Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a reader. The reader broadcasts a radio signal indicating an available slot set. The reader transmits an acknowledge (ACK) signal including a decoded sequence to an ambient internet of things (A-IoT) device. The reader receives an identifier from the A-IoT device. The identifier is a reply of the A-IoT device when there is a match between the decoded sequence and a chosen sequence, and the chosen sequence is a random sequence that responds to the radio signal in a random slot chosen from the available slot set.

Abstract: A fixing device includes a base provided with a base body, a receiving chamber, a through hole and a block, a slide including a substrate, a gradient groove located on the substrate with a relatively narrower locking side formed at one end and a relatively wider unlocking side formed at an opposite end, an abutment block protruding downward from one side of the substrate, a stop surface formed on an opposite side of the substrate for contacting the block at an inclined angle and an elastic member supported between the abutment block and the base, and a support including a positioning plate fixed in a plate holder of a preset machine box, a positioning rod extending from the positioning plate into the through hole of the base and the gradient groove of the slide and an annular stop surface formed between the positioning plate and the positioning rod.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a reader. The reader receives a response signal set that responds to a radio signal, from an ambient internet of things (A-IoT) device set, a response signal in the response signal set being modulated by a corresponding A-IoT device in the A-IoT device set to include an identification of the corresponding A-IoT device. The reader identifies the corresponding A-IoT device based on the identification of the corresponding A-IoT device, and performs measurement for a positioning parameter. The reader executes a positioning related operation based on the identified A-IoT device and the measurement for the positioning parameter.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. The UE receiving a unified waveform signal from a base station, wherein the unified waveform signal comprises an On-Off Keying (OOK) signal and an Orthogonal Frequency Division Multiplexing (OFDM) signal; determining whether an indicator in the OFDM signal indicates that the unified waveform signal is a low-power wake-up signal (LP-WUS); decoding the LP-WUS when the indicator indicates that the unified waveform signal is the LP-WUS; and terminating a decoding operation when the indicator indicates that the unified waveform signal is not the LP-WUS.

Abstract: A wafer thinning tape and a preparation method thereof, and a wafer grinding method are provided. The wafer thinning tape includes a tape layer, a base film layer, and a conductive coating that are successively stacked, where the base film layer and the conductive coating constitute an antistatic base film; the raw materials of the tape layer include acrylic adhesive, curing agent, and antistatic agent, and the mass dosage of curing agent is 3%-4% that of the acrylic adhesive, and the mass dosage of antistatic agent is 1%-2% that of the acrylic adhesive; the base film layer is TPU film; the conductive coating is silver nanowire coating. The wafer thinning tape can be applied to wafer grinding, has excellent antistatic property, and can effectively inhibit the peeling static electricity; at the same time, it also has the advantages of peeling without residue and preventing water penetration.

Abstract: Various solutions for wake-up signal (WUS) transmission based on timing information with respect to user equipment and network apparatus in mobile communications are described. An apparatus may receive a system information and a timing information for waking up a non-anchor cell from an anchor cell. The apparatus may transmit a WUS based on the system information and the timing information to wake up the non-anchor cell. The anchor cell comprises a cell where the apparatus is capable of receiving the system information and the timing information and performing a timing and frequency synchronization. The non-anchor cell comprises a cell where the apparatus cannot receive the system information and the timing information.

Abstract: Provided in the present invention is a wafer warpage regulation epoxy functional film. The wafer warpage regulation epoxy functional film includes the raw material components, in percentage by mass, 33% of an epoxy resin, 50%-52% of silica, 12%-14% of a curing agent, 1% of a curing accelerator, and 2% of a coloring agent; and the epoxy resin includes a bisphenol F-type epoxy resin and a phenolic epoxy resin. Besides, the above raw material components are stirred and mixed to obtain a slurry, the slurry is coated to a back of a wafer body, and after curing, the epoxy functional film which is formed by the phenolic epoxy resin has high shrinkage and large warpage, to drive the back of the wafer body to warp so as to drive a front of the wafer body to warp backwards.

Abstract: A packaging film and a preparation method thereof, and a filter chip packaging method are provided. The raw materials of the packaging film include: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant, where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:(7-9). The packaging film has excellent flexibility and adhesion, a low moisture absorption rate, and high heat resistance and is especially suitable for the packaging of filter chips.

Abstract: Provided in the present invention is a wafer warpage regulation epoxy functional film. The wafer warpage regulation epoxy functional film includes the raw material components, in percentage by mass, 33% of an epoxy resin, 50%-52% of silica, 12%-14% of a curing agent, 1% of a curing accelerator, and 2% of a coloring agent; and the epoxy resin includes a bisphenol F-type epoxy resin and a phenolic epoxy resin. Besides, the above raw material components are stirred and mixed to obtain a slurry, the slurry is coated to a back of a wafer body, and after curing, the epoxy functional film which is formed by the phenolic epoxy resin has high shrinkage and large warpage, to drive the back of the wafer body to warp so as to drive a front of the wafer body to warp backwards.

Abstract: An application method of a rotary positioning device, which has a limit member, a rotary block and an elastic member mounted in a housing assembled at a preset panel with the steering shaft portion of the rotary block exposed outside the cover, and has the stopper of a docking shaft assembled at another preset panel inserted into the housing and the limit member to pass through two limiting balls and rest on the top of an accommodation chamber. Pulling up the steering shaft portion causes the elastic member to drive rotary slideways of the rotary block and rotation guides of the limit member to slide axially, so as to drive the accommodation chamber of the rotary block to rotate, push the two limiting balls into the slots of the limit member, and abut against the stopper, thus completing the assembly and positioning of the two preset panels.

