Patents by Inventor Daniel J. Buvid
Daniel J. Buvid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11498307Abstract: Disclosed aspects relate to a structure which includes shape memory materials having transition triggers to transition the shape memory materials between initial states and transitioned states. A first physical shape of the structure exists when the first shape memory material has the first initial state and the second shape memory material has the second initial state. A second physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second initial state. A third physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second transitioned state. The physical shapes of the structure are reversible in nature. In embodiments, the shape memory materials are bonded to a flexible substrate or are clad together.Type: GrantFiled: March 19, 2016Date of Patent: November 15, 2022Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski
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Patent number: 11298721Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.Type: GrantFiled: April 12, 2019Date of Patent: April 12, 2022Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski
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Patent number: 11092763Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.Type: GrantFiled: August 1, 2018Date of Patent: August 17, 2021Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 11016255Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.Type: GrantFiled: October 23, 2019Date of Patent: May 25, 2021Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 10833001Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.Type: GrantFiled: February 27, 2019Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 10758938Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.Type: GrantFiled: April 12, 2019Date of Patent: September 1, 2020Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski
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Patent number: 10727176Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.Type: GrantFiled: February 27, 2019Date of Patent: July 28, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 10613283Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.Type: GrantFiled: August 1, 2018Date of Patent: April 7, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20200057219Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.Type: ApplicationFiled: October 23, 2019Publication date: February 20, 2020Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20190232336Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.Type: ApplicationFiled: April 12, 2019Publication date: August 1, 2019Inventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski
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Publication number: 20190232335Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.Type: ApplicationFiled: April 12, 2019Publication date: August 1, 2019Inventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski
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Publication number: 20190198439Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.Type: ApplicationFiled: February 27, 2019Publication date: June 27, 2019Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20190198440Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.Type: ApplicationFiled: February 27, 2019Publication date: June 27, 2019Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20190178883Abstract: According to an embodiment, a method of producing (e.g., making) a membrane for detecting toxic shock syndrome toxins includes depositing a second antibody on a first zone of the membrane. The second antibody is reactive with an antibody complex to cause a first indication. The antibody complex includes a first antibody coupled to a TSST-1 antigen. The method also includes depositing a third antibody on a second zone of the membrane. The third antibody is reactive with a fourth antibody to cause a second indication.Type: ApplicationFiled: February 20, 2019Publication date: June 13, 2019Inventors: Daniel J. BUVID, Eric J. CAMPBELL, Sarah K. CZAPLEWSKI, Christopher W. STEFFEN
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Patent number: 10293372Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.Type: GrantFiled: September 18, 2015Date of Patent: May 21, 2019Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski
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Patent number: 10295354Abstract: A computing device detects that an ignition switch of the vehicle was activated, wherein the vehicle includes a navigation device. The computing device requests a destination from the navigation device. The computing device interlocking, an operation of the vehicle based on determining that the destination is not valid.Type: GrantFiled: March 20, 2017Date of Patent: May 21, 2019Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski
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Patent number: 10290572Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.Type: GrantFiled: November 21, 2017Date of Patent: May 14, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 10274440Abstract: A method includes generating a graphical display based on chemical analysis data. The method also includes receiving input selecting a graphical component of the graphical display. The graphical component corresponds to a chemical or elemental constituent represented in the chemical analysis data. The method also includes receiving a specimen identifier indicating a specimen that was analyzed to generate the chemical analysis data. The method further includes generating a search query based on the specimen identifier and based on a constituent identifier of the chemical or elemental constituent and performing a search based on the search query to identify potential sources of the chemical or elemental constituent.Type: GrantFiled: June 22, 2016Date of Patent: April 30, 2019Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski
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Patent number: 10267792Abstract: A device for detecting toxic shock syndrome toxins includes a pad and a membrane coupled to the pad. The pad includes first antibodies that include a first particular antibody and a second particular antibody. Each of the first antibodies are associated with toxic shock syndrome toxin one (TSST-1). The first particular antibody is configured to react with a TSST-1 antigen to form an antibody complex. The membrane includes a first zone that includes an immobilized second antibody configured to react with the antibody complex to cause a first indication. The membrane further includes a second zone that includes a third antibody configured to react with the second particular antibody to cause a second indication.Type: GrantFiled: September 9, 2016Date of Patent: April 23, 2019Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 10247560Abstract: A computing device detects that an ignition switch of the vehicle was activated, wherein the vehicle includes a navigation device. The computing device requests a destination from the navigation device. The computing device interlocking, an operation of the vehicle based on determining that the destination is not valid.Type: GrantFiled: May 14, 2018Date of Patent: April 2, 2019Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski