Abstract: The invention relates to a disposable 3D printer cartridge for inserting into an exposure device for producing an object which is constructed in additive layers, wherein the cartridge contains at least one polymerizable liquid, or a polymerizable liquid can be filled into the cartridge. The cartridge comprises: a first lower housing part, a second upper housing part which can be removed from the first housing part, a support platform which forms the lower face of the second housing part, the object constructed in additive layers being arrangeable on the exterior of the support platform during the construction of the object, and a construction element which corresponds to the base of the first housing part. The layers of the object can be polymerized on the inner face of the construction element, and the inner face of the construction element has a non-stick coating.

Abstract: The invention relates to a disposable 3D printer cartridge for inserting into an exposure device for producing an object which is constructed in additive layers, wherein the cartridge contains at least one polymerizable liquid, or a polymerizable liquid can be filled into the cartridge. The cartridge comprises: a first lower housing part, a second upper housing part which can be removed from the first housing part, a support platform which forms the lower face of the second housing part, the object constructed in additive layers being arrangeable on the exterior of the support platform during the construction of the object, and a construction element which corresponds to the base of the first housing part. The layers of the object can be polymerized on the inner face of the construction element, and the inner face of the construction element has a non-stick coating.

Abstract: According to the present invention there is provided a method of handling devices comprising the steps of, receiving a tray on which devices to be tested are supported, into a flipping station; positioning the tray under a boat, so that the devices which are supported on the tray are sandwiched between the tray and a surface of the boat which can support devices, to form a first stack; flipping the first stack, so that the tray is positioned over the boat, to cause the devices to fall, under the influence of gravity, away from the tray to become supported on the surface of the boat, thereby transferring the devices from the tray to the surface of the boat; moving the boat to a testing station and testing the devices on the boat; receiving the boat of tested devices into the flipping station; positioning a tray over the boat, so that the devices which are supported on the surface of the boat are sandwiched between the surface of the boat and tray to form a second stack; flipping the second stack so that the bo

Abstract: According to the invention, there is provided a boat which comprises, a surface on which a plurality of electronic components can be supported, the surface having a plurality holes defined therein through which a vacuum can be passed to hold components on the surface; and a first vacuum inlet which is in fluid communication with the plurality of holes, wherein the first vacuum inlet can be fluidly connected to a first vacuum generating means so that the first vacuum generating means can provide a vacuum at the plurality of holes; a second vacuum inlet which is in fluid communication with the same plurality of holes with which the first vacuum inlet is in fluid communication with, wherein the second vacuum inlet can be fluidly connected to a second vacuum generating means so that the second vacuum generating means can provide a vacuum at the plurality of holes.

Abstract: According to the present invention there is provided a method of handling devices comprising the steps of, receiving a tray on which devices to be tested are supported, into a flipping station; positioning the tray under a boat, so that the devices which are supported on the tray are sandwiched between the tray and a surface of the boat which can support devices, to form a first stack; flipping the first stack, so that the tray is positioned over the boat, to cause the devices to fall, under the influence of gravity, away from the tray to become supported on the surface of the boat, thereby transferring the devices from the tray to the surface of the boat; moving the boat to a testing station and testing the devices on the boat; receiving the boat of tested devices into the flipping station; positioning a tray over the boat, so that the devices which are supported on the surface of the boat are sandwiched between the surface of the boat and tray to form a second stack; flipping the second stack so that the bo

Abstract: According to the invention, there is provided a boat which comprises, a surface on which a plurality of electronic components can be supported, the surface having a plurality holes defined therein through which a vacuum can be passed to hold components on the surface; and a first vacuum inlet which is in fluid communication with the plurality of holes, wherein the first vacuum inlet can be fluidly connected to a first vacuum generating means so that the first vacuum generating means can provide a vacuum at the plurality of holes; a second vacuum inlet which is in fluid communication with the same plurality of holes with which the first vacuum inlet is in fluid communication with, wherein the second vacuum inlet can be fluidly connected to a second vacuum generating means so that the second vacuum generating means can provide a vacuum at the plurality of holes.

