Patents by Inventor Dexter Tamio Chun

Dexter Tamio Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150243373
    Abstract: Systems, methods, and computer programs are disclosed for kernel masking dynamic random access memory (DRAM) defects. One such method comprises: detecting and correcting a single-bit error associated with a physical address in a dynamic random access memory (DRAM); receiving error data associated with the physical address from the DRAM; storing the received error data in a failed address table located in a non-volatile memory; and retiring a kernel page corresponding to the physical address if a number of errors associated with the physical address exceeds an error count threshold.
    Type: Application
    Filed: February 23, 2014
    Publication date: August 27, 2015
    Applicant: QUALCOMM INCORPORATED
    Inventors: DEXTER TAMIO CHUN, YANRU LI, XIANGYU DONG, JUNGWON SUH, JUNG PILL KIM, DEEPTI VIJAYALAKSHMI SRIRAMAGIRI
  • Publication number: 20150242213
    Abstract: Various embodiments of methods and systems for flexible read only memory (“ROM”) storage of coded instructions in a portable computing device (“PCD”) are disclosed. Because certain instructions and/or data associated with a primary boot loader (“PBL”) may be defective or in need of modification after manufacture of a mask ROM component, embodiments of flexible ROM storage (“FRS”) systems and methods use a closely coupled one-time programmable (“OTP”) memory component to store modified instructions and/or data. Advantageously, because the OTP memory component may be manufactured “blank” and programmed at a later time, modifications to code and/or data stored in an unchangeable mask ROM may be accomplished via pointers in fuses of a security controller that branch the request to the OTP and bypass the mask ROM.
    Type: Application
    Filed: February 23, 2014
    Publication date: August 27, 2015
    Applicant: QUALCOMM INCORPORATED
    Inventors: YANRU LI, DEXTER TAMIO CHUN, DHAMIM PACKER ALI, GREGORY AMERIADA UVIEGHARA, ZHONGZE WANG
  • Publication number: 20150213850
    Abstract: Serial data transmission for dynamic random access memory (DRAM) interfaces is disclosed. Instead of the parallel data transmission that gives rise to skew concerns, exemplary aspects of the present disclosure transmit the bits of a word serially over a single lane of the bus. Because the bus is a high speed bus, even though the bits come in one after another (i.e., serially), the time between arrival of the first bit and arrival of the last bit of the word is still relatively short. Likewise, because the bits arrive serially, skew between bits becomes irrelevant. The bits are aggregated within a given amount of time and loaded into the memory array.
    Type: Application
    Filed: January 19, 2015
    Publication date: July 30, 2015
    Inventors: Vaishnav Srinivas, Michael Joseph Brunolli, Dexter Tamio Chun, David Ian West
  • Publication number: 20150213849
    Abstract: Providing memory training of dynamic random access memory (DRAM) systems using port-to-port loopbacks, and related methods, systems, and apparatuses are disclosed. In one aspect, a first port within a DRAM system is coupled to a second port via a loopback connection. A training signal is sent to the first port from a System-on-Chip (SoC), and passed to the second port through the loopback connection. The training signal is then returned to the SoC, where it may be examined by a closed-loop training engine of the SoC. A training result corresponding to a hardware parameter may be recorded, and the process may be repeated until an optimal result for the hardware parameter is achieved at the closed-loop training engine. By using a port-to-port loopback configuration, the DRAM system parameters regarding timing, power, and other parameters associated with the DRAM system may be trained more quickly and with lower boot memory usage.
    Type: Application
    Filed: January 5, 2015
    Publication date: July 30, 2015
    Inventors: Vaishnav Srinivas, Michael Joseph Brunolli, Dexter Tamio Chun, David Ian West
  • Patent number: 9087765
    Abstract: An integrated circuit package is disclosed that includes a first-pitch die and a second-pitch die. The second-pitch die interconnects to the second-pitch substrate through second-pitch substrates. The first-pitch die interconnects through first-pitch interconnects to an interposer adapter. The pitch of the first-pitch interconnects is too fine for the second-pitch substrate. But the interposer adapter interconnects through second-pitch interconnects to the second-pitch substrate and includes through substrate vias so that I/O signaling between the first-pitch die and the second-pitch die can be conducted through the second-pitch substrate and through the through substrate vias in the interposer adapter.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 21, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Dexter Tamio Chun, Jungwon Suh, Urmi Ray, Shiqun Gu
  • Publication number: 20150194197
    Abstract: Dynamic random access memory (DRAM) backchannel communication systems and methods are disclosed. In one aspect, a backchannel communication system allows a DRAM to communicate error correction information and refresh alert information to a System on a Chip (SoC), applications processor (AP), or other memory controller.
