Abstract: A device initiates voice communication sessions with a media resource function processor (MRFP) of a network, where each voice communication session communicates audio data via one or more network devices of the network. For each voice communication session, the device sends first audio data to the MRFP and receives second audio data from the MRFP via the voice communication session, processes the first audio data and second audio data to determine one or more characteristics of the second audio data, and generates a record concerning the voice communication session based on the one or more characteristics of the second audio data. The device generates a report based on a respective record of each voice communication session, processes the report using an artificial intelligence technique to identify an issue concerning at least one network device, and performs, based on identifying the issue, an action concerning the at least one network device.

Abstract: A method of forming fully aligned vias in a semiconductor device, the method including recessing a first level interconnect line below a first interlevel dielectric (ILD), laterally etching the exposed upper portion of the first interlevel dielectric bounding the recess, depositing a dielectric cap layer and a second level interlevel dielectric on top of the first interlevel dielectric, and forming a via opening.

Abstract: A method is presented forming a fully-aligned via (FAV) and airgaps within a semiconductor device. The method includes forming a plurality of copper (Cu) trenches within an insulating layer, forming a plurality of ILD regions over exposed portions of the insulating layer, selectively removing a first section of the ILD regions in an airgap region, and maintaining a second section of the ILD regions in a non-airgap region. The method further includes forming airgaps in the airgap region and forming a via in the non-airgap region contacting a Cu trench of the plurality of Cu trenches.

Abstract: A method of forming fully aligned vias in a semiconductor device, the method including forming a first level interconnect line embedded in a first interlevel dielectric (ILD), selectively depositing a dielectric on the first interlevel dielectric, laterally etching the selectively deposited dielectric, depositing a dielectric cap layer and a second level interlevel dielectric on top of the first interlevel dielectric, and forming a via opening.

Abstract: A device initiates voice communication sessions with a media resource function processor (MRFP) of a network, where each voice communication session communicates audio data via one or more network devices of the network. For each voice communication session, the device sends first audio data to the MRFP and receives second audio data from the MRFP via the voice communication session, processes the first audio data and second audio data to determine one or more characteristics of the second audio data, and generates a record concerning the voice communication session based on the one or more characteristics of the second audio data. The device generates a report based on a respective record of each voice communication session, processes the report using an artificial intelligence technique to identify an issue concerning at least one network device, and performs, based on identifying the issue, an action concerning the at least one network device.

Abstract: The invention features a refrigerator cabinet door frame. The frame includes a thermally conductive outer frame, a thermally insulating inner frame member, and a sealing plate. The outer frame member includes a forward end having an outer surface that is disposed outside of a refrigerated cabinet with the frame mounted, and a rearward end defining a joint. The inner frame member includes a first end retained in the joint, and a second end. The sealing plate includes a first edge coupled to the outer frame member at the rearward end, forward of the joint, a second edge supported by the second end of the inner frame member, and a thermally conductive sealing surface. The first edge of the sealing plate is coupled to the outer frame member such that the sealing surface and the outer surface of the outer frame member together form a continuous heat transfer path.

Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.

Abstract: A method is presented forming a fully-aligned via (FAV) and airgaps within a semiconductor device. The method includes forming a plurality of copper (Cu) trenches within an insulating layer, forming a plurality of ILD regions over exposed portions of the insulating layer, selectively removing a first section of the ILD regions in an airgap region, and maintaining a second section of the ILD regions in a non-airgap region. The method further includes forming airgaps in the airgap region and forming a via in the non-airgap region contacting a Cu trench of the plurality of Cu trenches.

Abstract: The present invention is directed to a covering for a clamping assembly used to connect and ground solar panel modules to a mounting rail. The covering comprises a sleeve including an outer cover for connecting to the solar panel module and a connector shaped to be contained within the outer cover and connected to the outer cover through two or more flanges. The connector has an opening there through to receive a female member of the clamping assembly.

Abstract: A computer-implemented method for calibrating audio of a virtual reality device, the method comprising: determining a difference between a perceived tone location and an actual audible tone location, in response to an emitting of the actual audible tone; wherein the tone comprises a spectral tone, and creating and calibrating a user ear model by: emitting the spectral tone at a random time during a simulation by the virtual reality device; determining the perceived tone location during the simulation; and computing an error adjustment for one or more geometric variables of a default ear model based on a result of the determining.

