Patents by Inventor Derek Miller
Derek Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220262989Abstract: A light emitting device includes a LED having a light emitting first surface and a light emitting second surface that define a corner. A support layer is disposed to receive light emitted by the light emitting second surface and is disposed adjacent the corner. A luminophoric medium layer at least partially covers the light emitting first surface and the light emitting second surface where the luminophoric medium layer is at least partially supported by the support layer to prevent a narrowing of the luminophoric medium layer.Type: ApplicationFiled: February 18, 2021Publication date: August 18, 2022Inventors: Robert Wilcox, Sarah Trinkle, Derek Miller, Peter Andrews, Colin Blakely
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Publication number: 20220254962Abstract: Optical arrangements in cover structures for packaged light-emitting diode (LED) devices are disclosed. LED packages may include a cover structure arranged over one or more LED chips. The cover structure may include arrangements of one or more sublayers or regions configured with different optical arrangements for tailoring emission characteristics for the LED package. The one or more sublayers or regions may include one or more arrangements of optical materials, including lumiphoric materials, materials with different indexes of refraction, light-scattering materials, and light-diffusing materials individually or in various combinations with one another to provide one or more of improved light output, increased light extraction, improved emission uniformity, and improved emission contrast for the LED package. Related methods include providing individual sheets of precursor materials that include different optical arrangements and firing the sheets together to form cover structures.Type: ApplicationFiled: February 11, 2021Publication date: August 11, 2022Inventors: Derek Miller, Peter Scott Andrews, Colin Blakely, Brian T. Collins
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Patent number: 11411148Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: GrantFiled: September 10, 2020Date of Patent: August 9, 2022Assignee: CreeLED, Inc.Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Patent number: 11367810Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LED devices with light-altering particle arrangements are disclosed. An LED device may include an LED chip with a light-altering material arranged to redirect light in a desired emission direction. The light-altering material may include light-altering particles with a median particle size that is determined based on a wavelength of light provided by the LED chip. Such light-altering particles may be arranged proximate sidewalls of the LED chip to redirect lateral emissions. LED devices may further include lumiphoric materials and other light-altering particles arranged proximate the lumiphoric materials with a median particle size that is determined based on a wavelength of light provided by the lumiphoric materials.Type: GrantFiled: August 14, 2020Date of Patent: June 21, 2022Assignee: CREELED, INC.Inventors: Derek Miller, Colin Blakely
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Publication number: 20220190208Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly support structures for LED packages are disclosed. Support structure arrangements are provided for LED packages with increased reflectivity. Support structures may include patterned electrically conductive materials that provide electrical connections and bonding surfaces for LED chips within the package, and bonding surfaces for cover structures in certain arrangements. Depending on the wavelengths of light emitted by the LED package, light reflectivity tradeoffs can exist for conductive materials that provide suitable electrical connections and bonding surfaces. Additional patterned layers with increased reflectivity may be provided on underlying patterned electrically conductive materials.Type: ApplicationFiled: December 16, 2020Publication date: June 16, 2022Inventors: Derek Miller, Robert Wilcox, Colin Blakely
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Publication number: 20220165923Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly cover structure arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips and a cover structure that is arranged over the one or more LED chips that may provide protection from environmental exposure to underlying portions of the LED package. The cover structure may include arrangements of one or more layers or coatings that may be configured for providing improved emission characteristics for the LED package. The one or more layers or coatings may include antireflective structures, filter structures, and reflective structures individually or in various combinations with one another to provide one or more of improved light output, increased light extraction, improved emission uniformity, and improved emission contrast for the LED package.Type: ApplicationFiled: November 24, 2020Publication date: May 26, 2022Inventors: Eric Kamp, Derek Miller, Colin Blakely
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Publication number: 20220069172Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly binder materials for light-emitting devices are disclosed. A lumiphoric material for a light-emitting device may include lumiphoric particles embedded within a binder material. The lumiphoric material may be formed according to sol-gel chemistry techniques where a solution of binder precursors and lumiphoric particles is applied to a surface, dried to reduce liquid phase, and fired to form a hardened and dense lumiphoric material. The binder precursors may include metal oxide precursors that result in a metal oxide binder. In this manner, the lumiphoric material may have high thermal conductivity while also being adaptable for liquid-phase processing. In further embodiments, binder materials with or without lumiphoric particles may be utilized in place of conventional encapsulation materials for light-emitting devices.Type: ApplicationFiled: August 25, 2020Publication date: March 3, 2022Inventors: Walter Weare, Derek Miller, Brian T. Collins, Colin Blakely
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Publication number: 20220052232Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LED devices with light-altering particle arrangements are disclosed. An LED device may include an LED chip with a light-altering material arranged to redirect light in a desired emission direction. The light-altering material may include light-altering particles with a median particle size that is determined based on a wavelength of light provided by the LED chip. Such light-altering particles may be arranged proximate sidewalls of the LED chip to redirect lateral emissions. LED devices may further include lumiphoric materials and other light-altering particles arranged proximate the lumiphoric materials with a median particle size that is determined based on a wavelength of light provided by the lumiphoric materials.Type: ApplicationFiled: August 14, 2020Publication date: February 17, 2022Inventors: Derek Miller, Colin Blakely
