Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to one of a plurality of word lines and arranged in strings and configured to retain a threshold voltage corresponding to one of a plurality of memory states. A control circuit is coupled to the plurality of word lines and strings and is configured to erase the memory cells using a stripe erase operation in response to determining a cycle count is less than a predetermined cycle count maximum threshold. The control circuit is also configured to perform a dummy cycle operation in response to determining the cycle count is not less than the predetermined cycle count maximum threshold.

Abstract: A non-volatile memory system adjusts the speed of a memory operation for a subset of non-volatile memory cells. For example, during a GIDL based erase process, the GIDL generation can be dampened for a subset of memory cells (e.g., for a set of NAND strings, or one or more sub-blocks).

Abstract: A nonvolatile memory control method includes a step of writing, repeatedly to a nonvolatile memory cells. The method continues with detecting when writing reaches a writing threshold value. Upon reaching the writing threshold, the method continues with driving a charge to at least one parasitic area intermediate at least two charge storage areas of the nonvolatile memory cells to improve data retention in at least one of the at least two charge storage areas of the nonvolatile memory cells.

Abstract: A nonvolatile memory control method includes a step of writing, repeatedly to a nonvolatile memory cells. The method continues with detecting when writing reaches a writing threshold value. Upon reaching the writing threshold, the method continues with driving a charge to at least one parasitic area intermediate at least two charge storage areas of the nonvolatile memory cells to improve data retention in at least one of the at least two charge storage areas of the nonvolatile memory cells.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes memory cells connected to word lines and bit lines and arranged in strings and configured to retain a threshold voltage. Each of the memory cells is configured to be erased in an erase operation occurring during an erase time period. A control circuit is configured to adjust at least a portion of the erase time period in response to determining the erase operation is a segmented erase operation and is resumed after being suspended. The control circuit applies an erase signal having a plurality of voltage segments temporally separated from one another during the erase time period to each of the strings while simultaneously applying a word line erase voltage to selected ones of the word lines to encourage erasing of the memory cells coupled to the selected ones of the word lines in the segmented erase operation.

Abstract: A method reading memory using bi-directional sensing, including programming first memory cells coupled to a first word-line using a normal programming order; programming second memory cells coupled to a second word-line using a normal programming order; reading data from the first memory cells by applying a normal sensing operation to the first word-line; and reading data from the second memory cells by applying a reverse sensing operation to the second word-line. Methods also include receiving an error associated with reading data from the first memory cells; and then reading the data from the first memory cells by applying a reverse sensing operation to the first word-line. Method also include receiving an error associated with reading the data from the second memory cells; and then reading the data from the second memory cells by applying a normal sensing operation to the second word-line.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes a block of memory cells. Each of the memory cells is connected to one of a plurality of word lines and are also arranged in strings and configured to retain a threshold voltage within a common range of threshold voltages. A control circuit coupled to the plurality of word lines and the strings is configured to determine an erase upper tail voltage of a distribution of the threshold voltage of the memory cells following an erase operation. The erase upper tail voltage corresponds to a cycling condition of the memory cells. The control circuit is also configured to calculate a program voltage to apply to each of selected ones of the plurality of word lines associated with the memory cells to program the memory cells during a program operation based on the erase upper tail voltage.

Abstract: An apparatus includes a memory controller configured to apply selected one or ones of the program verify voltage levels to a single tier of memory cells. A memory controller is configured to: program data into the plurality of memory cells; and perform a program verify operation across multiple voltage levels with a first voltage level of the program verify operation being applied to a single tier that represents all of the tiers in the memory group and a second voltage level of the program verify operation being applied to multiple tiers, wherein the first voltage level is less than the second voltage level. In embodiments, less than all of the tiers, e.g., two or four tiers, can be used in the program verify to represent all of the tires.

Abstract: A method for memory program verification includes performing a write operation on memory cells of a memory device. The method also includes identifying memory strings associated with respective memory cells of the memory cells. The method also includes identifying a first memory string of the memory strings. The method also includes disabling a portion of a write verification for the first memory string. The method also includes enabling the portion of the write verification for other memory strings of the memory strings. The method also includes performing at least the portion of the write verification operation on write verification enabled memory strings.

Abstract: An apparatus includes a memory controller configured to apply selected one or ones of the program verify voltage levels to a single tier of memory cells. A memory controller is configured to: program data into the plurality of memory cells; and perform a program verify operation across multiple voltage levels with a first voltage level of the program verify operation being applied to a single tier that represents all of the tiers in the memory group and a second voltage level of the program verify operation being applied to multiple tiers, wherein the first voltage level is less than the second voltage level. In embodiments, less than all of the tiers, e.g.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, where the electrically conductive layers comprise word lines located between a source select gate electrode and a drain select gate electrode, a memory opening vertically extending through each layer of the alternating stack to a top surface of the substrate, a memory film and vertical semiconductor channel having a doping of a first conductivity type located in the memory opening, and an active region having a doping of a second conductivity type that is an opposite of the first conductivity type and adjoined to an end portion of the vertical semiconductor channel to provide a p-n junction. The end portion of the vertical semiconductor channel has a first thickness, and a middle portion of the vertical semiconductor channel has a second thickness which is less than the first thickness.