Abstract: A method (and structure) includes performing an initial partial anneal of a metal interconnect overburden layer for semiconductor devices being fabricated on a chip on a semiconductor wafer. Orientation of an early recrystallizing grain at a specific location on a top surface of the metal overburden layer is determined, as implemented and controlled by a processor on a computer. A determination is made whether the orientation of the early recrystallizing grain is desirable or undesirable.

Abstract: A method and apparatus for minimizing engine weight for a turbine engine by utilizing one or more discrete protuberances disposed on an engine component wall. The wall can have a nominal thickness to decrease engine weight while the protuberances can provide increased discrete thicknesses for providing one or more cooling holes. The increased thickness at the protuberances provides for an increased thickness to provide sufficient length to increase cooling hole effectiveness.

Abstract: A document including a Directed Self-Assembly (DSA) pattern including a unique and randomized pattern embedded on the document, where the DSA is formed by using two different-length polymer chains.

Abstract: Gas turbine engine components are provided which utilize an insert to provide cooling air along a cooled surface of an engine component. The insert provides cooling holes or apertures which face the cool side surface of the engine component and direct cooling air onto that cool side surface. The apertures may be formed in arrays and directed at an oblique or a non-orthogonal angle to the surface of the insert and may be at an angle to the surface of the engine component being cooled. An engine component assembly is provided with counterflow impingement cooling, comprising an engine component cooling surface having a cooling fluid flow path on one side and a second component adjacent to the first component. The second component may have a plurality of openings forming an array wherein the openings extend through the second component at a non-orthogonal angle to the surface of the second component.

Abstract: The present invention is directed to a covering for a clamping assembly used to connect and ground solar panel modules to a mounting rail. The covering comprises a sleeve including an outer cover for connecting to the solar panel module and a connector shaped to be contained within the outer cover and connected to the outer cover through two or more flanges. The connector has an opening there through to receive a female member of the clamping assembly.

Abstract: A device initiates voice communication sessions with a media resource function processor (MRFP) of a network, where each voice communication session communicates audio data via one or more network devices of the network. For each voice communication session, the device sends first audio data to the MRFP and receives second audio data from the MRFP via the voice communication session, processes the first audio data and second audio data to determine one or more characteristics of the second audio data, and generates a record concerning the voice communication session based on the one or more characteristics of the second audio data. The device generates a report based on a respective record of each voice communication session, processes the report using an artificial intelligence technique to identify an issue concerning at least one network device, and performs, based on identifying the issue, an action concerning the at least one network device.

Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.

Abstract: A method (and structure) includes performing an initial partial anneal of a metal interconnect overburden layer for semiconductor devices being fabricated on a chip on a semiconductor wafer. Orientation of an early recrystallizing grain at a specific location on a top surface of the metal overburden layer is determined, as implemented and controlled by a processor on a computer. A determination is made whether the orientation of the early recrystallizing grain is desirable or undesirable.

Abstract: A device initiates voice communication sessions with a media resource function processor (MRFP) of a network, where each voice communication session communicates audio data via one or more network devices of the network. For each voice communication session, the device sends first audio data to the MRFP and receives second audio data from the MRFP via the voice communication session, processes the first audio data and second audio data to determine one or more characteristics of the second audio data, and generates a record concerning the voice communication session based on the one or more characteristics of the second audio data. The device generates a report based on a respective record of each voice communication session, processes the report using an artificial intelligence technique to identify an issue concerning at least one network device, and performs, based on identifying the issue, an action concerning the at least one network device.

Abstract: A structure for disrupting the flow of a fluid is provided, the structure comprising: a first lateral wall and a second lateral wall spaced apart from one another a distance across an X-axis; and a turbulator extending between the first lateral wall and the second lateral wall, the turbulator extending away from the floor. The turbulator includes a first front surface extending between the first lateral wall and the second lateral wall, a second front surface extending between the first lateral wall and the second lateral wall, a first rear surface extending between the first lateral wall and the second lateral wall, the first rear surface extending between the first front surface and the floor, and a second rear surface adjoining the first rear surface and extending between the first lateral wall and the second lateral wall, the second rear surface extending between the second front surface and the floor.