Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

Abstract: Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

Abstract: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.

Abstract: A motorized cleaning/polishing device includes a housing and a carrier with a detachable cleaning/polishing attachment. The housing contains a rechargeable battery, motor and flex mount having flexible pillars to which the carrier is mounted. The carrier is also coupled to the motor drive shaft via an eccentric element and bearing. The carrier may have a foam layer with hook fasteners adhered to its underside for removably attaching any one of various attachments to the carrier. Cleanser is impregnated in the attachment. The device is particularly suited to orbit in the 3000 to 10,000 OPM range.

Abstract: Methods, systems and apparatus for automatically ensuring passenger safety by identifying article(s) in need of securing in a vehicle and attaching at least one wireless signaling component to each article. Each wireless signaling component includes a wireless signaling device and a mechanical blocking device that controls a wireless signal emitted from the wireless signaling device. The emitted wireless signaling indicates a state of the article. State information relating to a state of each article is generated and received at a data network device, which generates state results based on this state information. The state results are output to an end user, whereby the state results identify those articles that are secured, unsecured, and/or improperly secured, for automatically ensuring passenger safety.

Abstract: A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

Abstract: An apparatus for maintaining alignment between precision ground plates includes a first plate including a main body portion having plurality of passages. The first plate also includes a first heating device mounted to heat the main body portion to a selected temperature. A second plate including a main body portion having a plurality of passages is positioned adjacent the first plate. The second plate includes a second heating device mounted to heat the main body portion to a selected temperature. A controller operatively connected to the first and second heating devices selectively establishes a desired temperature in each of the first and second plates to facilitate a desired alignment between the plurality of passages in the first plate and the plurality of passages in the second plate.

Abstract: A method of correcting distortions in digital images captured by a digital camera system includes capturing a visual image with a digital camera having a camera body, converting the visual image to a digital format to form a captured digital image, determining camera angle position data by measuring relative lengths of a plurality of beams passing between the camera body and an object to be photographed, and removing distortions associated with camera angle position based on the camera angle position data to form a corrected digital image. The method further includes storing permanently both the captured digital image and the corrected digital image in a single memory, and storing the camera angle position data as a picture file header associated with the captured digital image. The camera angle position data is selectively employed to form the corrected digital image and to enable removal of corrections from a corrected digital image.

Abstract: A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

Abstract: A tensile strength testing structure for controlled collapse chip connections (C4) disposed above a substrate includes: a fixture base configured for positioning substrates with C4; a top fixture plate with through hole channels; test pins for insertion through the through hole channels; wherein dimensional tolerances of the substrates are accounted for with openings on at least two sides of the fixture base for positioning the substrates, and during alignment of the top fixture plate through hole channels with the C4 prior to securing the top fixture plate to the fixture base; wherein the test pins are strain hardened metal wires; wherein lower ends of the test pins are joined to the C4 during a solder reflow process; and wherein distal ends of the test pins are pulled in a direction perpendicular to the testing structure to determine the tensile strength of the C4.

Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

Abstract: An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

Abstract: A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.

Abstract: Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

Abstract: A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.

Abstract: A digital camera system includes a camera body; a lens mounted to the camera body, and an image processor operatively coupled to the lens. The image processor converts a visual image passing into the lens to a digital format to form a captured digital image. The digital camera system also includes an angle sensor mounted in the camera body. The angle sensor, in the form of a multi-spot focus angle sensor, determines a camera angle position and outputs camera angle position data. A distortion processor operatively coupled to the digital camera receives the camera angle position data obtained from the sensor and the captured digital image from the image processor to selectively remove distortions associated with the camera angle position to form a corrected digital image.

Abstract: A method for separating and filtering solid particles from a hydrocarbon slurry liquid includes two or more filter sections in fluid communication with the hydrocarbon slurry. At least one filter section is comprised of one or more filter elements having a mean pore size of less than 10 microns, and at least one other section is comprised of one or more filter elements having a mean pore size of 10 microns or greater. The small pore filter (less than 10 microns) will exclude all or substantially all of the smaller catalyst fines produced by catalyst particle attrition. The liquid product removed from the small pore filters will be substantially free of particulates. The large pore filters (10 microns or greater) will exclude larger catalyst particles, but will allow the smaller fines to pass. The liquid product removed from the large pore filters will contain the fines generated from catalyst particle attrition.

Abstract: A system and method for simulating to one or more individual observers a view through a window using a display screen comprising a storage device containing in electronic form one or more images of a scene selected from the group consisting of one or more images of the scene at different angles and one or more images of the scene at different magnifications. A display screen is adapted to display the images to one or more individual observers, and a sensor is adapted to locate observers with respect to the display screen. A controller is adapted to select one or more of the images based on angle or distance of the individual observers with respect to the display screen and display the selected images on the display screen to simulate to the observers a view through a window of the scene.