Abstract: Techniques for reducing program disturb of memory cells which are formed in a NAND string extending in a lower tier and an upper tier of a stack, the lower tier including a first plurality of memory cells and the upper tier including a second plurality of memory cells, wherein each memory cell of the first and second pluralities of memory cells is connected to a respective word line. The NAND string includes a joint region formed of a dielectric material and disposed between the lower tier and the upper tier of the stack; a first non-data memory cell adjacent to and below the joint region; a second non-data memory cell adjacent to and above the joint region; and a conductive gate connected to the first non-data memory cell and the second non-data memory cell.

Abstract: Techniques for reducing program disturb of memory cells which are formed in a NAND string extending in a lower tier and an upper tier of a stack, the lower tier comprising a first plurality of memory cells and the upper tier comprising a second plurality of memory cells, wherein each memory cell of the first and second pluralities of memory cells is connected to a respective word line. The NAND string includes a joint region formed of a dielectric material and disposed between the lower tier and the upper tier of the stack; a first non-data memory cell adjacent to and below the joint region; a second non-data memory cell adjacent to and above the joint region; and a conductive gate connected to the first non-data memory cell and the second non-data memory cell.

Abstract: A method for memory program verification includes performing a write operation on memory cells of a memory device. The method also includes identifying memory strings associated with respective memory cells of the memory cells. The method also includes identifying a first memory string of the memory strings. The method also includes disabling a portion of a write verification for the first memory string. The method also includes enabling the portion of the write verification for other memory strings of the memory strings. The method also includes performing at least the portion of the write verification operation on write verification enabled memory strings.

Abstract: A method of concurrently programming a memory. Various methods include: applying a non-negative voltage on a first bit line coupled to a first memory cell; applying a negative voltage on a second bit line coupled to a second memory cell, where the negative voltage is generated using triple-well technology; then applying a programming pulse to the first and second memory cells concurrently; and in response, programming the first and second memory cells to different states. The methods also include applying a quick pass write operation to the first and second memory cells, by: applying a quick pass write voltage to the first bit line coupled to the first memory cell, where the quick pass write voltage is higher than the non-negative voltage; applying a negative quick pass write voltage to the second bit line coupled to the first memory cell, where the negative quick pass write voltage is generated using triple-well technology.

Abstract: Method(s) and structure(s) for a two-page read operation are described and provide a multiple page read. The two page read operation provides for reading two pages with in a block without reducing the control gates to a low voltage level. The two page read can read the first page using an incrementing voltage level at discrete steps and starting the second page read at the high state for the control gates from the first page read. The second page read then decrements the control gate voltages level through the steps. This should reduce energy consumption. The two-page read operation will also reduce the time as the time period to reset the control gates to a low state are not required in between the page read operations.

Abstract: Method(s) and structure(s) for a two-page read operation are described and provide a multiple page read. The two page read operation provides for reading two pages with in a block without reducing the control gates to a low voltage level. The two page read can read the first page using an incrementing voltage level at discrete steps and starting the second page read at the high state for the control gates from the first page read. The second page read then decrements the control gate voltages level through the steps. This should reduce energy consumption. The two-page read operation will also reduce the time as the time period to reset the control gates to a low state are not required in between the page read operations.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, where the electrically conductive layers comprise word lines located between a source select gate electrode and a drain select gate electrode, a memory opening vertically extending through each layer of the alternating stack to a top surface of the substrate, a memory film and vertical semiconductor channel having a doping of a first conductivity type located in the memory opening, and an active region having a doping of a second conductivity type that is an opposite of the first conductivity type and adjoined to an end portion of the vertical semiconductor channel to provide a p-n junction. The end portion of the vertical semiconductor channel has a first thickness, and a middle portion of the vertical semiconductor channel has a second thickness which is less than the first thickness.

Abstract: A method reading memory using bi-directional sensing, including programming first memory cells coupled to a first word-line using a normal programming order; programming second memory cells coupled to a second word-line using a normal programming order; reading data from the first memory cells by applying a normal sensing operation to the first word-line; and reading data from the second memory cells by applying a reverse sensing operation to the second word-line. Methods also include receiving an error associated with reading data from the first memory cells; and then reading the data from the first memory cells by applying a reverse sensing operation to the first word-line. Method also include receiving an error associated with reading the data from the second memory cells; and then reading the data from the second memory cells by applying a normal sensing operation to the second word-line.

Abstract: A method of concurrently programming a memory. Various methods include: applying a non-negative voltage on a first bit line coupled to a first memory cell; applying a negative voltage on a second bit line coupled to a second memory cell, where the negative voltage is generated using triple-well technology; then applying a programming pulse to the first and second memory cells concurrently; and in response, programming the first and second memory cells to different states. The methods also include applying a quick pass write operation to the first and second memory cells, by: applying a quick pass write voltage to the first bit line coupled to the first memory cell, where the quick pass write voltage is higher than the non-negative voltage; applying a negative quick pass write voltage to the second bit line coupled to the first memory cell, where the negative quick pass write voltage is generated using triple-well technology.