at least one binding motif to which the binding domain is capable of binding, under conditions that allow the target molecule or particle to bind to the ligand and the binding domain to bind to the binding motif; (b) loading the polymer into a device comprising a pore that separates an interior space of the device into two volumes, and configuring the device to pass the polymer through the pore from one volume to the other volume, wherein the device further comprises a sensor adjacent to the pore configured to identify objects passing through the pore; and (c) determining, with the sensor, whether the fusion molecule or particle bound to the binding motif is bound to the target molecule or particle, thereby detect

Abstract: Provided are methods for detecting a target molecule or particle suspected to be present in a sample, comprising (a) contacting the sample with (i) a fusion molecule comprising a ligand capable of binding to the target molecule or particle and a binding domain, and (ii) a polymer scaffold comprising at least one binding motif to which the binding domain is capable of binding, under conditions that allow the target molecule or particle to bind to the ligand and the binding domain to bind to the binding motif; (b) loading the polymer into a device comprising a pore comprising an opening in a structure that separates an interior space of the device into two volumes, and configuring the device to pass the polymer through the pore from one volume to the other volume, wherein the device further comprises a sensor configured to identify objects passing through the pore; and (c) determining, with the sensor, whether the fusion molecule or particle bound to the binding motif is bound to the target molecule or particle

Abstract: A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate.

Abstract: Provided are methods and compositions for detecting a target molecule or particle suspected to be present in a sample using a polymer scaffold, a fusion molecule, and a pore.

Abstract: The invention relates to an illumination munition, particularly an illumination payload ejection device housed within a common carrier payload delivery shell, with a frangible safety link. There is provided an illumination munition comprising a shearable tail unit, a main body which comprises a payload cavity for receiving an illumination payload apparatus, a fuze, an ogive element located between said main body and the fuze, and an explosive train operably connected to said fuze, wherein the illumination payload apparatus comprises an illumination composition, a drogue parachute and a main parachute, wherein the main parachute is tethered by a payload tether to the payload apparatus, such that after deployment of said main parachute said payload apparatus descends under the control of said main parachute.

Abstract: The invention relates to a common carrier munition ammunition device, more particularly to common carrier payload delivery shell. There is provided a common carrier munition comprising a tail unit, a main body which comprises a payload cavity for receiving a payload, a fuze, and located between said main body and the fuze an ogive element, wherein the tail unit and main body comprise cooperatively engaging male and female threaded portions, wherein at least one of the threads is a shearable thread.

Abstract: A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate.