Abstract: A method of forming fully aligned vias in a semiconductor device, the method including forming a first level interconnect line embedded in a first interlevel dielectric (ILD), selectively depositing a dielectric on the first interlevel dielectric, laterally etching the selectively deposited dielectric, depositing a dielectric cap layer and a second level interlevel dielectric on top of the first interlevel dielectric, and forming a via opening.

Abstract: A method and apparatus for minimizing engine weight for a turbine engine by utilizing one or more discrete protuberances disposed on an engine component wall. The wall can have a nominal thickness to decrease engine weight while the protuberances can provide increased discrete thicknesses for providing one or more cooling holes. The increased thickness at the protuberances provides for an increased thickness to provide sufficient length to increase cooling hole effectiveness.

Abstract: A display case including a frame with a first fastener, a door with a second fastener, and a bracket coupling the door to the frame is described. The bracket has a first end coupled a second end. The first end is pivotably coupled to the frame by the first fastener. The first end includes a first pair of spring arms having a first slot to couple to the first fastener and to allow the door to pivot between open and closed positions. The second end is slideably coupled to the door by the second fastener. The second end has detents on a second pair of spring arms and a second slot to allow the second fastener of the door to slide as the door is pivoted between open and closed positions. A first detent is positioned further from the first end of the bracket than a second detent.

Abstract: A method of forming fully aligned vias in a semiconductor device, the method including forming a first level interconnect line embedded in a first interlevel dielectric (ILD), selectively depositing a dielectric on the first interlevel dielectric, laterally etching the selectively deposited dielectric, depositing a dielectric cap layer and a second level interlevel dielectric on top of the first interlevel dielectric, and forming a via opening.

Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.

Abstract: A display case including a frame with a first fastener, a door with a second fastener, and a bracket coupling the door to the frame is described. The bracket has a first end coupled a second end. The first end is pivotably coupled to the frame by the first fastener. The first end includes a first pair of spring arms having a first slot to couple to the first fastener and to allow the door to pivot between open and closed positions. The second end is slideably coupled to the door by the second fastener. The second end has detents on a second pair of spring arms and a second slot to allow the second fastener of the door to slide as the door is pivoted between open and closed positions. A first detent is positioned further from the first end of the bracket than a second detent.

Abstract: The invention features a refrigerator cabinet door frame. The frame includes a thermally conductive outer frame, a thermally insulating inner frame member, and a sealing plate. The outer frame member includes a forward end having an outer surface that is disposed outside of a refrigerated cabinet with the frame mounted, and a rearward end defining a joint. The inner frame member includes a first end retained in the joint, and a second end. The sealing plate includes a first edge coupled to the outer frame member at the rearward end, forward of the joint, a second edge supported by the second end of the inner frame member, and a thermally conductive sealing surface. The first edge of the sealing plate is coupled to the outer frame member such that the sealing surface and the outer surface of the outer frame member together form a continuous heat transfer path.

Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.

Abstract: A method of forming fully aligned vias in a semiconductor device, the method including forming a first level interconnect line embedded in a first interlevel dielectric (ILD), selectively depositing a dielectric on the first interlevel dielectric, laterally etching the selectively deposited dielectric, depositing a dielectric cap layer and a second level interlevel dielectric on top of the first interlevel dielectric, and forming a via opening.

Abstract: In one general aspect, the subject matter described in this specification can be embodied in a display case door that includes an insulated panel assembly that is transparent to visible light. The door further includes a door frame extending about and secured to a peripheral edge of the insulated panel assembly, an electronic display overlaying the insulated panel assembly, and at least one lift-off hinge including a first hinge component attached to a longitudinal side of the door frame, and a second hinge component coupled to the electronic display.

Abstract: A display case door includes a sealed glass unit assembly, a door frame, and an electronic display. The sealed glass unit assembly includes a sealed glass unit and a subframe extending about and coupled to the sealed glass unit. The subframe includes a set of two or more subframe rails configured to hold the sealed glass unit. The door frame is coupled to the subframe and configured to support the sealed glass unit assembly in the door frame. The electronic display is coupled to the door frame in front of the sealed glass unit. The door frame is configured to couple with a display case enclosure in an opening of the display case enclosure.

Abstract: A display case door includes an insulated panel assembly, a door frame, and one or more mounting blocks. The insulated panel assembly is transparent to visible light. The door frame extends about and is coupled to the insulated panel assembly. The one or more mounting blocks are coupled to and extend inwardly from the door frame. The electronic display assembly includes an electronic display, and one or more side brackets coupled to the electronic display. At least one of the side brackets of the electronic display assembly is coupled to at least one of the one or more mounting blocks. The electronic display is at least partially supported on at least one of the one or more mounting blocks.

Abstract: A display case door having an insulated panel assembly, a support plate, an electronic display assembly, and a hanger bracket. The insulated panel assembly has a door frame that extends about and is coupled to the insulated panel assembly. The support plate is coupled to a top rail of the door frame and has a least one pin. The electronic display assembly is coupled to the door frame. The hanger bracket is coupled to a top surface of the electronic display assembly and has a slot sized to accept the pin. The electronic display assembly is at least partially supported in the door frame by the support plate and the hanger bracket.

Abstract: A device initiates voice communication sessions with a media resource function processor (MRFP) of a network, where each voice communication session communicates audio data via one or more network devices of the network. For each voice communication session, the device sends first audio data to the MRFP and receives second audio data from the MRFP via the voice communication session, processes the first audio data and second audio data to determine one or more characteristics of the second audio data, and generates a record concerning the voice communication session based on the one or more characteristics of the second audio data. The device generates a report based on a respective record of each voice communication session, processes the report using an artificial intelligence technique to identify an issue concerning at least one network device, and performs, based on identifying the issue, an action concerning the at least one network device.

Abstract: The present invention is directed to a covering for a clamping assembly used to connect and ground solar panel modules to a mounting rail. The covering comprises a sleeve including an outer cover for connecting to the solar panel module and a connector shaped to be contained within the outer cover and connected to the outer cover through two or more flanges. The connector has an opening there through to receive a female member of the clamping assembly.

Abstract: The invention features a refrigerator cabinet door frame. The frame includes a thermally conductive outer frame, a thermally insulating inner frame member, and a sealing plate. The outer frame member includes a forward end having an outer surface that is disposed outside of a refrigerated cabinet with the frame mounted, and a rearward end defining a joint. The inner frame member includes a first end retained in the joint, and a second end. The sealing plate includes a first edge coupled to the outer frame member at the rearward end, forward of the joint, a second edge supported by the second end of the inner frame member, and a thermally conductive sealing surface. The first edge of the sealing plate is coupled to the outer frame member such that the sealing surface and the outer surface of the outer frame member together form a continuous heat transfer path.

Abstract: A display case including a frame with a first fastener, a door with a second fastener, and a bracket coupling the door to the frame is described. The bracket has a first end coupled a second end. The first end is pivotably coupled to the frame by the first fastener. The first end includes a first pair of spring arms having a first slot to couple to the first fastener and to allow the door to pivot between open and closed positions. The second end is slideably coupled to the door by the second fastener. The second end has detents on a second pair of spring arms and a second slot to allow the second fastener of the door to slide as the door is pivoted between open and closed positions. A first detent is positioned further from the first end of the bracket than a second detent.

Abstract: The invention features a refrigerator cabinet door frame. The frame includes a thermally conductive outer frame, a thermally insulating inner frame member, and a sealing plate. The outer frame member includes a forward end having an outer surface that is disposed outside of a refrigerated cabinet with the frame mounted, and a rearward end defining a joint. The inner frame member includes a first end retained in the joint, and a second end. The sealing plate includes a first edge coupled to the outer frame member at the rearward end, forward of the joint, a second edge supported by the second end of the inner frame member, and a thermally conductive sealing surface. The first edge of the sealing plate is coupled to the outer frame member such that the sealing surface and the outer surface of the outer frame member together form a continuous heat transfer path.

Abstract: An engine component assembly with a first substrate having a hot surface in thermal communication with a hot combustion gas flow and a cooling surface, with the cooling surface being different than the hot surface, a second substrate having a first surface in fluid communication with a cooling fluid supply and a second surface, different from the first surface, facing and spaced from the cooling surface to define at least one interior cavity. At least one cavity is provided within the first substrate defining a cavity surface where at least a portion of the cavity surface is directly opposite the second surface. At least one cooling aperture extending through the second substrate from the first surface to the second surface, and defining a streamline along which a cooling fluid passes from the cooling fluid supply to the at least one interior cavity.

Abstract: An engine component for a gas turbine engine includes a film-cooled substrate having a hot surface facing hot combustion gas and a cooling surface facing a cooling fluid flow. The substrate includes one or more film holes that have a metering section defining a metering diameter and a diffusing section that defines a hooded length.