Patents by Inventor David Finn
David Finn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11416728Abstract: Apparatus and method for producing contact, contactless and dual-interface metal transaction cards that provides enhanced durability and aesthetics, with increased production efficiency. The cards may include (i) a metal core subassembly comprising a metal layer or layers (metal inlay) having a slit (S) allowing for contactless functionality, and (ii) a UV hard coat on a release-carrier layer disposed on one or both sides of the metal core subassembly, and (iii) everything may be laminated together in a single step, providing a metal face smartcard. The hard coat provides a durable, scratch-resistant surface, and protects underlying layers while allowing the passage of a laser beam to write on or within the underlying layer(s), such as a transparent laser-reactive layer. Techniques for hiding or camouflaging the slit provide a more aesthetically pleasing appearance to the metal transaction card.Type: GrantFiled: September 14, 2020Date of Patent: August 16, 2022Assignee: Federal Card Services, LLCInventors: David Finn, Daniel Pierrard, Alex Sanchez
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Patent number: 11410010Abstract: A wireless connection is established between at least two electronic modules (M1, M2) disposed separate from one another in a smartcard having a coupling frame so that the two modules may communicate (signals, data) with each other. The two modules may each have module antennas (MA-1, MA-2), and may be disposed in respective two openings (MO-1, MO-2) of a coupling frame (CF). A coupling antenna (CPA) having two coupler coils (CC-1, CC-2) disposed close to the two modules antennas of the two modules. The coupling antenna may have only the two coupler coils (CC-1, CC-2), connected with one another, without the peripheral card antenna (CA) component of a conventional booster antenna (BA). Energy harvesting is disclosed.Type: GrantFiled: May 3, 2020Date of Patent: August 9, 2022Assignee: AMATECH GROUP LIMIIEDInventors: Mustafa Lotya, David Finn
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Patent number: 11392817Abstract: Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.Type: GrantFiled: August 29, 2020Date of Patent: July 19, 2022Assignee: AMATECH GROUP LIMITEDInventors: Mustafa Lotya, David Finn, Darren Molloy
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Patent number: 11386317Abstract: A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is “open loop”. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.Type: GrantFiled: August 29, 2020Date of Patent: July 12, 2022Assignee: AMATECH GROUP LIMITEDInventors: Mustafa Lotya, David Finn, Darren Molloy
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Patent number: 11354560Abstract: RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.Type: GrantFiled: August 29, 2020Date of Patent: June 7, 2022Assignee: AmaTech Group LimitedInventors: Mustafa Lotya, David Finn, Darren Molloy
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Patent number: 11354558Abstract: A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard. Various slit designs (configurations, geometries) are described and illustrated. The slit may be filled. The slit may be reinforced.Type: GrantFiled: January 14, 2020Date of Patent: June 7, 2022Assignee: AmaTech Group LimitedInventors: Mustafa Lotya, Darren Molloy, David Finn
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Patent number: 11347993Abstract: (i) Smartcards (SC) manufactured from a web of metal inlays (MI; FIGS. 12-14) with the coupling frame (CF) forming the metal card body (MCB) supported by metal struts (struts). In the production of smartcards having a coupling frame (CF) with a slit (S), the slit may form part of graphic elements (FIGS. 10-12). (ii) Printing and coating techniques may be used to camouflage the slit (FIGS. 9A-9D). (iii) Surface currents may be collected from one location in a card body (CB) and transported to another location (FIGS. 15AB). A flexible circuit (FC) may be connected to termination points (TP) across the slit (S), or may couple via a patch antenna (PA) with the slit (S). The flexible circuit may couple, via an antenna structure (AS) with the module antenna (MA) of a transponder chip module (TCM).Type: GrantFiled: August 12, 2020Date of Patent: May 31, 2022Assignee: Federal Card Services, LLCInventor: David Finn
