Abstract: An optical component has a bottom part located in an opening defined by a surface, wherein a distance between a sidewall of the bottom part of the optical component and a sidewall of the opening is non-uniform in which a width of a first section of the opening or a first section of the bottom part of the optical component is narrower than a width of a second lower section of the opening or a width of a second lower section of the bottom part of the optical component; and an adhesive is located in the opening between sidewalls.

Abstract: Laser diode packages include a rigid thermally conductive base member that includes a base member surface situated to support at least one laser diode assembly, at least one electrode standoff secured to the base member surface that has at least one electrical lead having a first end and a second end with the first end secured to a lead surface of the electrode standoff, and a lid member that includes a lid portion and a plurality of side portions extending from the lid portion and situated to be secured to the base member so as to define sides of the laser diode package, wherein at least one of the side portions includes a lead aperture situated to receive the second end of the secured electrical lead that is insertable through the lead aperture so that the lid member extends over the base member to enclose the laser diode package.

Abstract: A number of beams that can be coupled into an optical fiber can be increased using emitted beams having greater divergence, thus providing increased beam power. Alternatively, with a fixed number of emitters, total optical power can be maintained with fewer beams in an output beam with a smaller numerical aperture.

Abstract: Apparatus include a first laser diode situated to emit a beam from an exit facet along an optical axis, the beam as emitted having perpendicular fast and slow axes perpendicular to the optical axis, a first fast axis collimator (FAC) optically coupled to the beam as emitted from the exit facet and configured to direct the beam along a redirected beam axis having a non-zero angle with respect to the optical axis of the first laser diode, a second laser diode situated to emit a beam from an exit facet of the second laser diode along an optical axis parallel to the optical axis of the first laser diode and with a slow axis in a common plane with the slow axis of the first laser diode, and a second fast axis collimator (FAC) optically coupled to the beam as emitted from the exit facet of the second laser diode and configured to direct the beam along a redirected beam axis having a non-zero angle with respect to the optical axis of the second laser diode.

Abstract: Laser diode packages include a rigid thermally conductive base member that includes a base member surface situated to support at least one laser diode assembly, at least one electrode standoff secured to the base member surface that has at least one electrical lead having a first end and a second end with the first end secured to a lead surface of the electrode standoff, and a lid member that includes a lid portion and a plurality of side portions extending from the lid portion and situated to be secured to the base member so as to define sides of the laser diode package, wherein at least one of the side portions includes a lead aperture situated to receive the second end of the secured electrical lead that is insertable through the lead aperture so that the lid member extends over the base member to enclose the laser diode package.

Abstract: A number of beams that can be coupled into an optical fiber can be increased using emitted beams having greater divergence, thus providing increased beam power. Alternatively, with a fixed number of emitters, total optical power can be maintained with fewer beams in an output beam with a smaller numerical aperture.

Abstract: Apparatus include a first laser diode situated to emit a beam from an exit facet along an optical axis, the beam as emitted having perpendicular fast and slow axes perpendicular to the optical axis, a first fast axis collimator (FAC) optically coupled to the beam as emitted from the exit facet and configured to direct the beam along a redirected beam axis having a non-zero angle with respect to the optical axis of the first laser diode, a second laser diode situated to emit a beam from an exit facet of the second laser diode along an optical axis parallel to the optical axis of the first laser diode and with a slow axis in a common plane with the slow axis of the first laser diode, and a second fast axis collimator (FAC) optically coupled to the beam as emitted from the exit facet of the second laser diode and configured to direct the beam along a redirected beam axis having a non-zero angle with respect to the optical axis of the second laser diode.

Abstract: Laser diode packages include a rigid thermally conductive base member that includes a base member surface situated to support at least one laser diode assembly, at least one electrode standoff secured to the base member surface that has at least one electrical lead having a first end and a second end with the first end secured to a lead surface of the electrode standoff, and a lid member that includes a lid portion and a plurality of side portions extending from the lid portion and situated to be secured to the base member so as to define sides of the laser diode package, wherein at least one of the side portions includes a lead aperture situated to receive the second end of the secured electrical lead that is insertable through the lead aperture so that the lid member extends over the base member to enclose the laser diode package.

Abstract: A cross-cylinder objective assembly includes a fast axis objective (FAO) situated along an optical axis for focusing an incident laser beam along a fast axis, a slow axis objective (SAO) situated along the optical axis for focusing the incident laser beam along a slow axis, and a lens cell having fast and slow axis objective receiving portions for registering the FAO and SAO at a predetermined spacing along the optical axis.

Abstract: A high-power laser diode assembly uses a greater number of emitters in a laser diode package or uses larger, wider laser diode emitters to produce higher-power laser output. Each assembly design option includes a meniscus slow axis collimator lens having a light entrance surface imparting strong negative lens surface power to diverge an incident beam outwards and a light exit surface imparting even stronger positive lens surface power to collimate the rapidly diverging beam. In one example, a 5 mm focal length meniscus collimator lens, as compared to a standard 12 mm focal length collimator lens, can reduce by 7 mm the physical path from the collimator lens to the laser diode. In another example, a 15 mm focal length meniscus collimator lens with the same back focal length as that of a standard 12 mm collimator facilitates increasing chip-on-submount width from 200 ?m to 250 ?m.

