Abstract: A technique that is usable with a subterranean well includes communicating a slurry through a shunt flow path and operating a control device to isolate slurry from being communicated to an ancillary flow path. The system may include a shunt tube and a diverter. The shunt tube is adapted to communicate a slurry flow within the well to form a gravel pack. The diverter is located in a passageway of the shunt tube to divert at least part of the flow. A slurry may be communicated through the shunt flow path, and a control device may be operated to isolate the slurry from being communicated to the ancillary flow path.

Abstract: The present invention provides for a design and method of manufacture for a mesh-type screen to be used in subsurface well completions to prevent the production of sand.

Abstract: Certain embodiments of a cable sense mode for intelligent power saving in the absence of a link pulse may include detecting an energy level of an Ethernet link. The Ethernet link may couple a network adapter chip to a network. The power supplied to the network adapter chip may be adjusted based on the detected energy level. Power may be supplied to the network adapter chip if the detected energy level of the Ethernet link is greater than or equal to a particular energy level. Power may be reduced to the network adapter chip if the detected energy level of the Ethernet link is less than a particular energy level. An output signal and/or an interrupt signal may be generated that indicates a change in the detected energy level of the Ethernet link. Power may be provided to the circuitry that generates the output signal and the interrupt signal.

Abstract: A technique that is usable with a subterranean well includes communicating a slurry through a shunt flow path and operating a control device to isolate slurry from being communicated to an ancillary flow path. The system may include a shunt tube and a diverter. The shunt tube is adapted to communicate a slurry flow within the well to form a gravel pack. The diverter is located in a passageway of the shunt tube to divert at least part of the flow. A slurry may be communicated through the shunt flow path, and a control device may be operated to isolate the slurry from being communicated to the ancillary flow path.

Abstract: The present invention provides for a design and method of manufacture for a mesh-type screen to be used in subsurface well completions to prevent the production of sand.

Abstract: An electronic package assembly where a low profile integrated circuit chip package is soldered to an organic (e.g., epoxy resin) substrate, e.g., a printed circuit board or card, the projecting conductive leads of the integrated circuit chip package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with ultraviolet photocured encapsulant material (e.g., an epoxy resin or a cyanate with a photoinitiator and silica) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder.

Abstract: Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.

Abstract: A thermally stable photoimaging composition and a method of using the same, especially on circuit boards as a solder mask is provided. The composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Preferably, the composition has a coefficient of thermal expansion of about 28-40 ppm/.degree.C., which closely matches the coefficient of thermal expansion of the solder used on the circuit board components.

Abstract: A thermally stable photoimaging composition and a method of using the same, especially on circuit boards as a solder mask is provided. The composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Preferably, the composition has a coefficient of thermal expansion of about 28-40 ppm/.degree. C., which closely matches the coefficient of thermal expansion of the solder used on the circuit board components.

Abstract: Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.