Abstract: A dynamic random access memory (DRAM) cell and associated array are disclosed. The DRAM cell (300) includes a storage capacitor (304) and a pass transistor (302). The pass transistor (302) includes a source region (322), drain region (320) and channel region (324). A top gate (318) is disposed over the channel region (324) and a bottom gate (310) is disposed below the channel region (324). The top gate (318) and bottom gate (310) are commonly driven to provide greater control of the pass transistor (302) operation, including an off state with reduced source-to-drain leakage. The DRAM array (400) includes memory cells (414) having pass transistors (500) with double-gate structures. Memory cells (414) within the same row are commonly coupled to a top word line and bottom word line. The resistance of the top and bottom word lines is reduced by a word line strap layer (600). The DRAM array (400) further includes a strapping area that is void of memory cells.

Abstract: A simultaneous bi-directional input/output (I/O) circuit (300) is disclosed. The I/O circuit (300) includes an output buffer (302) for driving a data bus line (306) high or low according to a data input signal (Din), and an input buffer (308) for sensing the voltage on the data bus line (306). The input buffer (308) drives a data output node (332) between logic levels by comparing the voltage on the data bus line (306) with a reference voltage (Vref1 or Vref2) that is determined by the data input signal (Din). To eliminate glitches at the data output node (332) caused by the reference voltages switching faster than the data bus line can be driven (306), a transition detector (314) is provided that generates a disable pulse when Din transitions between logic levels.

Abstract: A dynamic random access memory (DRAM) cell and associated array are disclosed. The DRAM cell (300) includes a storage capacitor (304) and a pass transistor (302). The pass transistor (302) includes a source region (322), drain region (320) and channel region (324). A top gate (318) is disposed over the channel region (324) and a bottom gate (310) is disposed below the channel region (324). The top gate (318) and bottom gate (310) are commonly driven to provide greater control of the pass transistor (302) operation, including an off state with reduced source-to-drain leakage. The DRAM array (400) includes memory cells (414) having pass transistors (500) with double-gate structures. Memory cells (414) within the same row are commonly coupled to a top word line and bottom word line. The resistance of the top and bottom word lines is reduced by a word line strap layer (600). The DRAM array (400) further includes a strapping area that is void of memory cells.

Abstract: A data output system (100) is disclosed. The data output system (100) includes a number of data output paths (102a-102h) which provide data output signals (DQ0-DQ7) to a data bus. An invert data path 104 provides an invert data signal (INVOUT) that indicates when the data output signals (DQ0-DQ7) have been inverted to reduce the number of transitions on the data bus. A voter circuit (106) determines when data output signal inversion occurs, and includes a local data comparator (132a-132h) associated with each data output path (102a-102h). Each data comparator (132a-132h) compares a current data output signal (D0-D7) with a next data output signal (DN0-DN7), and in response thereto, generates a differential on a pair of data compare lines (138 and 140). The differential on the data compare lines (138 and 140) is amplified by a differential amplifier (136) to generate the invert output signal (INVN) for the following data output cycle.

Abstract: A static random access memory (SRAM) (10) operating in synchronism with an external clock is disclosed. The synchronous SRAM (10) includes a transparent address circuit (14) for decoding an external address in the set-up time prior to the rising edge of the external clock. A timing and control circuit (18) generates a word line enable (WLE) signal in synchronism with the rising edge of the external clock. When active, WLE activates a word line driver (34), when inactive, WLE equalizes the bit lines. WLE is applied to a first delay circuit (60) to generate a sense signal (SA). SA activates a sense circuit (46) and deactivates the WLE signal. Consecutive pipelined accesses are achieved such that, as an address is decoded, the bit lines are equalizing and the data from the previous address are propagating through a data I/O path (16).

Abstract: A static random access memory (SRAM) (10) operating in synchronism with an external clock is disclosed. The synchronous SRAM (10) includes a transparent address circuit (14) for decoding an external address in the set-up time prior to the rising edge of the external clock. A timing and control circuit (18) generates a word line enable (WLE) signal in synchronism with the rising edge of the external clock. When active, WLE activates a word line driver (34), when inactive, WLE equalizes the bit lines. WLE is applied to a first delay circuit (60) to generate a sense signal (SA). SA activates a sense circuit (46) and deactivates the WLE signal. Consecutive pipelined accesses are achieved such that, as an address is decoded, the bit lines are equalizing and the data from the previous address are propagating through a data I/O path (16).

Abstract: A circuit for selecting a block spare in a semiconductor device is designed with a programmable circuit (14), storing an internal address and producing an address match signal AM and a block select signal BS in response to first (A) and second (B) address signals and the internal address. A global spare circuit (28) produces a global spare select signal (GSS), in response to the address match signal. A block spare circuit (34) produces a block spare select signal (BSS), in response to the global spare select signal and the block select signal.

Abstract: A circuit for selecting a block spare in a semiconductor device is designed with a programmable circuit (14), storing an internal address and producing an address match signal AM and a block select signal BS in response to first (A) and second (B) address signals and the internal address. A global spare circuit (28) produces a global spare select signal (GSS), in response to the address match signal. A block spare circuit (34) produces a block spare select signal (BSS), in response to the global spare select signal and the block select signal.

Abstract: The plate voltage for a Dynamic Random Access Memory storage cell array is provided by two amplifiers. The first amplifier operates at a relatively low power level and compensates for leakage in the storage cell array, the compensation initiated by a departure of the plate from a nominal value which exceeds a preselected amount. The second amplifier operates at a higher power level and provides compensation for transients in the plate voltage resulting from the charging and discharging of the storage cells. Because the transients occur when the storage cells are accessed, the second amplifier is enabled only when a group of storage cells is accessed. In addition to operating at a higher power level, the second amplifier is more sensitive and responds to smaller excursions from the nominal voltage. Both the first and the second amplifiers have separate driver circuits for responding to excursions above and for responding to excursions below the nominal voltage.