Abstract: According to the present invention there is provided a component handling assembly ( ) suitable for facilitating loading or unloading a plurality of components onto/from a carrier, the assembly comprising, a carrier (1) which comprises a surface (3) on which a plurality of components (50) can be supported, wherein the surface (3) has a plurality of holes (5) defined therein; a vacuum generator (21) which can be arranged in fluid communication with said plurality of holes (5) in the surface (3) of the carrier (1) so that a vacuum can be applied, through said plurality of holes (5), to components (50) supported on the surface (3) of the carrier (1), to hold components (50) on the surface (3) of the carrier (5); a vacuum sensor (22) for sensing the level of vacuum applied to components (50) supported on the surface (3) of the carrier; a controller (23) for controlling the vacuum generator (21) during loading and/or unloading of component(s) onto/from the surface (3) of the carrier, based on the level of vacuum s

Abstract: A method and an arrangement for providing chalcogens as thin layers on substrates, in particular on planar substrates prepared with precursor layers and composed of any desired materials, preferably on substrates composed of float glass, is achieved by forming an inlet- and outlet-side gas curtain for an oxygen-tight closure of a transport channel in a vapour deposition head, introducing an inert gas into the transport channel for displacing atmospheric oxygen, introducing one or more substrates to be coated, the substrates being temperature-regulated to a predetermined temperature, into the transport channel, introducing a chalcogen vapour/carrier gas mixture from a source into the transport channel at the vapour deposition head above the substrates and forming a selenium layer on the substrates by PVD at a predetermined pressure, and removing the substrates after a predetermined process time has elapsed.

Abstract: In a method for producing a I-III-VI compound semiconductor layer, a substrate is provided with a coating which has a metallic precursor layer. The coating is kept, for the duration of a process time, at temperatures of at least 350 degrees C. and the metallic precursor layer, in the presence of a chalcogen at an ambient pressure of between 500 mbar and 1500 mbar, is converted into a compound semiconductor layer. The coating is kept at temperatures for the duration of an activation time which attain at least an activation barrier temperature, whereby as the activation barrier temperature a value of at least 600° C. is selected.

Abstract: In a method for producing a I-III-VI compound semiconductor layer, a substrate is provided with a coating which has a metallic precursor layer. The coating is kept, for the duration of a process time, at temperatures of at least 350 degrees C. and the metallic precursor layer, in the presence of a chalcogen at an ambient pressure of between 500 mbar and 1500 mbar, is converted into a compound semiconductor layer. The coating is kept at temperatures for the duration of an activation time which attain at least an activation barrier temperature, whereby as the activation barrier temperature a value of at least 600° C. is selected.

Abstract: A method and device for separation of chalcogens from waste gases in process installations are provided so that complete and reliable removal of chalcogens occurs continuously during nonstop operation of the process installation in the most effective manner possible. The process installation is connected via a pipeline to an input connector of the device for separation of chalcogens arranged outside of the process installation. The pipeline and the input connector have a heat connection to the process chamber. The device for separation of chalcogens is provided with an outlet connector as well as a gas outlet is equipped with a cooling device so that the input connector is excluded from cooling.

Abstract: A method deposits a layer of an indium chalcogenide onto a substrate. The method includes the steps of: providing an indium source in a reaction zone, providing a gaseous source of a chalcogen in the reaction zone, and heating the substrate. Thereby in the reaction zone, at a pressure of approximately atmospheric ambient pressure, the indium originating from the indium source and the chalcogen originating from the source of a chalcogen are converted to an indium chalcogenide being deposited onto the surface of the substrate.

Abstract: An accelerated and simple-to-realize fast method for thermally converting metallic precursor layers on any desired substrates into semiconducting layers, and also an apparatus suitable for carrying out the method and serving for producing solar modules with high efficiency are provided. The substrates previously prepared at least with a metallic precursor layer are heated in a furnace, which is segmented into a plurality of temperature regions, at a pressure at approximately atmospheric ambient pressure in a plurality of steps in each case to a predetermined temperature up to an end temperature between 400° C. and 600° C. and are converted into semiconducting layers whilst maintaining the end temperature in an atmosphere comprising a mixture of a carrier gas and vaporous chalcogens.

