Abstract: Beam compressors include separated surfaces having positive and negative optical powers. A surface spacing is selected so that a collimated beam input to the beam compressor is output as a collimated beam. In some examples, beam compressors are situated to compress a laser beam stack that includes beams associated with a plurality of laser diodes. Beam compression ratios are typically selected so that a compressed beam stack focused into an optical waveguide has a numerical aperture corresponding to the numerical aperture of the optical waveguide.

Abstract: A high brightness diode laser package includes a plurality of flared laser oscillator waveguides arranged on a stepped surface to emit respective laser beams in one or more emission directions, a plurality of optical components situated to receive the laser beams from the plurality of flared laser oscillator waveguides and to provide the beams in a closely packed relationship, and an optical fiber optically coupled to the closely packed beams for coupling the laser beams out of the diode laser package.

Abstract: A high power diode laser module is provided with improved high temperature handling and reliability, the module including a housing made of a thermally conductive material and providing a module interior extending between a plurality of housing surfaces, at least one diode laser disposed in the module interior and situated to emit a laser beam, one or more optical components disposed in the module interior and coupled to the at least one diode laser so as to change one or more characteristics of the laser beam, a waveguide in optical communication with the module interior and situated to receive the laser beam from the one or more optical components, and an optical absorber disposed in the housing and situated to receive stray light which is associated with the laser beam and which is propagating in the module interior so as to absorb the stray light and conduct heat associated with the stray light away from the module interior and into the housing.

Abstract: A method of spectrally multiplexing diode pump modules to increase brightness includes generating one or more pump beams from respective diode lasers at a first wavelength in a diode laser package, generating one or more pump beams from respective diode lasers at a second wavelength different from the first wavelength in the diode laser package, wavelength combining at least one of the pump beams at the first wavelength with at least one of the pump beams at the second wavelength to form one or more combined pump beams, and receiving the combined pump beams in a pump fiber coupled to the diode laser package. Laser systems can include multi-wavelength pump modules and a gain fiber having a core actively doped so as to have an absorption spectrum corresponding to the multiple wavelength, the gain fiber situated to receive the pump light and to produce an output beam at an output wavelength.

Abstract: A laser diode assembly, comprising a plurality of laser diodes each configured to emit respective ones of a plurality of laser beams along parallel and nonoverlapping optical axes and a first beam offset plate (BOP) configured to receive a first of the laser beams on a first input surface, the first laser beam having a first input optical axis, the first BOP configured to transmit a first output laser beam that has a first vertical offset from the first input optical axis.

Abstract: A high brightness diode laser package includes a plurality of flared laser oscillator waveguides arranged on a stepped surface to emit respective laser beams in one or more emission directions, a plurality of optical components situated to receive the laser beams from the plurality of flared laser oscillator waveguides and to provide the beams in a closely packed relationship, and an optical fiber optically coupled to the closely packed beams for coupling the laser beams out of the diode laser package.

Abstract: A number of beams that can be coupled into an optical fiber can be increased using emitted beams having greater divergence, thus providing increased beam power. Alternatively, with a fixed number of emitters, total optical power can be maintained with fewer beams in an output beam with a smaller numerical aperture.

Abstract: Laser diode packages include a rigid thermally conductive base member that includes a base member surface situated to support at least one laser diode assembly, at least one electrode standoff secured to the base member surface that has at least one electrical lead having a first end and a second end with the first end secured to a lead surface of the electrode standoff, and a lid member that includes a lid portion and a plurality of side portions extending from the lid portion and situated to be secured to the base member so as to define sides of the laser diode package, wherein at least one of the side portions includes a lead aperture situated to receive the second end of the secured electrical lead that is insertable through the lead aperture so that the lid member extends over the base member to enclose the laser diode package.

Abstract: A high brightness diode laser package includes a plurality of flared laser oscillator waveguides arranged on a stepped surface to emit respective laser beams in one or more emission directions, a plurality of optical components situated to receive the laser beams from the plurality of flared laser oscillator waveguides and to provide the beams in a closely packed relationship, and an optical fiber optically coupled to the closely packed beams for coupling the laser beams out of the diode laser package.

