Patents by Inventor David Finn

David Finn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10789524
    Abstract: A wireless connection may be established between at least two electronic modules (M1, M2) disposed in module openings (MO-1, MO-2) of a smartcard so that the two modules may communicate (signals, data) with each other. The connection may be implemented by a booster antenna (BA) having two coupler coils (CC-1, CC-2) disposed in close proximity with the two modules, and connected with one another. The booster antenna may also harvest energy from an external device such as a card reader, POS terminal, or a smartphone, and provide the energy to the two modules via the two coupler coils.
    Type: Grant
    Filed: February 23, 2020
    Date of Patent: September 29, 2020
    Assignee: AmaTech Group Limited
    Inventors: Mustafa Lotya, David Finn
  • Patent number: 10783426
    Abstract: A dual-interface metal hybrid smartcard comprising a plastic card body (CB), a booster antenna (BA) and a metal frame (CMF, DMF) disposed in the card body, in the form of a rectangular metal frame disposed external to the booster antenna (BA). The metal frame may extend continuously around the periphery of the card body as a continuous metal frame (CMF), or may have a slit (S), thereby forming a discontinuous metal frame (DMF). A second metal slug (MS-2) may be disposed at a lower portion of the card body (CB), inside the booster antenna. A smartcard may comprise a plastic card body (CB) and a generally rectangular metal slug (MS) having a main body portion slightly smaller than the card body, and having at least one protrusion extending from corresponding at least one corner of the main body portion of the metal slug to corresponding at least one corner of the card body.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: September 22, 2020
    Inventors: David Finn, Mustafa Lotya, Darren Molloy
  • Patent number: 10762413
    Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) component contributing to the inductance of the booster antenna (BA). At least a portion of the coupler coil (CC) component may have a sense which is opposite to a sense of at least a portion of the card antenna (CA) component. At least a portion of one of the components may be interleaved with (i) a portion of another component, or (ii) another portion of the same component. A capacitive extension (CE) may extend from at least one of the card antenna (CA), coupler coil (CC) and extension antenna (EA) components.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: September 1, 2020
    Assignee: Féinics AmaTech Teoranta
    Inventors: David Finn, Klaus Ummenhofer
  • Publication number: 20200257953
    Abstract: A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard. Various slit designs (configurations, geometries) are described and illustrated. The slit may be filled. The slit may be reinforced.
    Type: Application
    Filed: January 14, 2020
    Publication date: August 13, 2020
    Inventors: Mustafa Lotya, Darren Molloy, David Finn
  • Publication number: 20200250504
    Abstract: A “core” or “inlay” for a smartcard may comprise a first metal layer and a second metal layer, and may be formed by folding a single metal layer upon itself. A module cavity may be formed in the first metal layer by laser cutting, prior to laminating. An adhesive layer may be disposed between the two metal layers. A module opening may be formed in the second metal layer by milling, after laminating the first metal layer to the second metal layer. A slit in a metal layer may extend from an outer edge of the layer to the cavity or opening, thereby forming a coupling frame. The slit may have a termination hole at either end or at both ends of the slit. The slits of two metal layers may be positioned differently than one another.
    Type: Application
    Filed: March 3, 2020
    Publication date: August 6, 2020
    Inventors: Mustafa Lotya, David Finn, Darren Molloy
  • Publication number: 20200250506
    Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.
    Type: Application
    Filed: March 23, 2020
    Publication date: August 6, 2020
    Inventors: Mustafa Lotya, David Finn, Darren Molloy
  • Patent number: 10733494
    Abstract: A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP).
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: August 4, 2020
    Assignee: Féinics AmaTech Teoranta
    Inventors: David Finn, Mustafa Lotya, Darren Molloy
  • Publication number: 20200226443
    Abstract: A wireless connection may be established between at least two electronic modules (M1, M2) disposed in module openings (MO-1, MO-2) of a smartcard so that the two modules may communicate (signals, data) with each other. The connection may be implemented by a booster antenna (BA) having two coupler coils (CC-1, CC-2) disposed in close proximity with the two modules, and connected with one another. The booster antenna may also harvest energy from an external device such as a card reader, POS terminal, or a smartphone, and provide the energy to the two modules via the two coupler coils.
    Type: Application
    Filed: February 23, 2020
    Publication date: July 16, 2020
    Inventors: Mustafa Lotya, David Finn
  • Publication number: 20200151534
    Abstract: Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.
    Type: Application
    Filed: December 30, 2019
    Publication date: May 14, 2020
    Inventors: Mustafa Lotya, Darren Molloy, David Finn
  • Patent number: 10599972
    Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: March 24, 2020
    Assignee: Féinics AmaTech Teoranta
    Inventors: David Finn, Mustafa Lotya, Darren Molloy
  • Publication number: 20200050914
    Abstract: Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).
    Type: Application
    Filed: February 5, 2019
    Publication date: February 13, 2020
    Inventors: David Finn, Mustafa Lotya
  • Patent number: 10552722
    Abstract: Smartcard (SC) having a card body (CB) and a conductive coupling frame antenna (CFA) extending as a closed loop circuit around a periphery of the card body, and also extending inwardly so that two portions of the coupling frame antenna are closely adjacent each other, with a gap therebetween. The gap may extend from a periphery of the card body to a position corresponding with a module antenna (MA) of a transponder chip module (TCM) disposed in the card body, and may function like a slit (S) in a coupling frame (CF). A portion of the coupling frame antenna may be arranged to surround the ISO position of the transponder chip module in the card body. A coupling frame antenna (CFA) may be incorporated onto a module tape (MT) for a transponder chip module (TCM).