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Publication number: 20220005987Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.Type: ApplicationFiled: July 1, 2020Publication date: January 6, 2022Inventors: Robert Wilcox, Derek Miller, Kyle Damborsky, Aaron Francis, Colin Blakely
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Publication number: 20220000160Abstract: The invention relates to a flavonoid delivery system comprising a co-precipitate of a hydrophobic flavonoid and a protein. The flavonoid delivery system comprises a high ratio of flavonoid to protein, allowing food products to be fortified with relatively large amounts of flavonoid without compromising the sensory properties of the food product.Type: ApplicationFiled: November 7, 2019Publication date: January 6, 2022Inventors: Abby Kerrin Thompson, Alejandra Acevedo Fani, Ali Rashidinejad, Harjinder Singh, Simon Derek Miller Loveday, Zhigao Niu
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Publication number: 20210328112Abstract: Solid-state lighting devices and more particularly light-emitting devices including light-emitting diodes (LEDs) with light-altering material arrangements are disclosed. LED devices may include light-altering materials that are provided around peripheral sidewalls of LED chips without the need for a supporting submount or lead frame. The light-altering materials may be provided with reduced thicknesses along peripheral sidewalls of LED chips. An exemplary LED device as disclosed herein may be configured with a footprint that is close to a footprint of the LED chip within the LED device while also providing an amount of light-altering material around peripheral edges of the LED chip to reduce cross-talk. Accordingly, such LED devices may be well suited for use in applications where LED devices form closely-spaced LED arrays. Fabrication techniques are disclosed that include laminating a preformed sheet of light-altering material on one or more surfaces of the LED chip.Type: ApplicationFiled: April 16, 2020Publication date: October 21, 2021Inventors: Tucker McFarlane, Matthew Brady, Derek Miller, Colin Blakely
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Patent number: 11145689Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chips and related methods are disclosed. LED chips are provided that include an indicia arranged between a primary light-emitting face and a mounting face of the LED chip. The indicia may include at least one of a logo, one or more alphanumeric characters, or a symbol, among others that are configured to convey information. Arrangements of at least one of an n-contact, a p-contact, or a reflector layer of the LED chip may form the indicia. LED chips are also provided where at least a portion of an indicia is arranged on a mounting face of the LED chip. Indicia are provided that may be visible through primary light-emitting faces when LED chips are electrically activated or electrically deactivated. In this regard, the indicia may be embedded within LED chips while still being able to convey information.Type: GrantFiled: November 29, 2018Date of Patent: October 12, 2021Assignee: CreeLED, Inc.Inventors: Nikolas Hall, Derek Miller, Anoop Mathew, Colin Blakely, Luis Breva, Jesse Reiherzer, David Todd Emerson
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Publication number: 20210005793Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: ApplicationFiled: September 10, 2020Publication date: January 7, 2021Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Publication number: 20200334455Abstract: Provided herein are processing systems including a camera that is arranged to capture an image of a delivery item. The system also includes a hardware processor that is operably connected to the camera and that is configured to perform operations that include capturing, using the camera, an image of a delivery item that is undeliverable to an intended recipient or at an intended delivery location, where the image includes an address of the intended recipient. The operations also include embedding, by the hardware processor, processing data with the image of the delivery item to thereby generate an embedded image, and notifying a sender of the delivery item that the delivery item is undeliverable using the embedded image. Also provided herein are related computer readable media and methods of processing delivery items that are undeliverable.Type: ApplicationFiled: April 13, 2020Publication date: October 22, 2020Inventors: Derek MILLER, Thomas J. GRAHAM
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Patent number: 10811573Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: GrantFiled: November 18, 2019Date of Patent: October 20, 2020Assignee: Cree, Inc.Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Publication number: 20200176507Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chips and related methods are disclosed. LED chips are provided that include an indicia arranged between a primary light-emitting face and a mounting face of the LED chip. The indicia may include at least one of a logo, one or more alphanumeric characters, or a symbol, among others that are configured to convey information. Arrangements of at least one of an n-contact, a p-contact, or a reflector layer of the LED chip may form the indicia. LED chips are also provided where at least a portion of an indicia is arranged on a mounting face of the LED chip. Indicia are provided that may be visible through primary light-emitting faces when LED chips are electrically activated or electrically deactivated. In this regard, the indicia may be embedded within LED chips while still being able to convey information.Type: ApplicationFiled: November 29, 2018Publication date: June 4, 2020Inventors: Nikolas Hall, Derek Miller, Anoop Mathew, Colin Blakely, Luis Breva, Jesse Reiherzer, David Todd Emerson
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Publication number: 20200105984Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: ApplicationFiled: November 18, 2019Publication date: April 2, 2020Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Patent number: 10522722Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: GrantFiled: April 19, 2018Date of Patent: December 31, 2019Assignee: Cree, Inc.Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Publication number: 20190326485Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: ApplicationFiled: April 19, 2018Publication date: October 24, 2019Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Patent number: 9309130Abstract: Process for producing a hydrogen-containing product and one or more liquid water products using catalytic steam-hydrocarbon reforming. In the process, a portion of the make-up water is heated by the reformate and another portion of the make-up water is heated by the combustion product gas prior to introducing the make-up water to a deaerator. Water in the combustion product gas is condensed to form a liquid water product. The process may be integrated with a thermal water desalination process.Type: GrantFiled: October 23, 2013Date of Patent: April 12, 2016Assignee: AIR PRODUCTS AND CHEMICALS, INC.Inventors: Xiang-Dong Peng, Derek Miller, Geoffrey Colling Achilles, Xianming Jimmy Li