Abstract: Systems and methods for determining pixel classification information using images depicting at least a portion of a whole slide image (WSI) of a stained tissue sample. A system can store a first image of the tissue sample at a first resolution, a second image of the tissue sample at a second resolution that is higher than the first resolution, and a third image of the tissue sample at a third resolution that is higher than the second resolution, the first, second, and third images depicting at least a portion of a same area of the tissue sample. The system can include be configured to generate first feature information based on the first image, generate second feature information based on the second image, and determine pixel classification information of at least a portion of the WSI based on the third image, the first feature information and second feature information.

Abstract: In various examples, three-dimensional (3D) object or feature detection and localization for autonomous and semi-autonomous systems and applications is described herein. Systems and methods are disclosed that use different types of sensors, such as an image sensor and a LIDAR sensor, to determine information associated with objects, such as traffic objects (e.g., traffic signs, traffic signals, traffic markings, etc.). To determine the information for an object, image data is processed to determine a bounding shape associated with the object. The bounding shape is then used to determine a 3D shape, such as a frustum, corresponding to the object. Additionally, points data generated using the LIDAR sensor, such as an occupancy map and/or a point cloud, is processed to identify a portion of the points associated with (e.g., located within) the 3D shape. This portion of the points may then be used to determine the information associated with the object.

Abstract: In various examples, three-dimensional (3D) object or feature detection and localization for autonomous and semi-autonomous systems and applications is described herein. Systems and methods are disclosed that use different types of sensors, such as an image sensor and a LIDAR sensor, to determine information associated with objects, such as traffic objects (e.g., traffic signs, traffic signals, traffic markings, etc.). To determine the information for an object, image data is processed to determine a bounding shape associated with the object. The bounding shape is then used to determine a 3D shape, such as a frustum, corresponding to the object. Additionally, points data generated using the LIDAR sensor, such as an occupancy map and/or a point cloud, is processed to identify a portion of the points associated with (e.g., located within) the 3D shape. This portion of the points may then be used to determine the information associated with the object.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly polarization structures for LED devices are disclosed. Polarization structures are disclosed that are integrated within light-emitting devices and are capable of receiving unpolarized light and providing polarized light that exits the light-emitting devices. Polarization structures may be formed on or in various surfaces within light-emitting devices, such as one or more surfaces of cover structures and/or LED chips. LED packages with multiple LED chips and multiple polarization structures are also disclosed. The LED chips may be arranged to be electrically activated and deactivated independently of one another such that corresponding LED packages are capable of electronically switching between different orientations of polarized and/or unpolarized light.

Abstract: Systems and methods for characterizing interactions between molecules and targets are provided. Candidate molecules are selected using first interaction scores for each molecule and a target. Molecular graphs of each molecule are inputted into a first and/or second model to retrieve a first plurality of on-target interaction features or a second plurality of off-target interaction features, respectively. Second interaction scores are obtained using the first and/or second plurality of features and evaluated to filter the plurality of candidate molecules. For each molecule, a third plurality of binding affinity interaction features and/or a fourth plurality of specificity interaction features are determined. The plurality of candidate molecules is filtered based at least on counts of features in the third and/or fourth plurality of features. Predictions of interaction between each molecule and the target are determined using at least the third and/or fourth plurality of features.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly integrated secondary optics into LED chip cover structures for improved optical emission of high intensity LEDs is disclosed. Optical elements are integrated as a secondary optic onto one or both surfaces of a chip cover structure, where the chip cover structure may be referred to as a primary optic. The integrated secondary optic may be formed directly on one or both surfaces of the chip cover structure. The integrated secondary optic is purposely built to be coupled with the light emission of the LED to emit a desired emission profile. In this regard, a final luminaire may be provided with increased efficiency either by improving the coupling of the LED into a conventional secondary optic or in some cases by removing the need for a conventional secondary optic all together.

Abstract: Solid-state lighting devices, and more particularly sidewall arrangements for light-emitting devices such as light-emitting diodes (LEDs) are disclosed. LED devices may include light-altering materials that are provided around peripheral sidewalls of LED chips without the need for a supporting submount or lead frame. The side layer around the peripheral sidewall of the LED chip can include an inner layer and an outer layer, each with different light altering properties. For example, the inner layer can be reflective so as to improve the light output and/or efficiency of the LED chip, while the outer layer can be absorptive so as to avoid interaction and/or crosstalk with neighboring LED chips. By having a reflective inner layer, and an absorptive outer layer, light output, sharpness, and contrast can be improved.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and, more particularly, reflectors for support structures in LED packages are disclosed. Support structures include arrangements of dielectric reflectors relative to LED chips and electrically conductive traces that are patterned on a submount. Dielectric reflectors include multiple dielectric layer structures that form a distributed Bragg reflector or, in some instances, an aperiodic Bragg reflector. Such dielectric reflectors may be arranged one or more of the electrically conductive traces and on portions of the submount uncovered by the electrically conducive traces to provide increased reflectivity across a variety of wavelengths provided by LED chips, including wavelengths in the ultraviolet spectrum.

