Abstract: Provided herein are dendrimer-targeting agent conjugates comprising a dendrimer, the dendrimer comprising a core unit and lysine or lysine analogue building units, a HER2 targeting agent which is a peptidic moiety having a molecular weight of up to about 80 kDa and comprising an antigen-binding site, which is covalently linked by a spacer group, and a therapeutic agent which is covalently linked to a surface building unit of the dendrimer. Also provided herein are compositions comprising the conjugates, and therapeutic methods using the conjugates, particularly for treating cancer.

Abstract: A wafer shape metrology system includes a wafer shape metrology sub-system configured to perform one or more stress-free shape measurements on a first wafer, a second wafer, and a post-bonding pair of the first and second wafers. The wafer shape metrology system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller is configured to receive stress-free shape measurements from the wafer shape sub-system; predict overlay between one or more features on the first wafer and the second wafer based on the stress-free shape measurements of the first wafer, the second wafer, and the post-bonding pair of the first wafer and the second wafer; and provide a feedback adjustment to one or more process tools based on the predicted overlay. Additionally, feedforward and feedback adjustments may be provided to one or more process tools.

Abstract: A shape map can be extracted for a workpiece, such as a semiconductor wafer. A calibration map of the workpiece can be extracted from this shape map to generate a calibrated shape map. In-plane distortion matching can be performed using the calibrated shape map. The in-plane distortion matching can be performed between two metrology tools.

Abstract: The present invention relates to a system and method of facilitating the borrowing or hiring of equipment. including receiving details relating to one or more potential borrowers or hirers of equipment (including at least a location of each of the one or more potential borrowers or hirers), receiving details regarding each piece of equipment available for loan or hire (including information relating to the entity responsible for providing equipment for loan or hire including a pickup location of the equipment, a description relating to the equipment including a description regarding the condition of the equipment, and an image of the equipment), storing the equipment details in an equipment database including a data structure.

Abstract: A scanning acoustic microscope system may include one or more measurement assemblies, wherein a respective one of the measurement assemblies comprises a transducer and a receiver, wherein the receiver of at least one of the one or more measurement assemblies comprises a multipixel sensor to simultaneously generate sensor data for multiple locations associated with a sample. The tool may include a stage configured to scan the sample for measurement by the one or more measurement assemblies. The tool may include a controller communicatively coupled to the one or more measurement assemblies, wherein the controller includes one or more processors configured to execute program instructions causing the processors to implement a metrology recipe by: receiving the sensor data from the one or more measurement assemblies while the sample is scanned by the stage; and generating one or more measurements for the sample based on the sensor data.

Abstract: Compliance inspection system and method. The compliance inspection system includes an interface for at least communicating an inspection assignment to an inspector, wherein the inspection assignment includes an inspection location indicting where an inspection is to occur and for receiving location data related to the inspector. The compliance inspection system also includes a processor executing instructions stored on a memory to analyze the received location data related to the inspector, verify the inspector is at the inspection location based on the analysis of the received location data, and receive inspection documentation related to the inspection from the inspector.

Abstract: A wafer shape metrology system includes a wafer shape metrology sub-system configured to perform one or more stress-free shape measurements on a first wafer, a second wafer, and a post-bonding pair of the first and second wafers. The wafer shape metrology system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller is configured to receive stress-free shape measurements from the wafer shape sub-system; predict overlay between one or more features on the first wafer and the second wafer based on the stress-free shape measurements of the first wafer, the second wafer, and the post-bonding pair of the first wafer and the second wafer; and provide a feedback adjustment to one or more process tools based on the predicted overlay. Additionally, feedforward and feedback adjustments may be provided to one or more process tools.

Abstract: Compliance inspection system and method. The compliance inspection system includes an interface for at least communicating an inspection assignment to an inspector, wherein the inspection assignment includes an inspection location indicting where an inspection is to occur and for receiving location data related to the inspector. The compliance inspection system also includes a processor executing instructions stored on a memory to analyze the received location data related to the inspector, verify the inspector is at the inspection location based on the analysis of the received location data, and receive inspection documentation related to the inspection from the inspector.

Abstract: A macromolecule includes i) a dendrimer comprising a core and at least one generation of building units, the outermost generation of building units having surface amino groups wherein at least two different terminal groups are covalently attached to the surface amino groups of the dendrimer, ii) a first terminal group which is a residue of a pharmaceutically active agent comprising a hydroxyl group, and iii) a second terminal group which is a pharmacokinetic modifying agent. The pharmaceutically active agent is cabazitaxel. The first terminal group is covalently attached to the surface amino group of the dendrimer through a diacid linker, the diacid linker comprising an alkyl chain interrupted by one or more oxygen, sulfur or nitrogen atoms, or a pharmaceutically acceptable salt thereof.

