Abstract: A radiometer system includes a housing and an RF board contained within the housing. Balanced radiometer channels receive an unknown signal and known reference. Each balanced radiometer channel includes at least one quadrature hybrid and amplifier circuit to provide distributed gain and an amplified output signal. A detection circuit receives and detects the amplified output signal forming a detected signal. A controller board is contained within the housing and has an integration circuit and microcontroller that receives the detected signal and performs video signal digitization and conditioning and real-time corrections on any radiometer channels to account for changes in temperature or gain.

Abstract: A radiometer system includes a housing and an RF board contained within the housing. Balanced radiometer channels receive an unknown signal and known reference. Each balanced radiometer channel includes at least one quadrature hybrid and amplifier circuit to provide distributed gain and an amplified output signal. A detection circuit receives and detects the amplified output signal forming a detected signal. A controller board is contained within the housing and has an integration circuit and microcontroller that receives the detected signal and performs video signal digitization and conditioning and real-time corrections on any radiometer channels to account for changes in temperature or gain.

Abstract: The present invention is directed to indoor/outdoor wireless communication systems and methods. Communications between an indoor unit and outdoor unit do not require telemetry tones. The input DC voltage level from the indoor unit is reduced to a level below the normal operating range for the outdoor unit. This is recognized by the outdoor unit as a signal to start receiving telemetry data, which is sent from the indoor unit to the outdoor unit by modulating the transmit signal.

Abstract: A radiometer includes a housing and an RF board carried by the housing. A hybrid and amplifier circuit receives an unknown signal and a known reference signal. A switch receives signals as inputs from the hybrid and amplifier circuit and switches between the inputs. A detection circuit receives and detects the signal from the switch forming a detected signal. A controller board is carried by the housing and an integration circuit and processor receive the detected signal and produces a digital output.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A highly integrated radiometer sensor cell includes a base having opposing surfaces with one surface adapted for surface mounting on a board. A radio frequency (RF) feed receives RF signals and at least one MMIC is operatively connected to the RF feed and receives the RF signals from the RF feed. This MMIC can include at least one quadrature hybrid, a low noise amplifier (LNA) connected thereto, and a detector circuit for producing a detected signal for further radiometer processing.

Abstract: A radiometer includes a housing and an RF board carried by the housing. A hybrid and amplifier circuit receives an unknown signal and a known reference signal. A switch receives signals as inputs from the hybrid and amplifier circuit and switches between the inputs. A detection circuit receives and detects the signal from the switch forming a detected signal. A controller board is carried by the housing and an integration circuit and processor receive the detected signal and produces a digital output.

Abstract: A very small aperture terminal (VSAT) transceiver of a VSAT terminal has a ceramic substrate board with transmitter, receiver and local oscillator circuits, including microwave monolithic integrated circuit (MMIC) chips positioned on the ceramic substrate board. A microcontroller is operative with the MMIC chips and an indoor unit of the VSAT terminal for controlling transceiver gain and output power. The microcontroller monitors one or both of the received signal strength of a signal received from a satellite in communication therewith and the signal-to-noise information from the indoor unit. The transceiver gain and output power is controlled by the microcontroller based on the received signal strength and/or the signal-to-noise information from the indoor unit.

Abstract: A lightweight millimeter wave outdoor unit includes a lightweight housing with a heat sink and mounting member configured for mounting on the antenna to form a wireless link. A millimeter wave transceiver board is formed of ceramic material and mounted within the housing. It includes a millimeter wave transceiver circuit that has microwave monolithic integrated circuit (MMIC) chips and operable with the transmit and receive boards. An intermediate frequency (IF) board has components forming an intermediate frequency circuit operable with the millimeter wave transceiver circuit. A frequency synthesizer board has a signal generating circuit for generating local oscillator signals to the transceiver circuit. A controller board has surface mounted DC and low frequency discrete devices thereon forming power and control circuits that supply respective power and control signals to other circuits on other boards.

Abstract: A receiver is operable at microwave frequencies and includes a substrate and waveguide-to-microstrip transition formed on the substrate for receiving microwave radio frequency (RF) signals. Surface mounted receiver components are interconnected with microstrip formed on the substrate and receive the RF signals from the waveguide-to-microstrip transition and convert the signal to an intermediate frequency (IF) for further processing. The surface mounted receiver components include a mixer circuit that receives a local oscillator (LO) signal and RF signal to produce the IF signal. A diplexer circuit and a temperature compensated attenuator circuit received the IF signal from the mixer and attenuates the IF signal to provide high signal linearity and high order modulation.

