Abstract: A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Abstract: A low cost millimeter wave (MMW) module for a microwave monolithic integrated circuit (MMIC) includes a carrier board formed of a dielectric material and having at least one MMIC die mounted thereon and at least one interface line, such as a 50 Ohm microstrip interface line. A base plate is formed of a material that has a higher unmatched coefficient of thermal expansion (CTE) than the carrier board and supports same. A housing is mounted over the carrier board and engages the base plate. The housing has at least one subminiature coaxial connector (SMA) interface mounted thereon. A flexible circuit interconnect, such as a fuzz button, connects the subminiature coaxial connector and MMIC die through the interface line. A thermal interface member is positioned between the carrier board and base plate to aid in heat transfer between the base plate and housing and the lower CTE carrier board.

Abstract: A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC chip package, and a local oscillator (LO) multiplier MMIC chip package. Each MMIC chip package includes a base and a multilayer substrate board formed from layers of low temperature transfer tape. The multilayer substrate board has at least three layers and carries RF signals, DC signals, grounding and embedded passive components, including resistors and capacitors. At least one MMIC chip is received on the multilayer substrate board.

Abstract: A millimeter wave filter for surface mount applications includes a dielectric base plate having opposing surfaces. A ground plane layer is formed on a surface of the dielectric base plate. At least one low temperature co-fired ceramic layer is positioned over the ground plane layer and defines an outer filter surface. A plurality of coupled line millimeter wavelength resonators are formed as stripline or microstrip and positioned on the outer filter surface. These resonators can be parallel coupled line filters, including hairpin resonators. Radio frequency terminal contacts are positioned on the surface of the dielectric base plate opposite the at least one low temperature co-fired ceramic layer. Conductive vias extend through the at least one low temperature co-fired ceramic layer, ground plane and dielectric base plate and interconnect the radio frequency terminal contacts and coupled line resonator.

Abstract: An aircraft guidance system uses radar imaging to verify airport and runway location and provide navigation updates. The system is applicable to flight operations in low visibility conditions.

Abstract: A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.

Abstract: An aircraft guidance system uses radar imaging to verify airport and runway location and provide navigation updates. The system is applicable to flight operations in low visibility conditions.

Abstract: The present invention is directed to providing an antenna system for transmitting and receiving signals in a manner which eliminates the extensive hardware, high cost and complexity of the transmitter, receiver or transceiver used in conventional systems. Exemplary embodiments are directed to an antenna system which uses electronic beam forming to mathematically synthesize the signals desired for object detection and tracking. Rather than using passive waveguide material having multiple antenna system ports that must be individually processed in separate transceiver channels, exemplary embodiments of the present invention are directed to an antenna system wherein the antenna ports are coupled to a beam forming network of the antenna system. The beam forming network includes a single port that can be coupled to a single transceiver channel.

Abstract: A radar based terrain and obstacle detection device for aircraft detects obstacles and terrain ahead of the aircraft. An alert is sounded if the obstacle or terrain is above a clearance plane positioned ahead of the aircraft.

Abstract: A method and apparatus for improving resolution of targets in a monopulse radar beam.