Abstract: An innovative method of manufacturing polishing pads using photo-curing polymers and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.

Abstract: A polishing pad is formed as a one-piece article having a region which is transparent and an adjacent region which is opaque. The article is formed by solidifying a flowable polymeric material which at least initially has a uniform composition. The flowable polymeric material is processed during a molding operation to provide the transparent region and the adjacent opaque region. Types of polymeric material suitable for making the polishing pad include a single thermoplastic material, a blend of thermoplastic materials, and a reactive thermosetting polymer.

Abstract: A polishing pad having a substantially uniform, continuously interconnected porous surface. The pad can be produced by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer. The sintering process is conducted in a mold at a pressure in excess of 100 psi (0.07 MPa). In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other.

Abstract: A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, polishing pad comprising a high modulus phase and a low modulus phase. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.

Abstract: A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like.

Abstract: An innovative method of manufacturing polishing pads using photocuring polymers and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.

Abstract: An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution free from particulate matter.

Abstract: A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, hydrophilic polishing pad capable of releasing particles during polishing. Such a pad design is very efficient in providing polishing particles over the entire polishing surface interface. Since the polishing pad produces polishing particles, the polishing fluid can comprise very low loadings of polishing particles, if any.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: This invention provides polishing pad tiles which, by virtue of their geometry and surface features, can be arranged to form mosaic pads having channels at the seams which facilitate the flow of polishing fluid during polishing of a workpiece.

Abstract: Polymer-based pads useful for polishing objects, particularly integrated circuits, having interconnected porosity which is uniform in all directions, and where the solid portion of said pad consists of a uniform continuously interconnected polymer material of greater than 50% of the gross volume of the article, are produced directly to final shape and dimension by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer and at a pressure in excess of 100 psi in a mold having the desired final pad dimensions. In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other. When pressure sintered at a temperature not to exceed the melting point of the lower melting powder, the increased stiffness afforded by incorporation of the higher melting polymer component gives improved mechanical strength to the sintered product.

Abstract: A method and apparatus for storing a value in a non-volatile memory device is disclosed. The non-volatile memory device includes a plurality of address pins for concurrently receiving the respective bits of an address value while the non-volatile memory device is in a parallel interface mode. In response to one or more signals, the non-volatile memory device is transitioned to a serial interface mode to enable a serial input. A sequence of bits is received in the non-volatile memory device via the serial input. The first portion of the sequence of bits represents a store command and a second portion of the sequence of bits represents a data value. The data value represented by the second portion of the sequence of bits is then stored in the non-volatile memory device in response to the store command represented by the first portion of the sequence of bits.

Abstract: An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution essentially free from particulate matter.

Abstract: A method and apparatus for dynamically configuring the number of boundary-scan cells in a boundary-scan path is disclosed. A plurality of control signals is asserted to a plurality of boundary-scan cells in a boundary-scan path. Each control signal of the plurality of control signals is in a first state or a second state. For each control signal that is in a first state, a respective one of the plurality of boundary-scan cells is bypassed in the boundary-scan path.

Abstract: The adhesion of epoxy-resin containing resist compositions to a copper surface, which resist compositions are exposed to actinic radiation, developed and hardened, is enhanced by contacting the copper surface with an N-heterocyclic compound comprising --NH.sub.2 groups and drying the copper surface comprising the N-heterocyclic compound prior to application of the resist. Printed wiring boards produced by a partially additive process can be produced using this adhesion enhancement technique.

Abstract: A polymeric material which comprises an amorphous solid solution formed between a metallic compound and a polymer by virtue of ether, thioether or urethane linkages contained therein, the metal of the metallic compound being selected from the group consisting of Be, Mg, Sr, Ba, Sc, Y, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, Al, La and the other lanthanides.

Abstract: A polymeric material which comprises an amorphous solid solution formed between a metallic compound and a polymer by virtue of ether, thioether or urethane linkages contained therein, the metal of the metallic compound being selected from the group consisting of Be, Mg, Sr, Ba, Sc, Y, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, Al, La and the other lanthanides.

Abstract: A puzzle game apparatus and method of playing the game are disclosed wherein a base is provided with a plurality of rows of letters and punctuation symbols at fixed locations in the rows. A plurality of template outlines of various planar shapes and sizes are located in fixed positions among the letters and punctuation symbols in the rows. A plurality of movable elements corresponding in shape and size to various ones of the template outlines and adapted to be superimposed in registry thereon are provided. Each movable element has a letter display area which is identical in size and shape with the letter display areas of the other elements and which displays therein a letter.