Patents by Inventor David Wei Wang

David Wei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080251948
    Abstract: A chip package structure including a first substrate, a second substrate, a plurality of bumps, a first B-staged adhesive layer and a second B-staged adhesive layer is provided. The first substrate has a plurality of first bonding pads. The second substrate has a plurality of second bonding pads, and the second substrate is disposed above the first substrate. The bumps are disposed between the first substrate and the second substrate, wherein each of the first bonding pads is respectively electrically connected to one of the second bonding pads via one of the bumps. The first B-staged adhesive layer is adhered on the first substrate. The second B-staged adhesive layer is adhered between the first B-staged adhesive layer and the second substrate, wherein the first B-staged adhesive layer and the second B-staged adhesive layer encapsulate the bumps.
    Type: Application
    Filed: June 27, 2008
    Publication date: October 16, 2008
    Applicants: CHIPMOS TECHNOLOGIES INC., CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    Inventors: Geng-Shin Shen, David Wei Wang
  • Patent number: 7363974
    Abstract: A technique that is usable with a subterranean well includes communicating a slurry through a shunt flow path and operating a control device to isolate slurry from being communicated to an ancillary flow path. The system may include a shunt tube and a diverter. The shunt tube is adapted to communicate a slurry flow within the well to form a gravel pack. The diverter is located in a passageway of the shunt tube to divert at least part of the flow. A slurry may be communicated through the shunt flow path, and a control device may be operated to isolate the slurry from being communicated to the ancillary flow path.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: April 29, 2008
    Assignee: Schlumberger Technology Corporation
    Inventors: David Wei Wang, Bruno Khan, Michael D. Langlais
  • Patent number: 7243715
    Abstract: The present invention provides for a design and method of manufacture for a mesh-type screen to be used in subsurface well completions to prevent the production of sand.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: July 17, 2007
    Assignee: Schlumberger Technology Corporation
    Inventors: David Wei Wang, Colin J. Price-Smith
  • Publication number: 20070104124
    Abstract: Certain embodiments of a cable sense mode for intelligent power saving in the absence of a link pulse may include detecting an energy level of an Ethernet link. The Ethernet link may couple a network adapter chip to a network. The power supplied to the network adapter chip may be adjusted based on the detected energy level. Power may be supplied to the network adapter chip if the detected energy level of the Ethernet link is greater than or equal to a particular energy level. Power may be reduced to the network adapter chip if the detected energy level of the Ethernet link is less than a particular energy level. An output signal and/or an interrupt signal may be generated that indicates a change in the detected energy level of the Ethernet link. Power may be provided to the circuitry that generates the output signal and the interrupt signal.
    Type: Application
    Filed: November 8, 2005
    Publication date: May 10, 2007
    Inventors: Jonathan Lee, Gregory Youngblood, David (Wei) Wang
  • Patent number: 7147054
    Abstract: A technique that is usable with a subterranean well includes communicating a slurry through a shunt flow path and operating a control device to isolate slurry from being communicated to an ancillary flow path. The system may include a shunt tube and a diverter. The shunt tube is adapted to communicate a slurry flow within the well to form a gravel pack. The diverter is located in a passageway of the shunt tube to divert at least part of the flow. A slurry may be communicated through the shunt flow path, and a control device may be operated to isolate the slurry from being communicated to the ancillary flow path.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: December 12, 2006
    Assignee: Schlumberger Technology Corporation
    Inventors: David Wei Wang, Bruno Khan, Michael D. Langlais
  • Publication number: 20040084177
    Abstract: The present invention provides for a design and method of manufacture for a mesh-type screen to be used in subsurface well completions to prevent the production of sand.
    Type: Application
    Filed: July 25, 2003
    Publication date: May 6, 2004
    Inventors: David Wei Wang, Colin J. Price-Smith
  • Patent number: 6129955
    Abstract: An electronic package assembly where a low profile integrated circuit chip package is soldered to an organic (e.g., epoxy resin) substrate, e.g., a printed circuit board or card, the projecting conductive leads of the integrated circuit chip package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with ultraviolet photocured encapsulant material (e.g., an epoxy resin or a cyanate with a photoinitiator and silica) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder.
    Type: Grant
    Filed: June 13, 1997
    Date of Patent: October 10, 2000
    Assignee: International Business Machines Corporation
    Inventors: Konstantinos I. Papathomas, Stephen Joseph Fuerniss, Deborah Lynn Dittrich, David Wei Wang
  • Patent number: 5668059
    Abstract: Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: September 16, 1997
    Assignee: International Business Machines Corporation
    Inventors: Frederick Richard Christie, Kostas I. Papathomas, David Wei Wang
  • Patent number: 5667934
    Abstract: A thermally stable photoimaging composition and a method of using the same, especially on circuit boards as a solder mask is provided. The composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Preferably, the composition has a coefficient of thermal expansion of about 28-40 ppm/.degree.C., which closely matches the coefficient of thermal expansion of the solder used on the circuit board components.
    Type: Grant
    Filed: October 9, 1990
    Date of Patent: September 16, 1997
    Assignee: International Business Machines Corporation
    Inventors: Voya Rista Markovich, Ashit Arvind Mehta, Eugene Roman Skarvinko, David Wei Wang
  • Patent number: 5665526
    Abstract: A thermally stable photoimaging composition and a method of using the same, especially on circuit boards as a solder mask is provided. The composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Preferably, the composition has a coefficient of thermal expansion of about 28-40 ppm/.degree. C., which closely matches the coefficient of thermal expansion of the solder used on the circuit board components.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: September 9, 1997
    Assignee: International Business Machines Corporation
    Inventors: Voya Rista Markovich, Ashit Arvind Mehta, Eugene Roman Skarvinko, David Wei Wang
  • Patent number: 5656862
    Abstract: Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.
    Type: Grant
    Filed: May 6, 1993
    Date of Patent: August 12, 1997
    Assignee: International Business Machines Corporation
    Inventors: Kostas I. Papathomas, David Wei Wang