Abstract: A pressable locating device and a driving mechanism are disclosed. The locating device includes a shaft, a restraining rod and a restraining member; an accommodation space and a shaft hole of a sleeve of the driving mechanism are mounted on the shaft, the restraining rod and the restraining member. The pressing unit is movably assembled in the accommodation space and includes an inner sliding channel disposed on a bottom thereof, and the restraining member and the restraining rod are movably slid in the inner sliding channel. The inner sliding channel includes a through hole formed on a side thereof, and a locating member is axially movable in the through hole, so as to radially move to restrain with or depart from the restraining rod, along the restraining member. An elastic part is disposed and reciprocated between the bottom of the pressing unit and the accommodation space.

Abstract: A semiconductor device includes: a substrate; a channel layer disposed on the substrate, wherein the channel layer is made of GaN; a barrier layer disposed on the channel layer, wherein the barrier layer is made of AlzGa1-zN; and an inserting structure inserted between the channel layer and the barrier layer. The inserting structure includes: a first inserting layer disposed on the channel layer, wherein the first inserting layer is made of AlxGa1-xN; and a second inserting layer disposed on the first inserting layer, wherein the second inserting layer is made of AlyGa1-yN, and y is greater than x. The semiconductor device further includes: a gate electrode disposed on the barrier layer; a source electrode and a drain electrode disposed on the barrier layer and respectively at opposite sides of the gate electrode; and a spike region formed below at least one of the source electrode and the drain electrode.

Abstract: A board assembly device includes a base including a base body having a through hole and a spiral slideway and a positioning member having a joint portion assembled on the through hole, a fixed portion stopped outside the through hole and a locking screw hole therein, a movable seat including a rotating member and a fastening member with a positioning hole, the rotating member having an insertion rod penetrating into the through hole, a sliding rod with a shaft hole for sliding along the slideway, and an accommodating groove for the embedding and fixation of the fastening member, and a connecting member having a head exposed outside the fastening member, a shank inserted into the positioning hole and a screw rod passing through the shaft hole and the through hole and then locked in the locking screw hole.

Abstract: An automatic conveyor device includes an entrance platform and an exit platform opposite to each other, and a series of steps running in a loop between the entrance platform and the exit platform; a platform footboard at the entrance platform or exit platform; a comb support plate connected to the platform footboard and slidable along guide rails of the platform footboard along a length direction; and one or more comb plates fixedly mounted onto the comb support plate.

Abstract: A vibration-damping rectangular magnetic assembly includes a rectangular magnetic assembly and a vibration-damping structure. The rectangular magnetic assembly includes a main magnetic plate, magnetic unit, vibration-damping structure connecting portion and vibration-damping groove. The magnetic unit is disposed at the top of the main magnetic plate. The vibration-damping structure connecting portion and the vibration-damping groove are disposed at the bottom of the main magnetic plate, with the vibration-damping groove disposed outside the vibration-damping structure connecting portion. The vibration-damping structure includes a ring-shaped speaker base butting portion, magnetic assembly butting portion disposed inside the ring-shaped speaker base butting portion, first and second resilient connecting modules connected between the ring-shaped speaker base butting portion and the magnetic assembly butting portion.

Abstract: Various solutions for network power saving with respect to user equipment and network apparatus in mobile communications are described. An apparatus may receive a power saving indication. The apparatus may obtain power saving information according to the power saving indication. The power saving indication may comprise at least one of a discontinuous reception (DRX) switch indicator for switching between a user equipment (UE)-specific-DRX (U-DRX) and a group-specific-DRX (G-DRX), an energy saving mode (EMS) indication, a list of synchronization signal block (SSB) or channel state information-reference signal (CSI-RS) resources, and a set of transmission configuration indication (TCI)I states or RS resource indexes.

Abstract: A passenger conveyor system and an anti-collision device for step and comb plate. The passenger conveyor system includes a step chain having a plurality of steps, a comb plate and an anti-collision device, the anti-collision device includes an actuating mechanism connected to the comb plate and configured to, when a moving distance of a step adjacent to comb teeth of the comb plate to be engaged in a vertical upward direction of the passenger conveyor system exceeds a preset value, actuate the comb plate to be lifted up from an initial first position to a second position to avoid collision with the step; and a reset mechanism configured to return the comb plate from the second position to the first position after the step travels through the comb plate.

Abstract: Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 ?m-100 ?m accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.

Abstract: A two-stage fixing device includes a seat body mounted on a preset circuit board, and a positioning fastener having a base positioned on the seat body. The base has an integrated first positioning body and second positioning body, which are used for the preset first interface card and preset second interface card plugged into respective preset electrical connectors to be rotated and resisted, and then firmly fixed on the base. By moving the base and an operating portion of a buckle member of the positioning fastener, a first elastic member and a second elastic member loaded on the base can be elastically deformed to recede and tilt up, so that the preset first and second interface cards can be separated from the positioning fastener to achieve rapid positioning and disassembly of multiple interface cards of the present invention.

Abstract: A semiconductor wafer carrier structure includes a carrier body having a surface, a protective film covering the surface, and a susceptor disposed on the carrier body and having an upper surface. The upper surface is a planar surface. The semiconductor wafer carrier structure further includes a patterned coating film formed on the upper surface and configured to directly face a semiconductor wafer. A material of the patterned coating film is different from the susceptor. The patterned coating film has two or more different thicknesses and is with a pattern, so that the semiconductor wafer is at least locally separated from the patterned coating film due to the pattern. The patterned coating film is continuously and entirely distributed on the upper surface of the susceptor toward the semiconductor wafer, and the upper surface of the susceptor is separated from the semiconductor wafer by the patterned coating film.