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: February 4, 2020
    Assignee: Féinics AmaTech Teoranta
    Inventors: David Finn, Mustafa Lotya, Darren Molloy
  • Publication number: 20200034578
    Abstract: According to the invention, generally, a wireless connection may be established between two electronic modules (M1, M2) disposed in module openings (MO-1, MO-2) of a smartcard so that the two modules may communicate (signals, data) with each other. The connection may be implemented by a booster antenna (BA) having two coupler coils (CC-1, CC-2) disposed close to the two modules, and connected with one another. The booster antenna may also harvest energy from an external device such as a card reader, POS terminal, or a smartphone. A coupling antenna (CPA) may have only the two coupler coils connected with one another, without the peripheral card antenna (CA) component of a conventional booster antenna. A module may be disposed in only one of the two module openings.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 30, 2020
    Inventors: David Finn, Mustafa Lotya, Darren Molloy
  • Publication number: 20200005114
    Abstract: A dual-interface metal hybrid smartcard comprising a plastic card body (CB), a booster antenna (BA) and a metal frame (CMF, DMF) disposed in the card body, in the form of a rectangular metal frame disposed external to the booster antenna (BA). The metal frame may extend continuously around the periphery of the card body as a continuous metal frame (CMF), or may have a slit (S), thereby forming a discontinuous metal frame (DMF). A second metal slug (MS-2) may be disposed at a lower portion of the card body (CB), inside the booster antenna. A smartcard may comprise a plastic card body (CB) and a generally rectangular metal slug (MS) having a main body portion slightly smaller than the card body, and having at least one protrusion extending from corresponding at least one corner of the main body portion of the metal slug to corresponding at least one corner of the card body.
    Type: Application
    Filed: January 29, 2019
    Publication date: January 2, 2020
    Inventors: David Finn, Mustafa Lotya, Darren Molloy
  • Patent number: 10518518
    Abstract: Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: December 31, 2019
    Assignee: Féinics AmaTech Teoranta
    Inventors: David Finn, Mustafa Lotya, Darren Molloy
  • Publication number: 20190392283
    Abstract: A planar antenna (PA) of a transponder chip module (TCM) may have a planar antenna (PA) etched from a foil to have a track width of approximately 100 ?m or less; and a spacing between adjacent turns of the track of approximately 25 ?m or less. The track may subsequently be plated to reduce the spacing. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA).
    Type: Application
    Filed: January 14, 2019
    Publication date: December 26, 2019
    Inventors: David Finn, Mustafa Lotya, Darren Molloy
  • Publication number: 20190291820
    Abstract: A floating offshore structure includes a buoyant hull including a first column, a second column, and a pontoon coupled to the first column and the second column. The pontoon extends horizontally from the first column to the second column. The pontoon includes a first tubular member, a second tubular member positioned laterally adjacent to the first tubular member, a first edge plate extending horizontally from the first tubular member, and a second edge plate extending horizontally from the second tubular member. The first tubular member and the second tubular member are disposed between the first edge plate and the second edge plate. Each tubular member has a central axis, a first end coupled to the lower end of the first column, and a second end coupled to the lower end of the second column. The longitudinal axis of the first tubular member and the longitudinal axis of the second tubular member are disposed in a common horizontal plane.
    Type: Application
    Filed: June 11, 2019
    Publication date: September 26, 2019
    Applicant: HORTON DO BRASIL TECNOLOGIA OFFSHORE, LTDA.
    Inventors: Marcelo I. L. Souza, Lyle David Finn, Xavier Castello, Rodrigo M. R. Guimarães, Luiz Germano Bodanese, Rafael Bodanese
  • Patent number: 10358188
    Abstract: A floating offshore structure includes a buoyant hull including a first column, a second column, and a pontoon coupled to the first column and the second column. Each column is vertically oriented and the pontoon extends horizontally from the first column to the second column. Each column has a central axis, an upper end, and a lower end. The pontoon includes a first tubular member and a second tubular member positioned laterally adjacent to the first tubular member. Each tubular member has a central axis, a first end coupled to the lower end of the first column, and a second end coupled to the lower end of the second column. The longitudinal axis of the first tubular member and the longitudinal axis of the second tubular member are disposed in a common horizontal plane.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: July 23, 2019
    Assignee: HORTON DO BRASIL TECHNOLOGIA OFFSHORE, LTDA.
    Inventors: Marcelo I. L. Souza, Lyle David Finn, Xavier Castello, Rodrigo M. R. Guimarães, Luiz Germano Bodanese, Rafael Bodanese
  • Publication number: 20190197386
    Abstract: A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard.
    Type: Application
    Filed: January 13, 2019
    Publication date: June 27, 2019
    Inventors: David Finn, Mustafa Lotya, Darren Molloy
  • Publication number: 20190197385
    Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) component contributing to the inductance of the booster antenna (BA). At least a portion of the coupler coil (CC) component may have a sense which is opposite to a sense of at least a portion of the card antenna (CA) component. At least a portion of one of the components may be interleaved with (i) a portion of another component, or (ii) another portion of the same component. A capacitive extension (CE) may extend from at least one of the card antenna (CA), coupler coil (CC) and extension antenna (EA) components.
    Type: Application
    Filed: January 8, 2019
    Publication date: June 27, 2019
    Inventors: David Finn, Klaus Ummenhofer