Abstract: RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.

Abstract: RFID-enabled composite metal transaction cards may include a security layer comprising a hologram or diffraction grating on a metal layer having a slit. The metal layer may reside on a front or rear face, or as a core layer in the construction of the card. The security layer, with or without a carrier layer, may be hot stamped to the metal layer with a protective hard coating, to camouflage the existence of a discontinuity in the metal layer. The metal layer with slit or slits may be coated with a baked-on-ink to provide color and to partially fill the slit or slits. A metal foil, holofoil or a holographic metal film may be provided with a discontinuity in the form of a slit and may be a decorative foil mounted to a card body containing a metal layer with a slit.

Abstract: A transaction card for dual interface communication of a transaction includes a card body, a chip opening, a discontinuity, and a transponder chip. The card body includes a first metal layer having an outer peripheral edge, a first metal face, and a second metal face. The chip opening includes a first chip hole transversely extending from the first metal face toward the second metal face thereby defining a first metal edge surrounding a predetermined hole shape. The discontinuity extends from the outer peripheral edge to the first metal edge. The transponder chip module has a module antenna and is configured to be received within the chip opening. The module antenna defines an outer antenna edge surrounding a predetermined antenna shape such that the predetermined antenna shape is the same as the predetermined hole shape for improved inductive coupling via the discontinuity during use.

Abstract: Apparatus and method for producing contact, contactless and dual-interface metal transaction cards that provides enhanced durability and aesthetics, with increased production efficiency. The cards may include (i) a metal core subassembly comprising a metal layer or layers (metal inlay) having a slit (S) allowing for contactless functionality, and (ii) a UV hard coat on a release-carrier layer disposed on one or both sides of the metal core subassembly, and (iii) everything may be laminated together in a single step, providing a metal face smartcard. The hard coat provides a durable, scratch-resistant surface, and protects underlying layers while allowing the passage of a laser beam to write on or within the underlying layer(s), such as a transparent laser-reactive layer. Techniques for hiding or camouflaging the slit provide a more aesthetically pleasing appearance to the metal transaction card.

Abstract: RFID-enabled metal transaction cards may include a specially treated thin decorative layer attached to a thick core layer of metal or metal layers (with a discontinuity to function as a coupling frame), or a combination of ceramic and metal separated by a polymeric material, wherein the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal core cards. The decorative layer may comprise (a) an anodized metal layer with a discontinuity; or (b) a ceramic layer on a flexible polymeric material. A ceramic-containing transaction card may comprise a monolithic ceramic layer of ultra-thin, flexible zirconia. A PET or PEN layer laminated to the ultra-thin ceramic layer may absorb mechanical stress from flexing or torsion of the ceramic card body.

Abstract: Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.

Abstract: A dog link for a sharp chain conveyor with at least one spike to impale into a log, where at least one forwardly and/or upwardly facing spike on each dog link is combined with at least one rearwardly facing spike and/or barb disposed on a spike to insure that wherever the log is impaled, the dog counteracts any forward surge and more securely impales the log.

Abstract: (i) Smartcards (SC) manufactured from a web of metal inlays (MI; FIGS. 12-14) with the coupling frame (CF) forming the metal card body (MCB) supported by metal struts (struts). In the production of smartcards having a coupling frame (CF) with a slit (S), the slit may form part of graphic elements (FIGS. 10-12). (ii) Printing and coating techniques may be used to camouflage the slit (FIGS. 9A-9D). (iii) Surface currents may be collected from one location in a card body (CB) and transported to another location (FIGS. 15AB). A flexible circuit (FC) may be connected to termination points (TP) across the slit (S), or may couple via a patch antenna (PA) with the slit (S). The flexible circuit may couple, via an antenna structure (AS) with the module antenna (MA) of a transponder chip module (TCM).

Abstract: Proximity cards or contactless smartcards manufactured by folding a metal layer along one or two fold lines to form a metal card body (MCB) having the dimensions of a standard ID-1 smartcard. An antenna structure (AS) on a flexible or rigid circuit sandwiched powering an RFID chip may be disposed between the folded metal layer or metal layers. A smartcard (SC) characterized by a booster antenna (BA) arranged on a rear plastic layer laminated to a front metal layer (ML) having a slit (S). A sense coil (SeC) component may be arranged around the slit, and may overlap the slit in a zigzag fashion or the like. The sense coil may have a loop, spiral or helix shape. The booster antenna may form a closed loop circuit or an open loop circuit.

