Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.

Abstract: The present invention is directed towards a method of retaining a substrate to a wafer chuck. The method features accelerating a portion of the substrate toward the wafer chuck, generating a velocity of travel of the substrate toward the wafer chuck, and reducing the velocity before the substrate reaches the wafer chuck. In this manner, the force of impact of the portion with the wafer chuck is greatly reduced, which is believed to reduce the probability that the structural integrity of the substrate, and layers on the substrate and/or the wafer chuck, are damaged.

Abstract: The present invention is directed towards a method of separating a mold, included in a template, from a layer disposed on a substrate, the method including, inter alia, applying a separation force to the template to separate the template from the layer; and facilitating localized deformation in the substrate to reduce the separation force required to achieve separation.

Abstract: The present invention is directed towards a chucking system, including, inter alia, a body having a surface with a pin extending therefrom having a throughway defined therein, and a land surrounding the protrusions defining a channel between the pin and the land. In a further embodiment, the body comprises a plurality of protrusions.

Abstract: The present invention features a system to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The system senses relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: The present invention features a method to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The method includes sensing relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.

Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.

Abstract: The present invention is directed toward a method for reducing pattern distortions in imprinting layers by reducing gas pockets present in a layer of viscous liquid deposited on a substrate. To that end, the method includes varying a transport of the gases disposed proximate to the viscous liquid. Specifically, the atmosphere proximate to the substrate wherein a pattern is to be recorded is saturated with gases that are either highly soluble, highly diffusive, or both with respect to the viscous liquid being deposited. Additionally, or in lieu of saturating the atmosphere, the pressure of the atmosphere may be reduced.

Abstract: The present invention is directed toward a method of controlling a turbulent flow of a fluid between a substrate and a template, and more specifically, controlling a turbulent flow of a fluid between droplets disposed on a substrate and a template. To that end, the method further comprises the ingression and egression of the fluid through a first and second aperture, and in a further embodiment, a plurality of apertures, to create such a turbulent flow of the fluid.

Abstract: The present invention is directed toward a system for introducing a flow of a fluid between a mold, disposed on a template, and a substrate, the system including, a fluid supply system; and a chuck body having a baffle and first and second apertures, the first and second apertures disposed between the baffle and the template, with the first and second apertures in fluid communication with the fluid supply system to produce a turbulent flow of the fluid between the mold and said substrate.

Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.

Abstract: Disclosed are a method, system and holder for transferring templates during imprint lithography processes. To that end, a method for handling a template, having a patterned mold thereon, in an imprint lithography system having a motion stage with a chucking device coupled thereto, includes providing the template into a template transfer holder. The template transfer holder includes a side coupled to the motion stage and support members extending from the side. The template is disposed within the template transfer holder so as to have the patterned mold facing the side and spaced-apart therefrom. Relative movement is created between the motion stage and an imprint head to place the template transfer holder and the imprint head in superimposition. The template is removed from the template transfer holder, and the template is suspended above the wafer chuck by the imprint head. In another embodiment, a system and a template holder are described that facilitates the method.

Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.

Abstract: The present invention is an edge grip aligner with buffering capabilities and a method for increasing the throughput of wafers through the device. According to one embodiment, the present invention has first and second buffer arms, and a chuck arm. A workpiece can be aligned while supported on the chuck arm. Once the workpiece is aligned, the chuck arm transfers the workpiece to the buffer arms so that a second workpiece can be aligned on the chuck arm. While the second workpiece is being aligned, an end effector can transfer the first workpiece away from the buffer arms and retrieve another workpiece to place upon the chuck arm.

Abstract: A system is disclosed for safeguarding fab operators and workpieces such as semiconductor wafers from harm as a result of collision between an operator and a transport assembly for the workpieces as the workpieces are transported between tools and storage nests within a tool bay.

Abstract: The present invention is an edge grip aligner with buffering capabilities and a method for increasing the throughput of wafers through the device. According to one embodiment, the present invention has first and second buffer arms, and a chuck arm. A workpiece can be aligned while supported on the chuck arm. Once the workpiece is aligned, the chuck arm transfers the workpiece to the buffer arms so that a second workpiece can be aligned on the chuck arm. While the second workpiece is being aligned, an end effector can transfer the first workpiece away from the buffer arms and retrieve another workpiece to place upon the chuck arm.

Abstract: The present invention is an edge grip aligner with buffering capabilities and a method for increasing the throughput of wafers through the device. According to one embodiment, the present invention has first and second buffer arms, and a chuck arm. A workpiece can be aligned while supported on the chuck arm. Once the workpiece is aligned, the chuck arm transfers the workpiece to the buffer arms so that a second workpiece can be aligned on the chuck arm. While the second workpiece is being aligned, an end effector can transfer the first workpiece away from the buffer arms and retrieve another workpiece to place upon the chuck arm.

Abstract: A modular sorter is disclosed in which modular sections maybe easily added and removed to add and remove load port assemblies as required by a particular wafer fabrication run. In one embodiment, a modular sorter according to the present invention include a two-wide modular section defining a minienvironment for the sorter, a wafer handling robot a pair of aligners and a centralized controller. The modular section of this embodiment includes a pair of side-by-side load port assemblies for receiving a container or open cassette and presenting the cassette to the minienvironment of the sorter for processing of the wafers therein. The present invention further includes a removable end panel. When it is desired to add additional modular sections to the sorter, the end panel is removed and replaced by a connector frame. The connector frame allows additional modular sections, including either one load port assembly or two load port assemblies, to be attached to the original modular section.

Abstract: A system is disclosed for safeguarding fab operators and workpieces such as semiconductor wafers from harm as a result of collision between an operator and a transport assembly for the workpieces as the workpieces are transported between tools and storage nests within a tool bay.