Abstract: A hybrid architecture that combines the efficiency of small language models with the accuracy of large language models for enhanced selection of requested functionality and identification of data visualizations using a network system is described. For instance, an orchestration module employs a hybrid architecture using both small language models and large language models to generate API payloads for clients in a way that harnesses the benefits of both models.

Abstract: A hybrid architecture that combines the efficiency of small language models with the accuracy of large language models for enhanced selection of requested functionality and identification of data visualizations using a network system is described. For instance, an orchestration module employs a hybrid architecture using both small language models and large language models to generate API payloads for clients in a way that harnesses the benefits of both models.

Abstract: A method includes obtaining chunks of information and generating training samples for an embedding model using the chunks of information. Generating the training samples includes using at least one large language model to generate training samples in which different ones of the chunks of information are and are not relevant to different potential queries. The method also includes training the embedding model using the training samples. In some cases, the embedding model may represent a retriever model. For example, an input query may be obtained at the retriever model, and the retriever model may be configured to identify a specified number of chunks of information relevant to the input query. One or more of the chunks of information may be provided from the retriever model to a generative model, and the generative model may be used to create a response to the input query.

Abstract: A method includes obtaining an input query at a retriever model, where the retriever model includes a reconfigurable sequence of one or more rankers selected from among a plurality of rankers. Each ranker is configured to identify a specified number of information chunks relevant to the input query. The method also includes providing one or more of the information chunks from the retriever model to a generative model. The method further includes using the generative model to create a response to the input query, where the response is based on the one or more information chunks. The plurality of rankers includes a bi-encoder, a cross-encoder, and a large language model (LLM)-ranker.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network link between a first customer virtual network in a first cloud environment and a second customer virtual network in a second cloud environment. The first customer virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network link is created based on one or more link-enabling virtual networks that are deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on network resources and one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network-link between a virtual network in a cloud environment and a service endpoint associated with a service provided by another cloud environment. The network-link is created based on network resources and one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for establishing a private network path from a first cloud environment to a second cloud environment. A tenancy associated with the first cloud environment is provided in the second cloud environment. The tenancy includes a set of one or more resources that enable communication between the first cloud environment and the second cloud environment. A request originating in the second cloud environment and associated with a service provided by the first cloud environment is caused to be received by a first resource from the set of one or more resources. Using at least one resource from the set of one or more resources, the request is transmitted from the second cloud environment to first cloud environment.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.

Abstract: The subject disclosure relates to 3D microelectronic chip packages with embedded coolant channels. The disclosed 3D microelectronic chip packages provide a complete and practical mechanism for introducing cooling channels within the 3D chip stack while maintaining the electrical connection through the chip stack. According to an embodiment, a microelectronic package is provided that comprises a first silicon chip comprising first coolant channels interspersed between first thru-silicon-vias (TSVs). The microelectronic chip package further comprises a silicon cap attached to a first surface of the first silicon chip, the silicon cap comprising second TSVs that connect to the first TSVs. A second silicon chip comprising second coolant channels can further be attached to the silicon cap via interconnects formed between a first surface of the second silicon chip and the silicon cap, wherein the interconnects connect to the second TSVs.

Abstract: Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.

Abstract: A stacked semiconductor microcooler includes a first and second semiconductor microcooler. Each microcooler includes silicon fins extending from a silicon substrate. A metal layer may be formed upon the fins. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.