Abstract: An aspect includes a computer-implemented method that predicts a proposed region of interest in an image from a video of a surgical procedure based on one or more contextual targets. An image adjustment is synthesized based on the proposed region of interest and the image. A modified visualization of the surgical procedure is generated by incorporating the image adjustment in a real-time output of the video of the surgical procedure. The video of the surgical procedure is displayed with the modified visualization.

Abstract: Provided herein is dendrimer-targeting agent conjugate comprising: (a) a dendrimer comprising i) a core unit (C); and ii) building units (BU), wherein the dendrimer has from two to six generations of building units; and wherein the core unit is covalently attached to at least two building units; and the dendrimer further comprising: b) a targeting agent which is covalently linked to the dendrimer by a spacer group; c) one or more first terminal groups attached to an outermost building unit of the dendrimer, wherein the first terminal group comprises a complexation group for complexing a radionuclide; and d) one or more second terminal groups attached to an outermost building unit of the dendrimer, wherein the second terminal group comprises a pharmacokinetic-modifying moiety, or a salt thereof.

Abstract: Disclosed are dendrimers of formula (I): and pharmaceutically acceptable salts thereof. Also disclosed are pharmaceutical compositions comprising the dendrimer of formula (I) and methods of using the same for treating cancer.

Abstract: A wafer shape metrology system includes a wafer shape metrology sub-system configured to perform one or more stress-free shape measurements on a first wafer, a second wafer, and a post-bonding pair of the first and second wafers. The wafer shape metrology system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller is configured to receive stress-free shape measurements from the wafer shape sub-system; predict overlay between one or more features on the first wafer and the second wafer based on the stress-free shape measurements of the first wafer, the second wafer, and the post-bonding pair of the first wafer and the second wafer; and provide a feedback adjustment to one or more process tools based on the predicted overlay. Additionally, feedforward and feedback adjustments may be provided to one or more process tools.

Abstract: The invention generally relates to products for use in the treatment and/or prevention of Pulmonary Arterial Hypertension (PAH). More specifically, the invention relates to translocator protein (TSPO) binding members which treat or prevent pulmonary endothelial cell dysfunction, and the use of such TSPO binding members for use in the treatment and/or prevention of PAH [FIG. 1].

Abstract: A wafer shape metrology system includes a wafer shape metrology sub-system configured to perform one or more stress-free shape measurements on a first wafer, a second wafer, and a post-bonding pair of the first and second wafers. The wafer shape metrology system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller is configured to receive stress-free shape measurements from the wafer shape sub-system; predict overlay between one or more features on the first wafer and the second wafer based on the stress-free shape measurements of the first wafer, the second wafer, and the post-bonding pair of the first wafer and the second wafer; and provide a feedback adjustment to one or more process tools based on the predicted overlay. Additionally, feedforward and feedback adjustments may be provided to one or more process tools.

Abstract: Disclosed are dendrimers of formula (I): and pharmaceutically acceptable salts thereof. Also disclosed are pharmaceutical compositions comprising the dendrimer of formula (I) and methods of using the same for treating cancer.

Abstract: A connection point assembly for a patient lifter spreader bar has a hook member defining a throat having a mouth, the mouth being formed between a distal end of the hook member and an adjacent base portion and a latch assembly operably coupled to the hook member at the mouth and comprising a latch configurable between an open position wherein the latch does not obstruct the mouth and a closed position wherein the latch obstructs the mouth. The connection point assembly comprises a visual indicator indicative of the open position and the closed position.

Abstract: Provided herein are dendrimer-targeting agent conjugates comprising a dendrimer, the dendrimer comprising a core unit and lysine or lysine analogue building units, a HER2 targeting agent which is a peptidic moiety having a molecular weight of up to about 80 kDa and comprising an antigen-binding site, which is covalently linked by a spacer group, and a therapeutic agent which is covalently linked to a surface building unit of the dendrimer. Also provided herein are compositions comprising the conjugates, and therapeutic methods using the conjugates, particularly for treating cancer.

Abstract: Disclosed are methods of treating cancer in a subject, comprising subcutaneously administering to the subject an effective amount of a dendrimer of formula (I): and pharmaceutically acceptable salts thereof.

Abstract: A wafer shape metrology system includes a wafer shape metrology sub-system configured to perform one or more stress-free shape measurements on a first wafer, a second wafer, and a post-bonding pair of the first and second wafers. The wafer shape metrology system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller is configured to receive stress-free shape measurements from the wafer shape sub-system; predict overlay between one or more features on the first wafer and the second wafer based on the stress-free shape measurements of the first wafer, the second wafer, and the post-bonding pair of the first wafer and the second wafer; and provide a feedback adjustment to one or more process tools based on the predicted overlay. Additionally, feedforward and feedback adjustments may be provided to one or more process tools.