Abstract: A method of tailoring beam characteristics of a laser beam during fabrication of an electronic device. The method includes: providing a substrate comprising one or more layers; adjusting one or more characteristics of a laser beam; and impinging the laser beam having the adjusted beam characteristics on the substrate to carry out at least one process step for fabricating the electronic device. The adjusting of the laser beam comprises: perturbing the laser beam propagating within a first length of fiber to adjust the one or more beam characteristics of the laser beam in the first length of fiber or a second length of fiber or a combination thereof, the second length of fiber having two or more confinement regions; coupling the perturbed laser beam into the second length of fiber; and emitting the laser beam having the adjusted beam characteristics from the second length of fiber.

Abstract: A high-power laser diode assembly uses a greater number of emitters in a laser diode package or uses larger, wider laser diode emitters to produce higher-power laser output. Each assembly design option includes a meniscus slow axis collimator lens having a light entrance surface imparting strong negative lens surface power to diverge an incident beam outwards and a light exit surface imparting even stronger positive lens surface power to collimate the rapidly diverging beam. In one example, a 5 mm focal length meniscus collimator lens, as compared to a standard 12 mm focal length collimator lens, can reduce by 7 mm the physical path from the collimator lens to the laser diode. In another example, a 15 mm focal length meniscus collimator lens with the same back focal length as that of a standard 12 mm collimator facilitates increasing chip-on-submount width from 200 ?m to 250 ?m.

Abstract: A laser diode assembly, comprising a plurality of laser diodes each configured to emit respective ones of a plurality of laser beams along parallel and nonoverlapping optical axes and a first beam offset plate (BOP) configured to receive a first of the laser beams on a first input surface, the first laser beam having a first input optical axis, the first BOP configured to transmit a first output laser beam that has a first vertical offset from the first input optical axis.

Abstract: Beam compressors include separated surfaces having positive and negative optical powers. A surface spacing is selected so that a collimated beam input to the beam compressor is output as a collimated beam. In some examples, beam compressors are situated to compress a laser beam stack that includes beams associated with a plurality of laser diodes. Beam compression ratios are typically selected so that a compressed beam stack focused into an optical waveguide has a numerical aperture corresponding to the numerical aperture of the optical waveguide.

Abstract: A method of spectrally multiplexing diode pump modules to increase brightness includes generating one or more pump beams from respective diode lasers at a first wavelength in a diode laser package, generating one or more pump beams from respective diode lasers at a second wavelength different from the first wavelength in the diode laser package, wavelength combining at least one of the pump beams at the first wavelength with at least one of the pump beams at the second wavelength to form one or more combined pump beams, and receiving the combined pump beams in a pump fiber coupled to the diode laser package. Laser systems can include multi-wavelength pump modules and a gain fiber having a core actively doped so as to have an absorption spectrum corresponding to the multiple wavelength, the gain fiber situated to receive the pump light and to produce an output beam at an output wavelength.

Abstract: Apparatus include a first laser diode situated to emit a beam from an exit facet along an optical axis, the beam as emitted having perpendicular fast and slow axes perpendicular to the optical axis, a first fast axis collimator (FAC) optically coupled to the beam as emitted from the exit facet and configured to direct the beam along a redirected beam axis having a non-zero angle with respect to the optical axis of the first laser diode, a second laser diode situated to emit a beam from an exit facet of the second laser diode along an optical axis parallel to the optical axis of the first laser diode and with a slow axis in a common plane with the slow axis of the first laser diode, and a second fast axis collimator (FAC) optically coupled to the beam as emitted from the exit facet of the second laser diode and configured to direct the beam along a redirected beam axis having a non-zero angle with respect to the optical axis of the second laser diode.

Abstract: Laser diode packages include a rigid thermally conductive base member that includes a base member surface situated to support at least one laser diode assembly, at least one electrode standoff secured to the base member surface that has at least one electrical lead having a first end and a second end with the first end secured to a lead surface of the electrode standoff, and a lid member that includes a lid portion and a plurality of side portions extending from the lid portion and situated to be secured to the base member so as to define sides of the laser diode package, wherein at least one of the side portions includes a lead aperture situated to receive the second end of the secured electrical lead that is insertable through the lead aperture so that the lid member extends over the base member to enclose the laser diode package.

Abstract: A method of spectrally multiplexing diode pump modules to increase brightness includes generating one or more pump beams from respective diode lasers at a first wavelength in a diode laser package, generating one or more pump beams from respective diode lasers at a second wavelength different from the first wavelength in the diode laser package, wavelength combining at least one of the pump beams at the first wavelength with at least one of the pump beams at the second wavelength to form one or more combined pump beams, and receiving the combined pump beams in a pump fiber coupled to the diode laser package. Laser systems can include multi-wavelength pump modules and a gain fiber having a core actively doped so as to have an absorption spectrum corresponding to the multiple wavelength, the gain fiber situated to receive the pump light and to produce an output beam at an output wavelength.

Abstract: Beam compressors include separated surfaces having positive and negative optical powers. A surface spacing is selected so that a collimated beam input to the beam compressor is output as a collimated beam. In some examples, beam compressors are situated to compress a laser beam stack that includes beams associated with a plurality of laser diodes. Beam compression ratios are typically selected so that a compressed beam stack focused into an optical waveguide has a numerical aperture corresponding to the numerical aperture of the optical waveguide.

Abstract: Laser diode packages include a rigid thermally conductive base member that includes a base member surface situated to support at least one laser diode assembly, at least one electrode standoff secured to the base member surface that has at least one electrical lead having a first end and a second end with the first end secured to a lead surface of the electrode standoff, and a lid member that includes a lid portion and a plurality of side portions extending from the lid portion and situated to be secured to the base member so as to define sides of the laser diode package, wherein at least one of the side portions includes a lead aperture situated to receive the second end of the secured electrical lead that is insertable through the lead aperture so that the lid member extends over the base member to enclose the laser diode package.