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Patent number: 11341389Abstract: A “core” or “inlay” for a smartcard may comprise a first metal layer and a second metal layer, and may be formed by folding a single metal layer upon itself. A module cavity may be formed in the first metal layer by laser cutting, prior to laminating. An adhesive layer may be disposed between the two metal layers. A module opening may be formed in the second metal layer by milling, after laminating the first metal layer to the second metal layer. A slit in a metal layer may extend from an outer edge of the layer to the cavity or opening, thereby forming a coupling frame. The slit may have a termination hole at either end or at both ends of the slit. The slits of two metal layers may be positioned differently than one another.Type: GrantFiled: March 3, 2020Date of Patent: May 24, 2022Assignee: AmaTech Group LimitedInventors: Mustafa Lotya, David Finn, Darren Molloy
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Patent number: 11341385Abstract: A transaction card for dual interface communication of a transaction includes a card body, a chip opening, a discontinuity, and a transponder chip. The card body includes a first metal layer having an outer peripheral edge, a first metal face, and a second metal face. The chip opening includes a first chip hole transversely extending from the first metal face toward the second metal face thereby defining a first metal edge surrounding a predetermined hole shape. The discontinuity extends from the outer peripheral edge to the first metal edge. The transponder chip module has a module antenna and is configured to be received within the chip opening. The module antenna defines an outer antenna edge surrounding a predetermined antenna shape such that the predetermined antenna shape is the same as the predetermined hole shape for improved inductive coupling via the discontinuity during use.Type: GrantFiled: November 13, 2020Date of Patent: May 24, 2022Assignee: Federal Card Services, LLCInventor: David Finn
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Publication number: 20220138522Abstract: RFID devices comprising (i) a transponder chip module (TCM) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.Type: ApplicationFiled: January 19, 2022Publication date: May 5, 2022Inventors: Mustafa Lotya, David Finn, Darren Molloy
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Patent number: 11315003Abstract: A transaction card (smartcard) having a front “continuous” (with no slit) metal layer (ML, CML) with an opening (MO) for a dual-interface transponder chip module (TCM) having a module antenna (MA) on its bond side. A magnetic shielding layer (MSL) comprising ferrite material disposed below the front face continuous metal layer. An amplifying element, booster antenna circuit (BAC) disposed under the magnetic shielding layer. A rear discontinuous metal layer (ML, DML) with a slit (S) and a metal ledge surrounding the module opening to function as a coupling frame (CF). A rear plastic layer formed of non-RF impeding material may support a magnetic stripe and security elements (signature panel and hologram). A portion of the front face continuous metal layer may protrude downward into the magnetic shielding layer and booster antenna circuit layer. The rear discontinuous metal layer may have an additional slit to regulate the activation distance.Type: GrantFiled: April 1, 2021Date of Patent: April 26, 2022Assignee: Federal Card Services, LLCInventor: David Finn
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Patent number: 11250305Abstract: An RFID enabled metal transaction card comprising (i) a transponder chip module (TCM) having a RF payment chip (IC) and a module antenna (MA), (ii) a coupling frame (CF) in the form of a metal card body (MCB) having an electrical discontinuity comprising a slit (S, SCF) and (iii) a discontinuous metal frame (DMF) assembled to the metal card body (MCB) in a peripheral area thereof and having a slit (S, SDMF). The discontinuous metal frame (DMF) is electrically isolated from the metal card body (MCB) and may be coated with an insulating medium. The DMF camouflages the slit in the metal card body and mechanically stabilizes the structure of the card body, especially during insertion in an automatic teller machine (ATM) or point of sale (POS) terminal.Type: GrantFiled: January 13, 2021Date of Patent: February 15, 2022Assignee: Federal Card Services, LLCInventor: David Finn
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Publication number: 20210365759Abstract: Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).Type: ApplicationFiled: July 20, 2021Publication date: November 25, 2021Inventors: David Finn, Mustafa Lotya