Abstract: A method and an arrangement for providing chalcogens as thin layers on substrates, in particular on planar substrates prepared with precursor layers and composed of any desired materials, preferably on substrates composed of float glass is achieved by forming an inlet- and outlet-side gas curtain for an oxygen-tight closure of a transport channel in a vapour deposition head, introducing an inert gas into the transport channel for displacing atmospheric oxygen, introducing one or more substrates to be coated, the substrates being temperature-regulated to a predetermined temperature, into the transport channel, introducing a chalcogen vapour/carrier gas mixture from a source into the transport channel at the vapour deposition head above the substrates and forming a selenium layer on the substrates by PVD at a predetermined pressure, and removing the substrates after a predetermined process time has elapsed.

Abstract: The object of the invention is a spreading plug which preferably comprises plastic and has a plurality of slots in the plug cover, between which slots spreading segments are formed which are spread outward against the wall of the drilled hole when a screw or another spreading element is screwed into the central insertion channel of the plug. In order to obtain a plurality of spreading regions which are distributed over the axial plug length, for the purpose of a more uniform spreading action, a plurality of slot arrangements are provided which are arranged offset with respect to one another both in the circumferential direction and in the axial direction. Preferably, a first slot which extends over the diameter of the plug is provided over a part length of the shaft and a further continuous slot is provided, offset in the circumferential direction by 90°, over the remaining part of the plug length as far as the plug base. Here, the two slot pairs overlap one another in the central region.

Abstract: A method and device for separation of chalcogens from waste gases in process installations are provided so that complete and reliable removal of chalcogens occurs continuously during nonstop operation of the process installation in the most effective manner possible. The process installation is connected via a pipeline to an input connector of the device for separation of chalcogens arranged outside of the process installation. The pipeline and the input connector have a heat connection to the process chamber. The device for separation of chalcogens is provided with an outlet connector as well as a gas outlet is equipped with a cooling device so that the input connector is excluded from cooling.

Abstract: The invention relates to a method and a device for reacting metallic precursors with sulfur and/or selenium to chalcopyrite layers of CIGSS solar cells in a reaction chamber of an RTP furnace. The aim of the invention is to produce thin-layer solar modules. Said aim is achieved by introducing a substrate coated with the precursor as well as an amount of sulfur and/or selenium that is sufficient to carry out the reaction into a sealingly closable reaction box which is provided with at least one discharge valve that can be controlled from outside the reaction chamber. The reaction box is introduced into the reaction chamber of the RTP furnace, the reaction chamber is evacuated, the reaction box is heated to a predetermined temperature in the reaction chamber along with the substrate and is maintained at said temperature for a certain process time, the pressure in the reaction box being measured and being controlled via the at least one discharge valve during the process time.

Abstract: A closeable dispensing device for dispensing a liquid, viscous or pasty medium contained in a container, has an outlet opening which serves for dispensing the medium. The device further has a channel that extends between the container and the outlet opening, and a closure device which is inserted into an opening of the dispensing device. The closure device is movable relative to the opening and is intended for closing the channel. The closure device and a surface bounding the opening come into contact only via elevations provided on the closure device or on the surface adjacent to the opening.

Abstract: An apparatus for cleaning and/or removing images from surfaces, in particular from roll or cylinder surfaces or printing forms is provided. The cleaning apparatus includes one or more blasting nozzles for discharging water in the form of crystalline ice particles or CO2 particles/pellets onto the surfaces to be cleaned. The discharging crystalline ice or CO2 particles effectively remove dirt particles or ink-carrying polymers from the surface to be cleaned. The dislodged material and the waste ice, which may have changed into water droplets, are removed from the surface and taken away.

Abstract: A folding-aid mark on a folded product, includes a folding mark for identifying the intended course of a fold, and additional lines for identifying the tolerance limits of a predefined tolerance range in the region of the folding mark.