Abstract: A method of spectrally multiplexing diode pump modules to increase brightness includes generating one or more pump beams from respective diode lasers at a first wavelength in a diode laser package, generating one or more pump beams from respective diode lasers at a second wavelength different from the first wavelength in the diode laser package, wavelength combining at least one of the pump beams at the first wavelength with at least one of the pump beams at the second wavelength to form one or more combined pump beams, and receiving the combined pump beams in a pump fiber coupled to the diode laser package. Laser systems can include multi-wavelength pump modules and a gain fiber having a core actively doped so as to have an absorption spectrum corresponding to the multiple wavelength, the gain fiber situated to receive the pump light and to produce an output beam at an output wavelength.

Abstract: Beam compressors include separated surfaces having positive and negative optical powers. A surface spacing is selected so that a collimated beam input to the beam compressor is output as a collimated beam. In some examples, beam compressors are situated to compress a laser beam stack that includes beams associated with a plurality of laser diodes. Beam compression ratios are typically selected so that a compressed beam stack focused into an optical waveguide has a numerical aperture corresponding to the numerical aperture of the optical waveguide.

Abstract: An apparatus includes at least one multijunction diode laser situated to emit a plurality of beams along respective mutually parallel propagation axes, each beam having an associated mutually parallel slow axes and associated collinear fast axes, a fast axis collimator situated to receive and collimate the plurality of beams along the corresponding fast axes so as to produce corresponding fast axis collimated beams that propagate along associated non-parallel axes, and a reflector situated to receive the plurality of fast axis collimated beams and to reflect the beams so that the reflected fast axis collimated beams propagate along substantially parallel axes.

Abstract: A high brightness diode laser package includes a plurality of flared laser oscillator waveguides arranged on a stepped surface to emit respective laser beams in one or more emission directions, a plurality of optical components situated to receive the laser beams from the plurality of flared laser oscillator waveguides and to provide the beams in a closely packed relationship, and an optical fiber optically coupled to the closely packed beams for coupling the laser beams out of the diode laser package.

Abstract: A cross-cylinder objective assembly includes a fast axis objective (FAO) situated along an optical axis for focusing an incident laser beam along a fast axis, a slow axis objective (SAO) situated along the optical axis for focusing the incident laser beam along a slow axis, and a lens cell having fast and slow axis objective receiving portions for registering the FAO and SAO at a predetermined spacing along the optical axis.

Abstract: A high power diode laser module is provided with improved high temperature handling and reliability, the module including a housing made of a thermally conductive material and providing a module interior extending between a plurality of housing surfaces, at least one diode laser disposed in the module interior and situated to emit a laser beam, one or more optical components disposed in the module interior and coupled to the at least one diode laser so as to change one or more characteristics of the laser beam, a waveguide in optical communication with the module interior and situated to receive the laser beam from the one or more optical components, and an optical absorber disposed in the housing and situated to receive stray light which is associated with the laser beam and which is propagating in the module interior so as to absorb the stray light and conduct heat associated with the stray light away from the module interior and into the housing.

Abstract: A high brightness diode laser package includes a plurality of flared laser oscillator waveguides arranged on a stepped surface to emit respective laser beams in one or more emission directions, a plurality of optical components situated to receive the laser beams from the plurality of flared laser oscillator waveguides and to provide the beams in a closely packed relationship, and an optical fiber optically coupled to the closely packed beams for coupling the laser beams out of the diode laser package.

Abstract: A high brightness diode laser package includes a plurality of flared laser oscillator waveguides arranged on a stepped surface to emit respective laser beams in one or more emission directions, a plurality of optical components situated to receive the laser beams from the plurality of flared laser oscillator waveguides and to provide the beams in a closely packed relationship, and an optical fiber optically coupled to the closely packed beams for coupling the laser beams out of the diode laser package.

Abstract: A high brightness diode laser package includes a plurality of flared laser oscillator waveguides arranged on a stepped surface to emit respective laser beams in one or more emission directions, a plurality of optical components situated to receive the laser beams from the plurality of flared laser oscillator waveguides and to provide the beams in a closely packed relationship, and an optical fiber optically coupled to the closely packed beams for coupling the laser beams out of the diode laser package.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links.

Abstract: A system determines relative positions of a semiconductor substrate and a plurality of laser beam spots on or within the semiconductor substrate in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The system comprises a laser source, first and second laser beam propagation paths, first and second reflection sensors, and a processor. The laser source produces at least the first and second laser beams, which propagate toward the substrate along the first and second propagation paths, respectively, which have respective first and second axes that intersects the substrate at respective first and second spots. The reflection sensors are positioned to detect reflection of the spots, as the spots moves relative to the substrate, thereby generating reflection signals. The processor is configured to determine, based on the reflection signals, positions of the spots on or within the substrate.