Patents by Inventor Debendra Das Sharma

Debendra Das Sharma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210311895
    Abstract: An apparatus may comprise multiplexing circuitry to select an ingress lane from among a plurality of ingress lanes to couple to an egress lane; and retiming circuitry to retime a signal received on the selected ingress lane and transmit the retimed signal on the egress lane.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 7, 2021
    Inventor: Debendra Das Sharma
  • Publication number: 20210303482
    Abstract: A shared memory controller is to service load and store operations received, over data links, from a plurality of independent nodes to provide access to a shared memory resource. Each of the plurality of independent nodes is to be permitted to access a respective portion of the shared memory resource. Interconnect protocol data and memory access protocol data are sent on the data links and transitions between the interconnect protocol data and memory access protocol data can be defined and identified.
    Type: Application
    Filed: February 8, 2021
    Publication date: September 30, 2021
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Robert G. Blankenship, Suresh S. Chittor, Kenneth C. Creta, Balint Fleischer, Michelle C. Jen, Mohan J. Kumar, Brian S. Morris
  • Patent number: 11113225
    Abstract: An interconnect interface is provided to enable communication with an off-package device over a link including a plurality of lanes. Logic of the interconnect interface includes receiver logic to receive a valid signal from the off-package device on a dedicated valid lane of the link indicating that data is to arrive on a plurality of dedicated data lanes in the plurality of lanes, receive the data on the data lanes from the off-package device sampled based on arrival of the valid signal, and receive a stream signal from the off-package device on a dedicated stream lane in the plurality of lanes. The stream signal corresponds to the data and indicates a particular data type of the data. The particular data type can be one of a plurality of different data types capable of being received on the plurality of data lanes of the link.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: September 7, 2021
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss
  • Patent number: 11113196
    Abstract: A shared memory controller receives a flit from another first shared memory controller over a shared memory link, where the flit includes a node identifier (ID) field and an address of a particular line of the shared memory. The node ID field identifies that the first shared memory controller corresponds to a source of the flit. Further, a second shared memory controller is determined from at least the address field of the flit, where the second shared memory controller is connected to a memory element corresponding to the particular line. The flit is forwarded to the second shared memory controller using a shared memory link according to a routing path.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: September 7, 2021
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Brian S. Morris
  • Patent number: 11095556
    Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: August 17, 2021
    Assignee: INTEL CORPORATION
    Inventors: Debendra Das Sharma, Michelle C. Jen, Mark S. Myers, Don Soltis, Ramacharan Sundararaman, Stephen R. Van Doren, Mahesh Wagh
  • Patent number: 11088967
    Abstract: Systems, methods, and computer-readable media are disclosed for an apparatus coupled to a communication bus, where the apparatus includes a queue and a controller to manage operations of the queue. The queue includes a first space to store a first information for a first traffic type, with a first flow class, and for a first virtual channel of communication between a first communicating entity and a second communicating entity. The queue further includes a second space to store a second information for a second traffic type, with a second flow class, and for a second virtual channel of communication between a third communicating entity and a fourth communicating entity. The first traffic type is different from the second traffic type, the first flow class is different from the second flow class, or the first virtual channel is different from the second virtual channel. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: August 10, 2021
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Swadesh Choudhary
  • Patent number: 11086520
    Abstract: Provided are a method, system, computer readable storage medium, and switch for configuring a switch to assign partitions in storage devices to compute nodes. A management controller configures the switch to dynamically allocate partitions of at least one of the storage devices to the compute nodes based on a workload at the compute node.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: August 10, 2021
    Assignee: Intel Corporation
    Inventors: Mark A. Schmisseur, Mohan J. Kumar, Balint Fleischer, Debendra Das Sharma, Raj K. Ramanujan
  • Publication number: 20210240623
    Abstract: A shared memory controller receives a flit from another first shared memory controller over a shared memory link, where the flit includes a node identifier (ID) field and an address of a particular line of the shared memory. The node ID field identifies that the first shared memory controller corresponds to a source of the flit. Further, a second shared memory controller is determined from at least the address field of the flit, where the second shared memory controller is connected to a memory element corresponding to the particular line.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 5, 2021
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Brian S. Morris
  • Publication number: 20210240655
    Abstract: In one embodiment, an apparatus includes a port to transmit and receive data over a link; and protocol stack circuitry to implement one or more layers of a load-store input/output (I/O)-based protocol (e.g., PCIe or CXL) across the link. The protocol stack circuitry constructs memory write request transaction layer packets (TLPs) for memory write transactions, wherein fields of the memory write request TLPs indicate a virtual channel (VC) other than VCO, that a completion is required in response to the memory write transaction, and a stream identifier associated with the memory write transaction. The memory write request TLP is transmitted over the link and a completion TLP is received over the link in response, indicating a completion for the memory write request TLP.
