Patents by Inventor David Shau-Chew Wang
David Shau-Chew Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8446245Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volume resistivity between 0.07 ?-cm and 0.32 ?-cm. The PTC material layer includes a crystalline polymer, a conductive ceramic carbide filler of a particle size between 0.1 ?m and 50 ?m and a volume resistivity less than 0.1 ?-cm, and a carbon black filler. The weight ratio of the carbon black filler to the conductive ceramic carbide filler is between 1:90 and 1:4. The conductive ceramic carbide filler and the carbon black filler are dispersed in the crystalline polymer. The resistance ratio R100/Ri is between 3 and 20.Type: GrantFiled: September 19, 2011Date of Patent: May 21, 2013Assignee: Polytronics Technology Corp.Inventors: David Shau Chew Wang, Yi An Sha, Kuo Chang Lo, Tai Kuang Hei
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Patent number: 8432247Abstract: An over-current protection device includes a first electrode layer, a second electrode layer, and a resistance material disposed between the first and second electrode layers. The first electrode layer includes a first groove pattern formed on and through the first electrode layer. The first groove pattern is configured to separate the first electrode layer into a plurality of connected regions. The second electrode layer includes a second groove pattern formed on and through the second electrode layer. The second groove pattern is configured to separate the second electrode layer into a plurality of connected regions. The first and second groove patterns are further configured to be formed in an interlaced manner that when the first and second electrode layers are overlapped, the first and second groove patterns form a plurality of independent regions, which divide the resistance material into a plurality of electrically isolated and parallel connected units.Type: GrantFiled: September 19, 2011Date of Patent: April 30, 2013Assignee: Polytronics Technology Corp.Inventors: David Shau Chew Wang, Chun Teng Tseng
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Patent number: 8421584Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.Type: GrantFiled: January 17, 2012Date of Patent: April 16, 2013Assignee: Polytronics Technology Corp.Inventors: Tong Cheng Tsai, Yi An Sha, David Shau Chew Wang, Fu Hua Chu
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Publication number: 20130070380Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volume resistivity between 0.07 ?-cm and 0.32 ?-cm. The PTC material layer includes a crystalline polymer, a conductive ceramic carbide filler of a particle size between 0.1 ?m and 50 ?m and a volume resistivity less than 0.1 ?-cm, and a carbon black filler. The weight ratio of the carbon black filler to the conductive ceramic carbide filler is between 1:90 and 1:4. The conductive ceramic carbide filler and the carbon black filler are dispersed in the crystalline polymer. The resistance ratio R100/Ri is between 3 and 20.Type: ApplicationFiled: September 19, 2011Publication date: March 21, 2013Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: David Shau Chew WANG, Yi An Sha, Kuo Chang Lo, Tai Kuang Hei
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Publication number: 20130070381Abstract: An over-current protection device includes a first substrate, a second substrate, a first grating electrode, a second grating electrode and a positive temperature coefficient (PTC) material layer. The first grating electrode and the second grating electrode are formed on the first substrate and are interlaced and spaced on a same plane. The PTC material layer is formed on the first substrate, the first grating electrode and the second grating electrode, and between the first grating electrode and the second grating electrode. In an embodiment, the first grating electrode and the second grating electrode serve as a current input port and a current output port, respectively.Type: ApplicationFiled: September 21, 2011Publication date: March 21, 2013Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Yi An SHA, David Shau Chew Wang
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Publication number: 20130062045Abstract: A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK.Type: ApplicationFiled: September 14, 2011Publication date: March 14, 2013Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: FU HUA CHU, DAVID SHAU CHEW WANG, YI AN SHA, KUO HSUN CHEN
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Publication number: 20130021704Abstract: An over-current and over-temperature protection device includes a first conductive member, a second conductive member, a resistive device, at least one current input electrode and at least two current output electrodes. The first conductive member has a current input portion and a first insulative portion restricting current to only input through the current input portion, and the second conductive member has two or more current output portions and a second insulative portion restricting current to only output through the current output portions, in which the current output portions are electrically isolated by the second insulative portion. The resistive device is laminated between the first conductive member and the second conductive member. The current input electrode is electrically connected to the current input portion, and current output electrodes are electrically connected to the current output portions individually.Type: ApplicationFiled: July 20, 2011Publication date: January 24, 2013Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Chun Teng TSENG, David Shau Chew Wang
