LIQUID-COOLED RACK WITH OPTIMIZED RACK HEAT EXCHANGER DESIGN FOR NON-UNIFORM POWER DISSIPATION
A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server
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Modern rack-mount server systems include single and multiple liquid heat exchangers that cool air through a rack-mount server system to enable the deployment of high density electronic modules (“blades”) within the system. However, individual portions of blades within a rack-mount server system may not dissipate heat evenly. Thus, the heat exchangers must be designed to cool based on the worst case portion of an individual blade. Because various portions of a blade do not dissipate evenly, the heat exchangers may overcool lower power portions of an individual blade, resulting in increased utility costs for the entire server system.
SUMMARY OF THE INVENTIONA cooling system for a rack-mount server including at least one blade and a system enclosure is disclosed herein. The cooling system includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server.
Specific details of the present disclosure will now be described in detail with reference to the accompanying figures.
Referring now to
Referring now to
In order to minimize the total power, the structure of the cooling system is optimized to increase cooling capacity through the Part B 213 of the blade 207, because Part B 213 dissipates more heat than Part A 211. Alternatively, Part B 213 may simply have a higher heat density in terms of power per unit area than Part A 211. In this case, it may also be advantageous to direct cooling to the denser heat production. HEX A 215 is designed to correspond to Part A 211 and includes a lower density arrangement of fins, and HEX B 225 is designed to correspond to Part B 213 and includes a higher density arrangement of fins.
However, the higher density of fins in Part 213 may decrease the overall air flow over HEX B 225. Accordingly, the fans 209 are also divided into Group A 219 and Group B 229. In order to control air flow through each of the heat exchangers, Group A 219 and Group B 229 have different fan densities. For example,
Referring now to
Referring now to
Though the exemplary embodiments discussed above have been restricted to the possibility of two different areas of heat density within a blade, the invention is not so limited. For example, a blade may have any number of areas with different heat densities, and the number of groups of fans and sections of fins may be scaled appropriately.
Embodiments of the cooling system disclosed herein may exhibit one or more of the following advantages. The cooling system disclosed herein may reduce costs for cooling a rack-mount server by reducing the fan power required for cooling the rack-mount server. The cooling system disclosed herein may also allow for cooling to be distributed according to the heat dissipation of the blades in a rack-mount server.
While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that other embodiments may be devised which do not depart from the scope of the invention as disclosed herein. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims
1. A cooling system for a rack-mount server comprising at least one blade and a system enclosure, comprising:
- a liquid cooling line;
- at least one heat exchanger connected to the liquid cooling line and comprising a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections; and
- a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server;
- wherein the plurality of fans are divided into one or more groups corresponding to the one or more sections of the plurality of fins, and
- wherein the fan density of the plurality of fans varies over the one or more groups based on the fin density of the section of the plurality of fins to which the group corresponds.
2. The cooling system of claim 1, wherein the liquid cooling line is a tube that runs through the plurality of fins.
3. The cooling system of claim 1, wherein the liquid cooling line comprises one or more flattened tube disposed around the plurality of fins.
4. The cooling system of claim 1, wherein the at least one heat exchanger is a tube-fin heat exchanger.
5. The cooling system of claim 1, wherein relative positions within the rack-mount server of each of the sections of the plurality of fins depend on the heat dissipation characteristics of the at least one blade.
6. The cooling system of claim 1, wherein the fin densities of each of the sections of the plurality of fins depend on the heat dissipation characteristics of the at least one blade.
7. The cooling system of claim 6, wherein the fin density of a section of the plurality of fins corresponding to a higher power portion of the blade is higher than the fin density of a section of the plurality of fins corresponding to a lower power portion of the blade.
8. (canceled)
9. (canceled)
10. The cooling system of claim 1, wherein the fan densities of each of the groups of the plurality of fans depend on the heat dissipation characteristics of the at least one blade.
11. The cooling system of claim 10, wherein the fan density of a group of the plurality of fans corresponding to a higher power portion of the blade is higher than the fan density of a group of the plurality of fans corresponding to a lower power portion of the blade.
12. The cooling system of claim 1, wherein the total cubic air flow rate of each group of the plurality of fans through the corresponding section of fins of the at least one heat exchanger is substantially constant.
13. The cooling system of claim 1, wherein the fan density of a group of the plurality of fans corresponding to a section of higher fin density is higher than the fan density of a group of the plurality of fans corresponding to a section of lower fin density.
Type: Application
Filed: Aug 6, 2008
Publication Date: Feb 11, 2010
Applicant: SUN MICROSYSTEMS, INC. (Santa Clara, CA)
Inventors: David W. Copeland (Mountain View, CA), Marlin R. Vogel (Fremont, CA), Andrew R. Masto (San Jose, CA)
Application Number: 12/187,190