    Type: Application
    Filed: April 22, 2021
    Publication date: August 5, 2021
    Applicant: Intel Corporation
    Inventor: Debendra Das Sharma
  • Publication number: 20210234946
    Abstract: A port of a computing device is to communicate with another device over a link, the port including physical layer logic of a first protocol, link layer logic of each of a plurality of different protocols, and protocol negotiation logic to determine which of the plurality of different protocols to apply on the link. The protocol negotiation logic is to send and receive ordered sets in a configuration state of a link training state machine of the first protocol, where the ordered sets include an identifier of a particular one of the plurality of different protocols. The protocol negotiation logic is to determine from the ordered sets that a link layer of the particular protocol is to be applied on the link.
    Type: Application
    Filed: April 13, 2021
    Publication date: July 29, 2021
    Applicant: Intel Corporation
    Inventor: Debendra Das Sharma
  • Publication number: 20210232520
    Abstract: In one embodiment, an apparatus includes: a first link layer circuit to perform link layer functionality for a first communication protocol; and a logical physical (logPHY) circuit coupled to the first link layer circuit via a logical PHY interface (LPIF) link, the logPHY circuit to communicate with the first link layer circuit in a flit mode in which the first information is communicated in a fixed width size and to communicate with another link layer circuit in a non-flit mode. Other embodiments are described and claimed.
    Type: Application
    Filed: April 15, 2021
    Publication date: July 29, 2021
    Inventors: Swadesh Choudhary, Mahesh Wagh, Debendra Das Sharma
  • Publication number: 20210224215
    Abstract: A flit-based packetization approach is used for transmitting information between electronic components. A protocol stack can generate transaction layer packets from information received from a transmitting device, assemble the transaction layer packets into one or more flits, and protect the flits with a flit-level cyclic redundancy check (CRC) scheme. The assembled flits can be transmitted across one or more serial point-to-point interconnects in a link connecting the transmitting device to a receiving device. The protocol stack can protect flit information sent across each point-to-point interconnect with a lane-level interleaved forward error correction (FEC) scheme.
    Type: Application
    Filed: April 2, 2021
    Publication date: July 22, 2021
    Applicant: Intel Corporation
    Inventor: Debendra Das Sharma
  • Patent number: 11061850
    Abstract: Methods, apparatus, and systems, for transporting data units comprising multiple pieces of transaction data over high-speed interconnects. A flow control unit, called a KTI (Keizer Technology Interface) Flit, is implemented in a coherent multi-layer protocol supporting coherent memory transactions. The KTI Flit has a basic format that supports use of configurable fields to implement KTI Flits with specific formats that may be used for corresponding transactions. In one aspect, the KTI Flit may be formatted as multiple slots used to support transfer of multiple respective pieces of transaction data in a single Flit. The KTI Flit can also be configured to support various types of transactions and multiple KTI Flits may be combined into packets to support transfer of data such as cache line transfers.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: July 13, 2021
    Assignee: Intel Corporation
    Inventors: Robert J. Safranek, Robert G. Blankenship, Debendra Das Sharma
  • Patent number: 11043965
    Abstract: An identification is made that a link is to exit an active state, the link comprising a plurality of lanes. Parity information is maintained for the lanes based on data previously sent over the link, and an indication of the parity information is sent prior to the exit from the active state.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: June 22, 2021
    Assignee: Intel Corporation
    Inventors: Zuoguo Wu, Debendra Das Sharma, Md. Mohiuddin Mazumder, Subas Bastola, Kai Xiao
  • Publication number: 20210165756
    Abstract: A device is provided with two or more uplink ports to connect the device via two or more links to one or more sockets, where each of the sockets includes one or more processing cores, and each of the two or more links is compliant with a particular interconnect protocol. The device further includes I/O logic to identify data to be sent to the one or more processing cores for processing, determine an affinity attribute associated with the data, and determine which of the two or more links to use to send the data to the one or more processing cores based on the affinity attribute.