    Type: Application
    Filed: January 7, 2015
    Publication date: July 9, 2015
    Inventors: David Ian West, Michael Joseph Brunolli, Dexter Tamio Chun, Vaishnav Srinivas
  • Publication number: 20150194959
    Abstract: A method of controlling signal termination includes providing first logic for selectively terminating signals received at a first device on a bidirectional data bus, providing second logic for selectively terminating signals received at a second device on the bidirectional data bus, sending first signals from the first device to the second device on the bidirectional data bus at a first speed, stopping the sending of the first signals, after stopping the sending of the first signals, enabling the second logic and shifting a reference voltage of the second device from a first level to a second level, after enabling the second logic at the second device, sending second signals from the first device to the second device on the bidirectional data bus at a higher speed, and controlling the first logic based on a speed of signals received at the first device on the bidirectional data bus.
    Type: Application
    Filed: March 19, 2015
    Publication date: July 9, 2015
    Inventors: Dexter Tamio CHUN, Sumeet SETHI, John EATON, Vinodh CUPPU, Vikram ARORA, Vaishnav SRINIVAS, Asim Muhammed MUNEER, Isaac BERK
  • Publication number: 20150186267
    Abstract: Aspects include computing devices, systems, and methods for reorganizing the storage of data in memory to energize less than all of the memory devices of a memory module for read or write transactions. The memory devices may be connected to individual select lines such that a re-order logic may determine the memory devices to energize for a transaction according to a re-ordered memory map. The re-order logic may re-order memory addresses such that memory address provided by a processor for a transaction are converted to the re-ordered memory address according to the re-ordered memory map without the processor having to change its memory address scheme. The re-ordered memory map may provide for reduced energy consumption by the memory devices, or a balance of energy consumption and performance speed for latency tolerant processes.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 2, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Dexter Tamio Chun, Haw-Jing Lo, Michael Drop
  • Publication number: 20150067234
    Abstract: An enhanced multi chip package (eMCP) is provided including a unified memory controller. The UMC is configured to manage different types of memory, such as NAND flash memory and DRAM on the eMCP. The UMC provides storage memory management, DRAM management, DRAM accessibility for storage memory management, and storage memory accessibility for DRAM management. The UMC also facilitates direct data copying from DRAM to storage memory and vice versa. The direct copying may be initiated by the UMC without interaction from a host, or may be initiated by a host.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 5, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Hyunsuk SHIN, Jung Pill KIM, Dexter Tamio CHUN, Jungwon SUH
  • Publication number: 20140264836
    Abstract: An integrated circuit package is disclosed that includes a first-pitch die and a second-pitch die. The second-pitch die interconnects to the second-pitch substrate through second-pitch substrates. The first-pitch die interconnects through first-pitch interconnects to an interposer adapter. The pitch of the first-pitch interconnects is too fine for the second-pitch substrate. But the interposer adapter interconnects through second-pitch interconnects to the second-pitch substrate and includes through substrate vias so that I/O signaling between the first-pitch die and the second-pitch die can be conducted through the second-pitch substrate and through the through substrate vias in the interposer adapter.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Dexter Tamio Chun, Jungwon Suh, Urmi Ray, Shiqun Gu
  • Patent number: 8291226
    Abstract: Techniques to securely boot up an electronics device (e.g., a cellular phone) from an external storage device are described. Secure data (e.g., a hash digest, a signature, a cryptographic key, and so on) is initially retrieved from a non-writable area of an external memory device (e.g., an one-time programmable (OTP) area of a NAND Flash device). A first program (e.g., a boot program) is retrieved from a writable or main area of the external memory device and authenticated based on the secure data. The first program is enabled for execution if authenticated. A second program may be retrieved from the main area of the external memory device and authenticated based on the secure data. The second program is enabled for execution if authenticated. Additional programs may be retrieved and authenticated. Each program may be authenticated using a secure hash function, a digital signature, and/or some other cryptographic technique.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: October 16, 2012
    Assignee: QUALCOMM Incorporated
    Inventors: Dexter Tamio Chun, Ajit B. Patil, Cuneyt Fitoz, Dwight Gordon, Yu-Hsiang Huang, Oliver Michaelis
  • Patent number: 7061804
    Abstract: Techniques for quickly and reliably accessing a memory device (e.g., a NAND Flash memory) with adaptive interface timing are described. For memory access with adaptive interface timing, the NAND Flash memory is accessed at an initial memory access rate, which may be the rate predicted to achieve reliable memory access. Error correction coding (ECC), which is often employed for NAND Flash memory, is then used to ensure reliable access of the NAND Flash. For a read operation, one page of data is read at a time from the NAND Flash memory, and the ECC determines whether the page read from the NAND Flash memory contains any errors. If errors are encountered, then a slower memory access rate is selected, and the page with error is read again from the NAND Flash memory at the new rate. The techniques may be used to write data to the NAND Flash memory.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: June 13, 2006
    Assignee: QUALCOMM Incorporated
    Inventors: Dexter Tamio Chun, Ajit Patil, Ian Huang, Jason Chan, Timothy Gold