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Publication number: 20210350198Abstract: A transaction card (smartcard) having a front “continuous” (with no slit) metal layer (ML, CML) with an opening (MO) for a dual-interface transponder chip module (TCM) having a module antenna (MA) on its bond side. A magnetic shielding layer (MSL) comprising ferrite material disposed below the front face continuous metal layer. An amplifying element, booster antenna circuit (BAC) disposed under the magnetic shielding layer. A rear discontinuous metal layer (ML, DML) with a slit (S) and a metal ledge surrounding the module opening to function as a coupling frame (CF). A rear plastic layer formed of non-RF impeding material may support a magnetic stripe and security elements (signature panel and hologram). A portion of the front face continuous metal layer may protrude downward into the magnetic shielding layer and booster antenna circuit layer. The rear discontinuous metal layer may have an additional slit to regulate the activation distance.Type: ApplicationFiled: April 1, 2021Publication date: November 11, 2021Inventor: David Finn
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Patent number: 11113593Abstract: Smartcards (SC) having a metal layer (ML) or metal card body (MCB) and a module opening (MO) for a transponder chip module (TCM). A slit (S) or notch (N) in the metal card body may extend from a peripheral edge of a metal layer or card body, without extending to the module opening. A flexible circuit (FC) with one or two patch antennae (PA) or sense coils (SeC) connected to a coupling loop structure (CLS) with an antenna structure (AS) on the same substrate may be incorporated into the card body (CB). A fingerprint sensing module comprising an electrically-conductive metal bezel housed in the card may be electrically isolated from the metal layer or metal card body by the application of coatings (DLC) or anodizing (oxidizing) the respective metal surfaces. The cards may be contactless only, contact only, or dual-interface (contact and contactless).Type: GrantFiled: August 15, 2020Date of Patent: September 7, 2021Assignee: Federal Card Services; LLCInventor: David Finn
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Publication number: 20210256341Abstract: Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.Type: ApplicationFiled: April 13, 2021Publication date: August 19, 2021Inventors: Mustafa Lotya, Darren Molloy, David Finn
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Patent number: 11084553Abstract: A floating offshore structure includes a buoyant hull including a first column, a second column, and a pontoon coupled to the first column and the second column. The pontoon extends horizontally from the first column to the second column. The pontoon includes a first tubular member, a second tubular member positioned laterally adjacent to the first tubular member, a first edge plate extending horizontally from the first tubular member, and a second edge plate extending horizontally from the second tubular member. The first tubular member and the second tubular member are disposed between the first edge plate and the second edge plate. Each tubular member has a central axis, a first end coupled to the lower end of the first column, and a second end coupled to the lower end of the second column. The longitudinal axis of the first tubular member and the longitudinal axis of the second tubular member are disposed in a common horizontal plane.Type: GrantFiled: June 11, 2019Date of Patent: August 10, 2021Assignee: HORTON DO BRASIL TECHNOLOGIA OFFSHORE, LTDA.Inventors: Marcelo I. L. Souza, Lyle David Finn, Xavier Castello, Rodrigo M. R. Guimarães, Luiz Germano Bodanese, Rafael Bodanese
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Patent number: 11068770Abstract: Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).Type: GrantFiled: February 5, 2019Date of Patent: July 20, 2021Assignee: Féinics AmaTech Teoranta Lower ChurchfieldInventors: David Finn, Mustafa Lotya
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Publication number: 20210216838Abstract: An RFID enabled metal transaction card comprising (i) a transponder chip module (TCM) having a RF payment chip (IC) and a module antenna (MA), (ii) a coupling frame (CF) in the form of a metal card body (MCB) having an electrical discontinuity comprising a slit (S, SCF) and (iii) a discontinuous metal frame (DMF) assembled to the metal card body (MCB) in a peripheral area thereof and having a slit (S, SDMF). The discontinuous metal frame (DMF) is electrically isolated from the metal card body (MCB) and may be coated with an insulating medium. The DMF camouflages the slit in the metal card body and mechanically stabilizes the structure of the card body, especially during insertion in an automatic teller machine (ATM) or point of sale (POS) terminal.Type: ApplicationFiled: January 13, 2021Publication date: July 15, 2021Inventor: David Finn
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Publication number: 20210192312Abstract: Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.Type: ApplicationFiled: August 29, 2020Publication date: June 24, 2021Inventors: Mustafa Lotya, David Finn, Darren Molloy