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Publication number: 20130021703Abstract: An over-current protection device includes a first conductive member, a second conductive member, a resistive device and a temperature sensing switch. The first conductive member includes a first electrode foil and a second electrode foil those are formed on a same plane. The resistive device is laminated between the first conductive member and the second conductive member and exhibits positive temperature coefficient or negative temperature coefficient behavior. The temperature sensing switch can switch the first electrode foil and the second electrode foil between electrically conductive status and current-restriction status, e.g., open circuit, according to temperature variation. The threshold temperature of the temperature sensing switch is lower than the trip temperature of the resistive device.Type: ApplicationFiled: July 20, 2011Publication date: January 24, 2013Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: David Shau Chew Wang, Chun Teng Tseng
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Publication number: 20120182118Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.Type: ApplicationFiled: January 17, 2012Publication date: July 19, 2012Applicant: Polytronics Technology Corp.Inventors: Tong Cheng Tsai, Yi An Sha, David Shau Chew Wang, Fu Hua Chu
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Patent number: 8198642Abstract: A light emitting diode (LED) apparatus with temperature control and current regulation functions is provided. The LED apparatus includes at least one LED die and at least one temperature control and current regulation (TCCR) device. The TCCR device is electrically connected between the LED die and a power source, and is placed within an effective temperature sensing distance of the LED die, so as to sense temperature changes of the LED die. The resistance of the TCCR device is proportional to the temperature in a range of 25° C. to 85° C., i.e., the resistance increases with temperature. Moreover, the resistance difference of the TCCR device between 50° C. and 80° C. is greater than or equal to 100 m?.Type: GrantFiled: January 19, 2007Date of Patent: June 12, 2012Assignee: Polytronics Technology Corp.Inventors: David Shau Chew Wang, Jyh Ming Yu
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Publication number: 20120075762Abstract: An over-current protection device includes a first electrode layer, a second electrode layer, and a resistance material disposed between the first and second electrode layers. The first electrode layer includes a first groove pattern formed on and through the first electrode layer. The first groove pattern is configured to separate the first electrode layer into a plurality of connected regions. The second electrode layer includes a second groove pattern formed on and through the second electrode layer. The second groove pattern is configured to separate the second electrode layer into a plurality of connected regions. The first and second groove patterns are further configured to be formed in an interlaced manner that when the first and second electrode layers are overlapped, the first and second groove patterns form a plurality of independent regions, which divide the resistance material into a plurality of electrically isolated and parallel connected units.Type: ApplicationFiled: September 19, 2011Publication date: March 29, 2012Applicant: Polytronics Technology Corp.Inventors: David Shau Chew Wang, Chun Teng Tseng
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Publication number: 20110217462Abstract: A method for manufacturing an insulated heat conductive substrate comprises the steps of: performing hydrolysis and condensation of at least one thermally conductive ceramic powder to prepare at least one modified thermally conductive ceramic powder, which comprises a plurality of modified powder particles, each grafted with an organic material; mixing the at least one modified thermally conductive ceramic powder with two substantially mutually soluble polymers to achieve a uniform mixture; blending the uniform mixture with a curing agent to obtain a melt extrudable dielectric curable material; extruding the dielectric curable material through a slit to form a sheet-like substrate; and disposing a first film and a second film on two side surfaces of the substrate to obtain an insulated heat conductive substrate, wherein each of the first and second films can be either a metal foil or a release film.Type: ApplicationFiled: May 12, 2011Publication date: September 8, 2011Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: DAVID SHAU CHEW WANG, YI AN SHA, KUO HSUN CHEN
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Publication number: 20110214852Abstract: A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.Type: ApplicationFiled: May 17, 2011Publication date: September 8, 2011Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: DAVID SHAU CHEW WANG, YI AN SHA, KUO HSUN CHEN
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Patent number: 8003216Abstract: A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.Type: GrantFiled: January 30, 2007Date of Patent: August 23, 2011Assignee: Polytronics Technology CorporationInventors: David Shau Chew Wang, En Tien Yang, Jyh Ming Yu, Fu Hua Chu
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Patent number: 7892392Abstract: A method for manufacturing an over-current protection device comprises a step of providing at least one current sensitive device and a step of pressing. The current sensitive device comprises a first electrode foil, a second electrode foil and a PTC conductive layer physically laminated between the first and second electrode foils. The pressing step is to press the current sensitive device at a predetermined temperature, thereby generating at least one overflow portion at sides of the PTC conductive layer to form the over-current protection device. The predetermined temperature is higher than the softening temperature of the PTC conductive layer. The over-current protection devices manufactured according to the present invention have superior resistance distribution.Type: GrantFiled: March 3, 2008Date of Patent: February 22, 2011Assignee: Polytronics Technology CorporationInventors: David Shau Chew Wang, Jyh Ming Yu