Abstract: A radiometer system includes a housing and an RF board contained within the housing. Balanced radiometer channels receive an unknown signal and known reference. Each balanced radiometer channel includes at least one quadrature hybrid and amplifier circuit to provide distributed gain and an amplified output signal. A detection circuit receives and detects the amplified output signal forming a detected signal. A controller board is contained within the housing and has an integration circuit and microcontroller that receives the detected signal and performs video signal digitization and conditioning and real-time corrections on any radiometer channels to account for changes in temperature or gain.

Abstract: A millimeter wave pulsed radar system includes a radar synthesizer having a voltage controlled oscillator/phase locked loop (VCO/PLL) circuit, direct digital synthesizer (DDS) circuit and quadrature modulator circuit that are operative to generate an intermediate frequency local oscillator signal (IF/LO signal). A radar transceiver is operative with the radar synthesizer for receiving the IF/LO signal. A transmitter section has a frequency multiplier that multiplies the IF/LO signal up to a millimeter wave (MMW) radar signal and a receiver section and includes a direct conversion mixer that receives a MMW radar signal and the IF/LO signal to produce I/Q baseband signals that are later digitized and processed.

Abstract: A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC chip package, and a local oscillator (LO) multiplier MMIC chip package. Each MMIC chip package includes a base and a multilayer substrate board formed from layers of low temperature transfer tape. The multilayer substrate board has at least three layers and carries RF signals, DC signals, grounding and embedded passive components, including resistors and capacitors. At least one MMIC chip is received on the multilayer substrate board.

Abstract: A microstrip-to-waveguide power combiner includes a dielectric substrate and at least two microstrip transmission lines formed thereon in which radio frequency signals are transmitted. The microstrip transmission lines terminate in microstrip launchers or probes at a microstrip-to-waveguide transition. A waveguide opening is positioned at the transition. A waveguide back-short is positioned opposite the waveguide opening at the transition. Isolation vias are formed within the dielectric substrate and around the transition and isolate the transition. A coaxial-to-waveguide power combiner is also disclosed.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Abstract: A phase locked loop (PLL) frequency synthesizer generates a high frequency signal by generating an output signal from a voltage controlled oscillator of a primary phase locked loop (PLL) circuit. The voltage controlled oscillator output is programmably divided with a reference signal output at a divide ratio such that the outputs are equal to a common phase comparison frequency. An external reference signal used for the primary phase locked loop circuit is isolated by generating a voltage controlled, clean reference signal and filtering and synchronizing the clean reference signal with the external reference signal within a secondary phase locked loop circuit to produce the reference signal output to the primary phase locked loop circuit.

Abstract: A phase locked loop (PLL) frequency synthesizer generates a high frequency signal by generating an output signal from a voltage controlled oscillator of a primary phase locked loop (PLL) circuit. The voltage controlled oscillator output is programmably divided with a reference signal output at a divide ratio such that the outputs are equal to a common phase comparison frequency. An external reference signal used for the primary phase locked loop circuit is isolated by generating a voltage controlled, clean reference signal and filtering and synchronizing the clean reference signal with the external reference signal within a secondary phase locked loop circuit to produce the reference signal output to the primary phase locked loop circuit.

Abstract: A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Abstract: A lightweight millimeter wave outdoor unit includes a lightweight housing with a heat sink and mounting member configured for mounting on the antenna to form a wireless link. A millimeter wave transceiver board is formed of ceramic material and mounted within the housing. It includes a millimeter wave transceiver circuit that has microwave monolithic integrated circuit (MMIC) chips and operable with the transmit and receive boards. An intermediate frequency (IF) board has components forming an intermediate frequency circuit operable with the millimeter wave transceiver circuit. A frequency synthesizer board has a signal generating circuit for generating local oscillator signals to the transceiver circuit. A controller board has surface mounted DC and low frequency discrete devices thereon forming power and control circuits that supply respective power and control signals to other circuits on other boards.

Abstract: A very small aperture terminal (VSAT) transceiver of a VSAT terminal has a ceramic substrate board with transmitter, receiver and local oscillator circuits, including microwave monolithic integrated circuit (MMIC) chips positioned on the ceramic substrate board. A microcontroller is operative with the MMIC chips and an indoor unit of the VSAT terminal for controlling transceiver gain and output power. The microcontroller monitors one or both of the received signal strength of a signal received from a satellite in communication therewith and the signal-to-noise information from the indoor unit. The transceiver gain and output power is controlled by the microcontroller based on the received signal strength and/or the signal-to-noise information from the indoor unit.