Abstract: An interposer structure including a dielectric base material, and a metal based interconnect structure extending through the dielectric base material from a first side of the dielectric base material to an opposing second side of the dielectric base material. At least one metal line of the metal based interconnect structure extends from the first side of the dielectric base material to the second side of the dielectric base material and has a first non-linear portion. A fluidic passage extends through the dielectric base material, wherein the fluidic passage has a second non-linear portion.

Abstract: A device for detecting toxic shock syndrome toxins includes a pad and a membrane coupled to the pad. The pad includes first antibodies that include a first particular antibody and a second particular antibody. Each of the first antibodies are associated with toxic shock syndrome toxin one (TSST-1). The first particular antibody is configured to react with a TSST-1 antigen to form an antibody complex. The membrane includes a first zone that includes an immobilized second antibody configured to react with the antibody complex to cause a first indication. The membrane further includes a second zone that includes a third antibody configured to react with the second particular antibody to cause a second indication.

Abstract: Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.

Abstract: Embodiments herein describe techniques for operating an omnidirectional treadmill, the techniques include receiving VR (virtual reality) topographical information comprising a VR environment, and displaying the VR environment to a user wearing a headset. VR topographical information includes information about VR elements in front of the user in the VR environment relative to a facing direction of the user in the VR environment. The method includes sending topographical signals to active elements in an omnidirectional treadmill based upon the VR topographical information where the omnidirectional treadmill permits the user to move along at least two perpendicular directions of motion on a surface of the omnidirectional treadmill. The techniques include activating the active elements, based upon the VR topographical signals, to physically simulate the VR elements in the VR topographical information on the surface by at least one of expanding or contracting the active elements.

Abstract: A shape memory article comprises a shape memory material that transitions to a first shape from a second shape when a temperature of the shape memory material exceeds a threshold temperature. A plurality of microcapsules is in thermal contact with the shape memory material. Each microcapsule in the plurality of microcapsules has a first compartment, a second compartment, and an isolating structure separating the first and second compartments. The isolating structure is rupturable in response to a stimulus. The first compartments each contain a first component, and the second compartments each contain a second component that reacts with the first component to produce heat.

Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.

Abstract: A cooling system cools one or more electrical components on a printed circuit board. A piece of bilayer tubing made of an electrically conductive outer layer and an insulating inner layer. The insulating inner layer separates an electrically conductive coolant fluid from the electrically conductive outer layer. A signal generator is configured to inject an electrical signal into the electrically conductive coolant fluid. A sensor circuit electrically connected to the conductive outer layer is configured to detect the signal in the electrically conductive outer layer.

Abstract: A method includes generating a graphical display based on chemical analysis data. The method also includes receiving input selecting a graphical component of the graphical display. The graphical component corresponds to a chemical or elemental constituent represented in the chemical analysis data. The method also includes receiving a specimen identifier indicating a specimen that was analyzed to generate the chemical analysis data. The method further includes generating a search query based on the specimen identifier and based on a constituent identifier of the chemical or elemental constituent and performing a search based on the search query to identify potential sources of the chemical or elemental constituent.

Abstract: Disclosed aspects relate to a structure which includes shape memory materials having transition triggers to transition the shape memory materials between initial states and transitioned states. A first physical shape of the structure exists when the first shape memory material has the first initial state and the second shape memory material has the second initial state. A second physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second initial state. A third physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second transitioned state. The physical shapes of the structure are reversible in nature. In embodiments, the shape memory materials are bonded to a flexible substrate or are clad together.

Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.

Abstract: Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.

Abstract: Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.

Abstract: A cooling system cools one or more electrical components on a printed circuit board. A piece of bilayer tubing made of an electrically conductive outer layer and an insulating inner layer. The insulating inner layer separates an electrically conductive coolant fluid from the electrically conductive outer layer. A signal generator is configured to inject an electrical signal into the electrically conductive coolant fluid. A sensor circuit electrically connected to the conductive outer layer is configured to detect the signal in the electrically conductive outer layer.

Abstract: Devices employing semiconductor die having hydrophobic coatings, and related cooling methods are disclosed. A device may include at least one semiconductor die electrically coupled to a substrate by electrical contact elements. During operation the semiconductor die and the electrical contact elements generate heat. By applying hydrophobic coatings to the semiconductor die and the electrical contact elements, a cooling fluid may be used to directly cool the semiconductor die and the electrical contact elements to maintain these components within temperature limits and free from electrical shorting and corrosion. In this manner, the semiconductor die and associated electrical contact elements may be cooled to avoid the creation of damaging localized hot spots and temperature-sensitive semiconductor performance issues.

Abstract: Devices employing semiconductor die having hydrophobic coatings, and related cooling methods are disclosed. A device may include at least one semiconductor die electrically coupled to a substrate by electrical contact elements. During operation the semiconductor die and the electrical contact elements generate heat. By applying hydrophobic coatings to the semiconductor die and the electrical contact elements, a cooling fluid may be used to directly cool the semiconductor die and the electrical contact elements to maintain these components within temperature limits and free from electrical shorting and corrosion. In this manner, the semiconductor die and associated electrical contact elements may be cooled to avoid the creation of damaging localized hot spots and temperature-sensitive semiconductor performance issues.

Abstract: Devices employing semiconductor die having hydrophobic coatings, and related cooling methods are disclosed. A device may include at least one semiconductor die electrically coupled to a substrate by electrical contact elements. During operation the semiconductor die and the electrical contact elements generate heat. By applying hydrophobic coatings to the semiconductor die and the electrical contact elements, a cooling fluid may be used to directly cool the semiconductor die and the electrical contact elements to maintain these components within temperature limits and free from electrical shorting and corrosion. In this manner, the semiconductor die and associated electrical contact elements may be cooled to avoid the creation of damaging localized hot spots and temperature-sensitive semiconductor performance issues.