Patents by Inventor David C. Long

David C. Long has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170091491
    Abstract: Tamper-respondent electronic circuit structures, electronic assembly packages, and methods of fabrication are provided which include, at least in part, a tamper-respondent sensor. The tamper-respondent sensor includes one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: John R. DANGLER, Phillip Duane ISAACS, David C. LONG
  • Publication number: 20170094847
    Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure.
    Type: Application
    Filed: November 16, 2015
    Publication date: March 30, 2017
    Inventors: Michael J. FISHER, David C. LONG, Michael T. PEETS, Thomas WEISS
  • Publication number: 20170094783
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: John R. DANGLER, David C. LONG, Michael T. PEETS
  • Publication number: 20170094803
    Abstract: Methods of fabricating tamper-respondent electronic circuit structures and electronic assembly packages are provided which include, at least in part, a tamper-respondent sensor including one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.
    Type: Application
    Filed: August 29, 2016
    Publication date: March 30, 2017
    Inventors: John R. DANGLER, Phillip Duane ISAACS, David C. LONG
  • Publication number: 20170094808
    Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board.
    Type: Application
    Filed: November 16, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, Silvio DRAGONE, Roger S. KRABBENHOFT, David C. LONG, Stefano S. OGGIONI, Michael T. PEETS, William SANTIAGO-FERNANDEZ
  • Publication number: 20170089729
    Abstract: Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, Silvio DRAGONE, Roger S. KRABBENHOFT, David C. LONG, Stefano S. OGGIONI, Michael T. PEETS, William SANTIAGO-FERNANDEZ
  • Publication number: 20170094819
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, John R. DANGLER, Zachary T. DREISS, David C. LONG, Michael T. PEETS, William SANTIAGO-FERNANDEZ, Thomas WEISS
  • Publication number: 20170094804
    Abstract: Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
    Type: Application
    Filed: August 29, 2016
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, John R. DANGLER, Phillip Duane ISAACS, David C. LONG, Michael T. PEETS
  • Publication number: 20170091492
    Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, John R. DANGLER, Phillip Duane ISAACS, David C. LONG, Michael T. PEETS
  • Publication number: 20170094820
    Abstract: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly.
    Type: Application
    Filed: November 16, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, James A. BUSBY, Zachary T. DREISS, Michael J. FISHER, David C. LONG, William SANTIAGO-FERNANDEZ, Thomas WEISS
  • Patent number: 9591776
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: March 7, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, John R. Dangler, Zachary T. Dreiss, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
  • Patent number: 9578764
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: February 21, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael J. Fisher, David C. Long, Michael T. Peets, Thomas Weiss
  • Patent number: 9555606
    Abstract: Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: January 31, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael J. Fisher, David C. Long, Donald Merte, Robert Weiss, Thomas Weiss
  • Patent number: 9554477
    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: January 24, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
  • Publication number: 20160300780
    Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.
    Type: Application
    Filed: June 20, 2016
    Publication date: October 13, 2016
    Inventors: Raschid J. Bezama, David C. Long, Govindarajan Natarajan, Thomas Weiss
  • Publication number: 20160064306
    Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.
    Type: Application
    Filed: November 10, 2015
    Publication date: March 3, 2016
    Inventors: Raschid J. Bezama, David C. Long, Govindarajan Natarajan, Thomas Weiss
  • Patent number: 9034595
    Abstract: Systems and methods are provided for enhancing the integration of processes for recovering products from algae-derived biomass. The enhanced process integration allows for increased use of input streams and other reagents that are derived from renewable sources. This increases the overall renewable character of the products extracted from the algae-derived biomass. The process integration can include exchange of input streams or energy between an algae processing system and a system for processing non-algal biomass. One example of improving process integration is using oxygenates that are generated in a renewable manner as a reagent for enhancing the algae processing system.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: May 19, 2015
    Assignee: EXXONMOBIL RESEARCH AND ENGINEERING COMPANY
    Inventors: Paul D. Oldenburg, Michel Daage, Virginia M. Roberts, Paul J. Berlowitz, David C. Long, James R. Bielenberg
  • Patent number: 8962701
    Abstract: Systems and methods are provided for enhancing the integration of processes for recovering products from algae-derived biomass. The enhanced process integration allows for increased use of input streams and other reagents that are derived from renewable sources. This increases the overall renewable character of the products extracted from the algae-derived biomass. The process integration can include exchange of input streams or energy between an algae processing system and a system for processing non-algal biomass. One example of improving process integration is using oxygenates that are generated in a renewable manner as a reagent for enhancing the algae processing system.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: February 24, 2015
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Paul D. Oldenburg, Michel Daage, Virginia M. Roberts, Paul J. Berlowitz, David C. Long, James R. Bielenberg
  • Patent number: 8704019
    Abstract: Biomass based feeds are processed under hydrothermal treatment conditions to produce a hydrocarbon liquid product and a solids portion. The hydrothermal treatment is performed in the presence of catalyst particles. The presence of the heterogeneous catalyst can modify the nature of the hydrocarbon products produced from the hydrothermal treatment. After the hydrothermal treatment, the catalyst particles can be separated from the algae-based solids, to allow for recycle of the catalyst particles.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: April 22, 2014
    Assignee: Exxonmobil Research and Engineering Company
    Inventors: Paul D. Oldenburg, Virginia M. Roberts, Michel Daage, Paul J. Berlowitz, David C. Long, Halou Oumar-Mahamat
  • Patent number: 8704020
    Abstract: Biomass based feeds are processed under hydrothermal treatment conditions, e.g., to produce a hydrocarbon liquid product and a solids portion. The hydrothermal treatment is performed in the presence of a dissolved catalyst or catalyst precursor. The presence of the dissolved catalyst or catalyst precursor can modify the nature of the hydrocarbon products produced from the hydrothermal treatment.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: April 22, 2014
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Virginia M. Roberts, Michel Daage, James R. Bielenberg, Paul J. Berlowitz, Paul D. Oldenburg, David C. Long, Halou Oumar-Mahamat