Abstract: The present disclosure relates to techniques for providing a liquid metal alloy in a light-emitting diode device that can both heal cracks formed in solder joints on the light-emitting diode (LED) device as well as improve thermal energy dissipation from the LED chips to improve the performance, reduce wear, and prolong the life of the LED chips. In an embodiment, a light-emitting diode device can include a liquid metal alloy containing gallium next to a solder joint, and when one or more cracks form, the liquid metal alloy can enter the cracks and solidify, healing the cracks. The liquid metal alloy can also be placed adjacent to, and in contact with the LED chip to transfer energy away from the LED chips.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.

Abstract: A light emitting device includes a LED having a light emitting first surface and a light emitting second surface that define a corner. A support layer is disposed to receive light emitted by the light emitting second surface and is disposed adjacent the corner. A luminophoric medium layer at least partially covers the light emitting first surface and the light emitting second surface where the luminophoric medium layer is at least partially supported by the support layer to prevent a narrowing of the luminophoric medium layer.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly support structures for LED packages are disclosed. Support structure arrangements are provided for LED packages with increased reflectivity. Support structures may include patterned electrically conductive materials that provide electrical connections and bonding surfaces for LED chips within the package, and bonding surfaces for cover structures in certain arrangements. Depending on the wavelengths of light emitted by the LED package, light reflectivity tradeoffs can exist for conductive materials that provide suitable electrical connections and bonding surfaces. Additional patterned layers with increased reflectivity may be provided on underlying patterned electrically conductive materials.

Abstract: Light-emitting diode (LED) packages and more particularly LED packages with directional emission intensity and color uniformity are disclosed. LED packages include one or more LED chips on a submount with arrangements of light-altering materials and lumiphoric material layers that provide directional light emissions with improved color over angle uniformity. Light-altering materials are provided that cover sidewalls of LED chips while lumiphoric material layers cover LED chips and light-altering materials. Such LED packages may avoid the need to include encapsulation materials and/or lenses that would otherwise cover the lumiphoric material layers. As such, exterior light-exiting faces of LED packages are formed by surfaces of lumiphoric material layers.

Abstract: Light-emitting diode (LED) packages, and more particularly arrangements of multiple LED chips in LED packages are disclosed. Arrangements include different types, different dimensions, and/or different orientations of LED chips within LED packages and corresponding electrical connections. Further arrangements include individual cover structures having different dimensions for various LED chips to accommodate thickness variations of LED chips and/or thickness variations attributed to different elements of individual cover structures. Different cover structure elements may include lumiphoric materials, antireflective layers, filter layers, and polarization layers. By accounting for dimensional variations between LED chips and/or between cover structures within multiple-chip LED packages, aggregate light-emitting surfaces may be provided with improved emission uniformity.

Abstract: Systems and methods for determining pixel classification information using images depicting at least a portion of a whole slide image (WSI) of a stained tissue sample. A system can store a first image of the tissue sample at a first resolution, a second image of the tissue sample at a second resolution that is higher than the first resolution, and a third image of the tissue sample at a third resolution that is higher than the second resolution, the first, second, and third images depicting at least a portion of a same area of the tissue sample. The system can include be configured to generate first feature information based on the first image, generate second feature information based on the second image, and determine pixel classification information of at least a portion of the WSI based on the third image, the first feature information and second feature information.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly binder materials for light-emitting devices are disclosed. A lumiphoric material for a light-emitting device may include lumiphoric particles embedded within a binder material. The lumiphoric material may be formed according to sol-gel chemistry techniques where a solution of binder precursors and lumiphoric particles is applied to a surface, dried to reduce liquid phase, and fired to form a hardened and dense lumiphoric material. The binder precursors may include metal oxide precursors that result in a metal oxide binder. In this manner, the lumiphoric material may have high thermal conductivity while also being adaptable for liquid-phase processing. In further embodiments, binder materials with or without lumiphoric particles may be utilized in place of conventional encapsulation materials for light-emitting devices.

Abstract: Solid-state lighting devices and more particularly light-emitting devices including light-emitting diodes (LEDs) with light-altering material arrangements are disclosed. LED devices may include light-altering materials that are provided around peripheral sidewalls of LED chips without the need for a supporting submount or lead frame. The light-altering materials may be provided with reduced thicknesses along peripheral sidewalls of LED chips. An exemplary LED device as disclosed herein may be configured with a footprint that is close to a footprint of the LED chip within the LED device while also providing an amount of light-altering material around peripheral edges of the LED chip to reduce cross-talk. Accordingly, such LED devices may be well suited for use in applications where LED devices form closely-spaced LED arrays. Fabrication techniques are disclosed that include laminating a preformed sheet of light-altering material on one or more surfaces of the LED chip.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly polarization structures for LED devices are disclosed. Polarization structures are disclosed that are integrated within light-emitting devices and are capable of receiving unpolarized light and providing polarized light that exits the light-emitting devices. Polarization structures may be formed on or in various surfaces within light-emitting devices, such as one or more surfaces of cover structures and/or LED chips. LED packages with multiple LED chips and multiple polarization structures are also disclosed. The LED chips may be arranged to be electrically activated and deactivated independently of one another such that corresponding LED packages are capable of electronically switching between different orientations of polarized and/or unpolarized light.