Abstract: A high frequency signal source and method of generating a high frequency signal is disclosed. An output signal is generated from a dielectric resonator oscillator and mixed with an output signal from a voltage controlled oscillator having a predetermined tuning range and part of a phase locked loop circuit to sum the frequencies for creating a final output frequency. A portion of the final output frequency is coupled into the phase locked loop circuit that is phase locked to a reference signal from a crystal reference oscillator. The voltage controlled oscillator has a tuning range that is used to compensate for the dielectric resonator oscillator initial frequency error and drift over temperature and aging while the balance of the bandwidth is used to provide the tuning range on the local oscillator output.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A microstrip-to-waveguide power combiner includes a dielectric substrate and at least two microstrip transmission lines formed thereon in which radio frequency signals are transmitted. The microstrip transmission lines terminate in microstrip launchers or probes at a microstrip-to-waveguide transition. A waveguide opening is positioned at the transition. A waveguide back-short is positioned opposite the waveguide opening at the transition. Isolation vias are formed within the dielectric substrate and around the transition and isolate the transition. A coaxial-to-waveguide power combiner is also disclosed.

Abstract: A phase locked loop (PLL) frequency synthesizer generates a high frequency signal by generating an output signal from a voltage controlled oscillator of a primary phase locked loop (PLL) circuit. The voltage controlled oscillator output is programmably divided with a reference signal output at a divide ratio such that the outputs are equal to a common phase comparison frequency. An external reference signal used for the primary phase locked loop circuit is isolated by generating a voltage controlled, clean reference signal and filtering and synchronizing the clean reference signal with the external reference signal within a secondary phase locked loop circuit to produce the reference signal output to the primary phase locked loop circuit.

Abstract: A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Abstract: A high frequency signal source and method of generating a high frequency signal is disclosed. An output signal is generated from a dielectric resonator oscillator and mixed with an output signal from a voltage controlled oscillator having a predetermined tuning range and part of a phase locked loop circuit to sum the frequencies for creating a final output frequency. A portion of the final output frequency is coupled into the phase locked loop circuit that is phase locked to a reference signal from a crystal reference oscillator. The voltage controlled oscillator has a tuning range that is used to compensate for the dielectric resonator oscillator initial frequency error and drift over temperature and aging while the balance of the bandwidth is used to provide the tuning range on the local oscillator output.

Abstract: A microstrip-to-waveguide power combiner includes a dielectric substrate and at least two microstrip transmission lines formed thereon in which radio frequency signals are transmitted. The microstrip transmission lines terminate in microstrip launchers or probes at a microstrip-to-waveguide transition. A waveguide opening is positioned at the transition. A waveguide back-short is positioned opposite the waveguide opening at the transition. Isolation vias are formed within the dielectric substrate and around the transition and isolate the transition. A coaxial-to-waveguide power combiner is also disclosed.

Abstract: A receiver is operable at microwave frequencies and includes a substrate and waveguide-to-microstrip transition formed on the substrate for receiving microwave radio frequency (RF) signals. Surface mounted receiver components are interconnected with microstrip formed on the substrate and receive the RF signals from the waveguide-to-microstrip transition and convert the signal to an intermediate frequency (IF) for further processing. The surface mounted receiver components include a mixer circuit that receives a local oscillator (LO) signal and RF signal to produce the IF signal. A diplexer circuit and a temperature compensated attenuator circuit received the IF signal from the mixer and attenuates the IF signal to provide high signal linearity and high order modulation.

Abstract: A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC chip package, and a local oscillator (LO) multiplier MMIC chip package. Each MMIC chip package includes a base and a multilayer substrate board formed from layers of low temperature transfer tape. The multilayer substrate board has at least three layers and carries RF signals, DC signals, grounding and embedded passive components, including resistors and capacitors. At least one MMIC chip is received on the multilayer substrate board.

Abstract: A phase locked loop (PLL) frequency synthesizer generates a high frequency signal by generating an output signal from a voltage controlled oscillator of a primary phase locked loop (PLL) circuit. The voltage controlled oscillator output is programmably divided with a reference signal output at a divide ratio such that the outputs are equal to a common phase comparison frequency. An external reference signal used for the primary phase locked loop circuit is isolated by generating a voltage controlled, clean reference signal and filtering and synchronizing the clean reference signal with the external reference signal within a secondary phase locked loop circuit to produce the reference signal output to the primary phase locked loop circuit.

Abstract: A high frequency signal source and method of generating a high frequency signal is disclosed. An output signal is generated from a dielectric resonator oscillator and mixed with an output signal from a voltage controlled oscillator having a predetermined tuning range and part of a phase locked loop circuit to sum the frequencies for creating a final output frequency. A portion of the final output frequency is coupled into the phase locked loop circuit that is phase locked to a reference signal from a crystal reference oscillator. The voltage controlled oscillator has a tuning range that is used to compensate for the dielectric resonator oscillator initial frequency error and drift over temperature and aging while the balance of the bandwidth is used to provide the tuning range on the local oscillator output.

Abstract: A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Abstract: A microstrip-to-waveguide power combiner includes a dielectric substrate and at least two microstrip transmission lines formed thereon in which radio frequency signals are transmitted. The microstrip transmission lines terminate in microstrip launchers or probes at a microstrip-to-waveguide transition. A waveguide opening is positioned at the transition. A waveguide back-short is positioned opposite the waveguide opening at the transition. Isolation vias are formed within the dielectric substrate and around the transition and isolate the transition. A coaxial-to-waveguide power combiner is also disclosed.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Abstract: A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC chip package, and a local oscillator (LO) multiplier MMIC chip package. Each MMIC chip package includes a base and a multilayer substrate board formed from layers of low temperature transfer tape. The multilayer substrate board has at least three layers and carries RF signals, DC signals, grounding and embedded passive components, including resistors and capacitors. At least one MMIC chip is received on the multilayer substrate board.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.

Abstract: An aircraft guidance system uses radar imaging to verify airport and runway location and provide navigation updates. The system is applicable to flight operations in low visibility conditions.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.