Abstract: A computing device detects that an ignition switch of the vehicle was activated, wherein the vehicle includes a navigation device. The computing device requests a destination from the navigation device. The computing device interlocking, an operation of the vehicle based on determining that the destination is not valid.

Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure is removed, and the continuous seed metal layer remains. An interconnect metal layer is formed on the continuous seed layer, and an electrically insulating material layer is formed on the interconnect metal layer. An electrically conductive support material is formed to encapsulate a majority of the interconnect metal layer, wherein the ends of the interconnect metal layer are exposed through opposing surfaces of the electrically conductive support material to provide an interconnect extending through the electrically conductive support material.

Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.

Abstract: A shape memory article comprises a shape memory material that transitions to a first shape from a second shape when a temperature of the shape memory material exceeds a threshold temperature. A plurality of microcapsules is in thermal contact with the shape memory material. Each microcapsule in the plurality of microcapsules has a first compartment, a second compartment, and an isolating structure separating the first and second compartments. The isolating structure is rupturable in response to a stimulus. The first compartments each contain a first component, and the second compartments each contain a second component that reacts with the first component to produce heat.

Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.

Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.

Abstract: Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.

Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure is removed, and the continuous seed metal layer remains. An interconnect metal layer is formed on the continuous seed layer, and an electrically insulating material layer is formed on the interconnect metal layer. An electrically conductive support material is formed to encapsulate a majority of the interconnect metal layer, wherein the ends of the interconnect metal layer are exposed through opposing surfaces of the electrically conductive support material to provide an interconnect extending through the electrically conductive support material.

Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.

Abstract: Embodiments herein describe techniques for operating an omnidirectional treadmill, the techniques include receiving VR (virtual reality) topographical information comprising a VR environment, and displaying the VR environment to a user wearing a headset. VR topographical information includes information about VR elements in front of the user in the VR environment relative to a facing direction of the user in the VR environment. The method includes sending topographical signals to active elements in an omnidirectional treadmill based upon the VR topographical information where the omnidirectional treadmill permits the user to move along at least two perpendicular directions of motion on a surface of the omnidirectional treadmill. The techniques include activating the active elements, based upon the VR topographical signals, to physically simulate the VR elements in the VR topographical information on the surface by at least one of expanding or contracting the active elements.

Abstract: A computing device detects that an ignition switch of the vehicle was activated, wherein the vehicle includes a navigation device. The computing device requests a destination from the navigation device. The computing device interlocking, an operation of the vehicle based on determining that the destination is not valid.

Abstract: A computing device detects that an ignition switch of the vehicle was activated, wherein the vehicle includes a navigation device. The computing device requests a destination from the navigation device. The computing device interlocking, an operation of the vehicle based on determining that the destination is not valid.

Abstract: A computing device detects that an ignition switch of the vehicle was activated, wherein the vehicle includes a navigation device. The computing device requests a destination from the navigation device. The computing device interlocking, an operation of the vehicle based on determining that the destination is not valid.

Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure is removed, and the continuous seed metal layer remains. An interconnect metal layer is formed on the continuous seed layer, and an electrically insulating material layer is formed on the interconnect metal layer. An electrically conductive support material is formed to encapsulate a majority of the interconnect metal layer, wherein the ends of the interconnect metal layer are exposed through opposing surfaces of the electrically conductive support material to provide an interconnect extending through the electrically conductive support material.

Abstract: A computing device detects that an ignition switch of the vehicle was activated, wherein the vehicle includes a navigation device. The computing device requests a destination from the navigation device. The computing device interlocking, an operation of the vehicle based on determining that the destination is not valid.

Abstract: A method and apparatuses protecting a portable device from an impact are provided. An accelerometer is operable to detect acceleration of the portable device. A protective structure disposed outside of the portable device includes a substrate and an elastomeric layer arranged on the substrate. The elastomeric layer defines an inflatable region in which the elastomeric layer is not attached to the substrate. The substrate includes a fluid channel in fluid communication with a pressurized fluid source. A controller is operable to trigger the pressurized fluid source upon detection of an acceleration event, wherein the pressurized fluid source transmits pressurized fluid to the inflatable region, causing the inflatable regions to inflate. The inflatable regions provide a cushion against impacts with surfaces when the portable device is dropped or otherwise propelled toward a surface.

Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.

Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure is removed, and the continuous seed metal layer remains. An interconnect metal layer is formed on the continuous seed layer, and an electrically insulating material layer is formed on the interconnect metal layer. An electrically conductive support material is formed to encapsulate a majority of the interconnect metal layer, wherein the ends of the interconnect metal layer are exposed through opposing surfaces of the electrically conductive support material to provide an interconnect extending through the electrically conductive support material.

Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.

Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.