Abstract: (i) Smartcards (SC) manufactured from a web of metal inlays (MI; FIGS. 12-14) with the coupling frame (CF) forming the metal card body (MCB) supported by metal struts (struts). In the production of smartcards having a coupling frame (CF) with a slit (S), the slit may form part of graphic elements (FIGS. 10-12). (ii) Printing and coating techniques may be used to camouflage the slit (FIGS. 9A-9D). (iii) Surface currents may be collected from one location in a card body (CB) and transported to another location (FIGS. 15AB). A flexible circuit (FC) may be connected to termination points (TP) across the slit (S), or may couple via a patch antenna (PA) with the slit (S). The flexible circuit may couple, via an antenna structure (AS) with the module antenna (MA) of a transponder chip module (TCM).

Abstract: Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

Abstract: A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is “open loop”. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.

Abstract: Smartcards (SC) having a metal layer (ML) or metal card body (MCB) and a module opening (MO) for a transponder chip module (TCM). A slit (S) or notch (N) in the metal card body may extend from a peripheral edge of a metal layer or card body, without extending to the module opening. A flexible circuit (FC) with one or two patch antennae (PA) or sense coils (SeC) connected to a coupling loop structure (CLS) with an antenna structure (AS) on the same substrate may be incorporated into the card body (CB). A fingerprint sensing module comprising an electrically-conductive metal bezel housed in the card may be electrically isolated from the metal layer or metal card body by the application of coatings (DLC) or anodizing (oxidizing) the respective metal surfaces. The cards may be contactless only, contact only, or dual-interface (contact and contactless).

Abstract: Smartcard (SC) having a metal card body (MCB) which is a coupling frame (CF) with a slit (S), and a coupling loop antenna/structure (CLA, CLS) connected to termination points (TP) on each side of the slit (S) and coupled with the module antenna (MA) of a transponder chip module (TCM). A portion of the card body (CB) may be metal and another, coplanar portion of the card body may be a synthetic material which may be transparent or translucent. Currents may be collected from the interface between the two portions. The card body (CB) may have two metal layers of different materials, adhesively joined to each other using a thermosetting epoxy that converts from B-stage to C-stage during lamination.

Abstract: A dual-interface smartcard (SC) having a booster antenna (BA) with coupler coil (CC) in its card body, and a metallized face plate having a window opening for an antenna module (AM) having contact pads (CP) and a module antenna (MA). A compensation loop (CL) may be disposed directly behind a peripheral portion of the booster antenna. The compensation loop may be formed of a conductive material, such as copper, or of ferrite, and may have two free ends or no free ends. Additionally, the window opening may be substantially larger than the antenna module, the face plate may be perforated, ferrite material may be disposed between the face plate and the booster antenna, the coupler coil may be offset from the antenna, and a ferrite element may be disposed in the antenna module between the module antenna and the contact pads.

Abstract: A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP). The slits in the metal layers may have non-linear shapes.

Abstract: A planar antenna (PA) of a transponder chip module (TCM) may have a planar antenna (PA) etched from a foil to have a track width of approximately 100 ?m or less; and a spacing between adjacent turns of the track of approximately 25 ?m or less. The track may subsequently be plated to reduce the spacing. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA).

Abstract: A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard.

Abstract: A wireless connection is established between at least two electronic modules (M1, M2) disposed separate from one another in a smartcard having a coupling frame so that the two modules may communicate (signals, data) with each other. The two modules may each have module antennas (MA-1, MA-2), and may be disposed in respective two openings (MO-1, MO-2) of a coupling frame (CF). A coupling antenna (CPA) having two coupler coils (CC-1, CC-2) disposed close to the two modules antennas of the two modules. The coupling antenna may have only the two coupler coils (CC-1, CC-2), connected with one another, without the peripheral card antenna (CA) component of a conventional booster antenna (BA). Energy harvesting is disclosed.