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Patent number: 7852192Abstract: The over-current protection device of the present invention can be used for over-current protection to PCM. The over-current protection device comprises a PTC device, at least one insulation layer; at least one electrode layer and at least one conductive channel. The insulation layer is placed on a surface of the PTC device, and the electrode layer is formed on the insulation layer afterwards. As a result, the insulation layer is between the electrode layer and the PTC device. The electrode layer serves as a surface of the over-current protection device. The conductive channel electrically connects the PTC device and the electrode layer. In an embodiment, the conductive channel is a blind hole penetrating through the electrode layer and the insulation layer and ending at the surface of the PTC device, and the surface of the blind hole is coated with a conductive layer to electrically connect the PTC device and the electrode layer.Type: GrantFiled: October 25, 2007Date of Patent: December 14, 2010Assignee: Polytronics Technology CorporationInventors: Ching Han Yu, David Shau Chew Wang, Pao Hsuan Chen
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Patent number: 7708912Abstract: A variable impedance composition according to one aspect of the present invention comprises a high electro-magnetic permeability powder in an amount from 10% to 85% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 10% to 30% of the weight of the variable impedance composition. The incorporation of high electro-magnetic permeability powder including carbonyl metal, such as carbonyl iron or carbonyl nickel, in the variable impedance composition can not only suppress the overstress voltage, but also dampen the transient current. In contrast to the conventional electrostatic discharge (ESD) device, the relatively high electro-magnetic permeability carbonyl metal powder can reduce arcing as well as lower the trigger voltage of the device. The high electro-magnetic permeability characteristics can also absorb the undesirable electro-magnetic radiation that causes corruption of signal and loss of data.Type: GrantFiled: June 16, 2008Date of Patent: May 4, 2010Assignee: Polytronics Technology CorporationInventors: Pao Hsuan Chen, David Shau Chew Wang, Tong Cheng Tsai
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Publication number: 20090309074Abstract: A variable impedance composition according to one aspect of the present invention comprises a high electro-magnetic permeability powder in an amount from 10% to 85% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 10% to 30% of the weight of the variable impedance composition. The incorporation of high electro-magnetic permeability powder including carbonyl metal, such as carbonyl iron or carbonyl nickel, in the variable impedance composition can not only suppress the overstress voltage, but also dampen the transient current. In contrast to the conventional electrostatic discharge (ESD) device, the relatively high electro-magnetic permeability carbonyl metal powder can reduce arcing as well as lower the trigger voltage of the device. The high electro-magnetic permeability characteristics can also absorb the undesirable electro-magnetic radiation that causes corruption of signal and loss of data.Type: ApplicationFiled: June 16, 2008Publication date: December 17, 2009Applicant: POLYTRONICS TECHNOLOGY CORPORATIONInventors: Pao Hsuan Chen, David Shau Chew Wang, Tong Cheng Tsai
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Publication number: 20090231763Abstract: An over-voltage protection device comprises a substrate having a first surface and a second surface, a first nonrectangular conductor having a first protrusion positioned on the first surface of the substrate, a second nonrectangular conductor having a second protrusion positioned on the first surface of substrate, at least one alignment block positioned on the second surface, and a variable impedance material positioned between the first protrusion and the second protrusion. Preferably, the second protrusion faces the first protrusion to form an arcing path from the first protrusion to the second protrusion.Type: ApplicationFiled: March 12, 2008Publication date: September 17, 2009Applicant: POLYTRONICS TECHNOLOGY CORPORATIONInventors: Pao Hsuan Chen, David Shau Chew Wang, Ching Han Yu, Tong Cheng Tsai
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Publication number: 20090224213Abstract: A variable impedance composition according to this aspect of the present invention comprises a conductive powder in an amount from 10% to 30% of the weight of the variable impedance composition, a semi-conductive power in an amount from 30% to 90% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 3% to 50% of the weight of the variable impedance composition. According to one embodiment of the present invention, the variable impedance material presents a high resistance at a low applied voltage and a low resistance at a high applied voltage. As the variable impedance material is positioned in a gap between two conductors of an over-voltage protection device, the over-voltage protection device as a whole presents a high resistance to a low voltage applied across the gap and a low resistance to a high voltage applied across the gap.Type: ApplicationFiled: March 6, 2008Publication date: September 10, 2009Applicant: POLYTRONICS TECHNOLOGY CORPORATIONInventors: Pao Hsuan Chen, David Shau Chew Wang, Ching Han Yu, Tong Cheng Tsai