    Type: Application
    Filed: January 20, 2021
    Publication date: June 3, 2021
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Anil Vasudevan, David Harriman
  • Patent number: 11005692
    Abstract: A port of a computing device is to connect to another device over a link and use equalization logic to perform equalization of the link at a plurality of different data rates. The equalization logic may identify that the other device supports bypassing a sequential equalization mode, determine a maximum data rate supported by the devices on the link, and participate in equalization of the link at the maximum supported data rate before equalizing the link at one or more other data rates lower than the maximum supported data rate in the plurality of data rates.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: May 11, 2021
    Assignee: Intel Corporation
    Inventor: Debendra Das Sharma
  • Patent number: 11003610
    Abstract: Physical layer logic is provided that is to receive data on one or more data lanes of a physical link, receive a valid signal on another of the lanes of the physical link identifying that valid data is to follow assertion of the valid signal on the one or more data lanes, and receive a stream signal on another of the lanes of the physical link identifying a type of the data on the one or more data lanes.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: May 11, 2021
    Assignee: Intel Corporation
    Inventors: Zuoguo Wu, Mahesh Wagh, Debendra Das Sharma, Gerald S. Pasdast, Ananthan Ayyasamy, Xiaobel Li, Robert G. Blankenship, Robert J. Safranek
  • Patent number: 10997111
    Abstract: A flit-based packetization approach is used for transmitting information between electronic components. A protocol stack can generate transaction layer packets from information received from a transmitting device, assemble the transaction layer packets into one or more flits, and protect the flits with a flit-level cyclic redundancy check (CRC) scheme. The assembled flits can be transmitted across one or more serial point-to-point interconnects in a link connecting the transmitting device to a receiving device. The protocol stack can protect flit information sent across each point-to-point interconnect with a lane-level interleaved forward error correction (FEC) scheme.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: May 4, 2021
    Assignee: Intel Corporation
    Inventor: Debendra Das Sharma
  • Publication number: 20210117350
    Abstract: A physical layer (PHY) is coupled to a serial, differential link that is to include a number of lanes. The PHY includes a transmitter and a receiver to be coupled to each lane of the number of lanes. The transmitter coupled to each lane is configured to embed a clock with data to be transmitted over the lane, and the PHY periodically issues a blocking link state (BLS) request to cause an agent to enter a BLS to hold off link layer flit transmission for a duration. The PHY utilizes the serial, differential link during the duration for a PHY associated task selected from a group including an in-band reset, an entry into low power state, and an entry into partial width state.
    Type: Application
    Filed: December 25, 2020
    Publication date: April 22, 2021
    Applicant: Intel Corporation
    Inventors: Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers, Darren S. Jue, Arvind A. Kumar, Debendra Das Sharma, Jeffrey C. Swanson, Bahaa Fahim, Vedaraman Geetha, Aaron T. Spink, Fulvio Spagna, Rahul R. Shah, Sitaraman V. Iyer, William Harry Nale, Abhishek Das, Simon P. Johnson, Yuvraj S. Dhillon, Yen-Cheng Liu, Raj K. Ramanujan, Robert A. Maddox, Herbert H. Hum, Ashish Gupta
  • Publication number: 20210119730
    Abstract: Systems, methods, and apparatuses can include transmission-side protocol stack circuitry comprising first cyclic redundancy check (CRC) circuitry to determine first CRC code for a first set of information and to determine second CRC code for a second set of information; and Flit encoding circuitry to encode a first portion of a Flit with the first set of information and the first CRC code, the Flit encoding circuitry to encode a second portion of the Flit with the second set of information and the second CRC code. Receiver-side protocol stack circuitry can include a low-latency path comprising first CRC check circuitry to perform a CRC check on a first portion of a received Flit. Receiver-side protocol stack circuitry can include a non-low-latency path comprising forward error correction (FEC) decoder circuitry to perform FEC on received Flits, and second CRC check circuitry to perform CRC check on received Flits that pass FEC.
    Type: Application
    Filed: December 25, 2020
    Publication date: April 22, 2021
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Swadesh Choudhary