Abstract: Techniques are described for performing filter and project operations. In an embodiment, a set of predicates that specify criteria for filtering results to a query is received. Based on a particular predicate of the set of predicates, a predicate result for at least one portion of a particular column is generated. The predicate result identifies rows within the first column that satisfy the particular predicate. Rows are selected and returned as results to the query based at least in part on the predicate result. In an embodiment, the predicate result is a bitvector where each bit of the bitvector corresponds to a particular row within the particular column and identify whether the particular row satisfies the particular predicate.

Abstract: Systems and methods for tuning an impedance matching network in a step-wise fashion for each state are described. By tuning the impedance matching network in a step-wise fashion for each state instead of directly achieving optimum values of a radio frequency (RF) for each state and directly achieving an optimal value of a combined variable capacitance for each state, processing of a wafer using the tuned optimal values becomes feasible.

Abstract: A hand-portable drying apparatus and method for use in a damp or waterlogged room, the apparatus including a housing having a carrying handle, the housing containing first and second airflow ducts arranged generally parallel to each other and having respective air inlet and air outlet ends, the apparatus further including means to force air through the ducts and to selectively heat it in at least one of the ducts, and valve means within the housing to selectively direct air from the first duct to the second duct whereby to move air from within the room received by the first duct back to the room via the second duct or to expel air from the room via the first duct to outside the room and draw in fresh air from outside the room via the second duct.

Abstract: Systems, methods, apparatus, and computer program products are provided for managing access of mobile stations to a plurality of wireless carriers. For example, in one embodiment, a central system can provide configuration files to mobile stations. The mobile stations can use the configuration files to access a plurality of different wireless carriers, with the different wireless carriers potentially implementing distinct technologies and communication standards and protocols.

Abstract: Systems, methods, apparatus, and computer program products are provided for managing access of mobile stations to a plurality of wireless carriers. For example, in one embodiment, a central system can provide configuration files to mobile stations. The mobile stations can use the configuration files to access a plurality of different wireless carriers, with the different wireless carriers potentially implementing distinct technologies and communication standards and protocols.

Abstract: Systems and methods for tuning an impedance matching network in a step-wise fashion for each state are described. By tuning the impedance matching network in a step-wise fashion for each state instead of directly achieving optimum values of a radio frequency (RF) for each state and directly achieving an optimal value of a combined variable capacitance for each state, processing of a wafer using the tuned optimal values becomes feasible.

Abstract: Techniques are described for performing grouping and aggregation operations. In an embodiment, a request is received to aggregate data grouped by a first column. In response to receiving the request, values are loaded from the first column into an input cache. The values include values, from the first column, from a set of rows. A filter unit is programmed with logic to perform a comparison between a particular value, from the first column of a first row, and values in the first column of a plurality of rows, of the set of rows. Based on the comparison, a predicate result is generated that identifies rows, within the plurality of rows, that have a valued in the first column that matches the particular value. An aggregate value for a second column is generated by aggregating values, from the second column, of each of the rows identified by the predicate result.

Abstract: An apparatus and method for the controlled release of an active agent into an aqueous system for a prolonged duration of time are provided. Some embodiments provide an apparatus for controlling the dissolution of at least one active agent to enable an increase in active agent lifetime.

Abstract: Techniques are described for performing grouping and aggregation operations. In one embodiment, a request is received to aggregate data grouped by a first column. In response to receiving the request, a group value in a row of a first column is mapped to an address. A pointer is stored for a first group at a first location identified by the address. The pointer identifies a second location of a set of aggregation data for the first group. An aggregate value included in the set of aggregation data is updated based on a value in the row of a second column.

Abstract: Systems and methods for tuning an impedance matching network in a step-wise fashion for each state transition are described. By tuning the impedance matching network in a step-wise fashion for each state transition instead of directly achieving an optimal value of a combined variable capacitance for each state, processing of a wafer using the tuned optimal values becomes feasible.

Abstract: Systems and methods for reducing reflected towards a higher frequency radio frequency (RF) generator during a period of a lower frequency RF generator and for using a relationship to reduce reflected power are described. By tuning the higher frequency RF generator during the period of the lower frequency RF generator, precise control of the higher frequency RF generator is achieved for reducing power reflected towards the higher frequency RF generator. Moreover, by using the relationship to reduce the reflected power, time is saved during processing of a wafer.

Abstract: A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.

Abstract: Systems and methods for tuning an impedance matching network in a step-wise fashion are described. By tuning the impedance matching network in a step-wise fashion instead of directly to achieve optimum values of a radio frequency (RF) and a combined variable capacitance, processing of a wafer using the tuned optimal values becomes feasible.

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract: An apparatus and method for the controlled release of an active agent into an aqueous system for a prolonged duration of time are provided. Some embodiments provide an apparatus for controlling the dissolution of at least one active agent to enable an increase in active agent lifetime.

Abstract: An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of semiconductor dies that are arranged in a stack in a vertical direction, which are offset from each other in a horizontal direction to define a stepped terrace at one side of the vertical stack. Moreover, the chip package may be assembled using the assembly component. In particular, the assembly component may include a pair of stepped terraces that approximately mirror the stepped terrace of the chip package and which provide vertical position references for an assembly tool that positions the set of semiconductor dies in the vertical stack during assembly of the chip package.

Abstract: A chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. Moreover, surfaces of each of the semiconductor dies in the stepped terrace include two rows of first pads approximately parallel to edges of the semiconductor dies. Furthermore, the chip package includes a high-bandwidth ramp component, which is positioned approximately parallel to the terrace, and which has a surface that includes second pads arranged in at least two rows of second pads for each of the semiconductor dies. The second pads are electrically and mechanically coupled to the exposed first pads by connectors. Consequently, the electrical contacts in the chip package may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique.

Abstract: Systems, methods, apparatus, and computer program products are provided for managing access of mobile stations to a plurality of wireless carriers. For example, in one embodiment, a central system can provide configuration files to mobile stations. The mobile stations can use the configuration files to access a plurality of different wireless carriers, with the different wireless carriers potentially implementing distinct technologies and communication standards and protocols.