Abstract: Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.

Abstract: In general, techniques are described for load balancing, with a service node, packet flows using stateless load balancing that adapts to server failure to provide flow affinity to initially selected servers for the duration of respective flows. In one example, service node device applies stateless load balancing to packet flows to distribute the flows among a plurality of servers. The service node determines a failure of a failed server and then receives an initial packet of a packet flow from the packet flows and forwards the initial packet to an active server. The service node generates a mapping of the packet flow to the active server, determines a recovery of the failed server, receives a subsequent packet of the packet flow, and forwards the subsequent packet of the packet flow to the active server based at least on the mapping of the packet flow to the active server.

Abstract: In one embodiment of the invention, a method includes partitioning an integrated circuit design into a hierarchy of a top level and a plurality of partitions, wherein the top level includes a top level netlist and each partition includes a partition netlist; receiving data path timing budgets and clock path timing budgets for each of the plurality of partitions of the integrated circuit design; and generating a timing budget model of each partition in response to the respective data path timing budgets and clock path timing budgets, wherein each timing budget model includes an intra-partition clock timing constraint for each respective partition for independent implementation of the top level.

Abstract: In one embodiment, a method of designing an integrated circuit is disclosed, including receiving a first partition block for a top level of a hierarchical design of an integrated circuit; analyzing each pin of the first partition block for an attribute associated with the pin indicating a timing exception; and if a timing exception other than false path is indicated then generating an internal timing pin in a first timing graph model of the first partition block for each timing exception, and adding a timing arc and a dummy arc coupled to the internal timing pin in the first timing graph model of the first partition block. The internal timing pin adds a timing exception constraint for each timing exception. Timing of the top level may then be analyzed with the first timing graph model to determine if timing constraints, including the added timing exception constraints, are met.

Abstract: A guide catheter has an inlet orifice that allows blood to enter an interior passage of the catheter. A valve is positioned next to the inlet orifice that selectively opens and closes the inlet orifice. The catheter includes a dye passage that transports dye from a proximal end of the catheter to a dye outlet orifice. The dye passage may be formed in a unitary tubular member, a partitioned tubular member or in the clearances of a double-walled catheter. A valve may also be positioned next to the dye outlet orifices that selectively opens and closes the orifices. The valves are preferably kidney-shaped expandable bladders or pressure valves. A capillary tube connected to the expandable bladder functions to inflate and deflate the expandable bladder. The expandable bladders and capillary tubes are incorporated into the wall of the catheter.

Abstract: A system and method of designing an integrated circuit capable of deriving timing constraints for individual block-level circuits of an integrated circuit that are derived from the chip-level timing constraints and analysis. The block-level timing constraints are in the form of one or more logical timing constraint points at the input and output ports of block-level circuits. Each logical timing constraint points specifies a clock source used to clock data through the port, a delay parameter specifying data propagation delay backward from an input port and forward from an output port, and any timing exception associated with the data path. Using the logical timing constraint point, the circuit design system performs independent timing analysis and optimization of each block-level circuit. The system then reassembles the block-level circuits into a modified chip-level circuit for which timing closure can be achieved.

Abstract: In one embodiment of the invention, a method includes partitioning an integrated circuit design into a hierarchy of a top level and a plurality of partitions, wherein the top level includes a top level netlist and each partition includes a partition netlist; receiving data path timing budgets and clock path timing budgets for each of the plurality of partitions of the integrated circuit design; and generating a timing budget model of each partition in response to the respective data path timing budgets and clock path timing budgets, wherein each timing budget model includes an intra-partition clock timing constraint for each respective partition for independent implementation of the top level.

Abstract: In one embodiment, a method of designing an integrated circuit is disclosed, including receiving a first partition block for a top level of a hierarchical design of an integrated circuit; analyzing each pin of the first partition block for an attribute associated with the pin indicating a timing exception; and if a timing exception other than false path is indicated then generating an internal timing pin in a first timing graph model of the first partition block for each timing exception, and adding a timing arc and a dummy arc coupled to the internal timing pin in the first timing graph model of the first partition block. The internal timing pin adds a timing exception constraint for each timing exception. Timing of the top level may then be analyzed with the first timing graph model to determine if timing constraints, including the added timing exception constraints, are met.

Abstract: In one embodiment of the invention, a method includes partitioning an integrated circuit design into a hierarchy of a top level and a plurality of partitions, wherein the top level includes a top level netlist and each partition includes a partition netlist; receiving data path timing budgets and clock path timing budgets for each of the plurality of partitions of the integrated circuit design; and generating a timing budget model of each partition in response to the respective data path timing budgets and clock path timing budgets, wherein each timing budget model includes an intra-partition clock timing constraint for each respective partition for independent implementation of the top level.

Abstract: In one embodiment of the invention, a method includes partitioning an integrated circuit design into a hierarchy of a top level and a plurality of partitions, wherein the top level includes a top level netlist and each partition includes a partition netlist; receiving data path timing budgets and clock path timing budgets for each of the plurality of partitions of the integrated circuit design; and generating a timing budget model of each partition in response to the respective data path timing budgets and clock path timing budgets, wherein each timing budget model includes an intra-partition clock timing constraint for each respective partition for independent implementation of the top level.

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

Abstract: A system and method of designing an integrated circuit capable of deriving timing constraints for individual block-level circuits of an integrated circuit that are derived from the chip-level timing constraints and analysis. The block-level timing constraints are in the form of one or more logical timing constraint points at the input and output ports of block-level circuits. Each logical timing constraint points specifies a clock source used to clock data through the port, a delay parameter specifying data propagation delay backward from an input port and forward from an output port, and any timing exception associated with the data path. Using the logical timing constraint point, the circuit design system performs independent timing analysis and optimization of each block-level circuit. The system then reassembles the block-level circuits into a modified chip-level circuit for which timing closure can be achieved.

Abstract: Write logic and read logic are coupled to SDRAM and a frame status table. VCG members are written into SDRAM by the write logic and an entry (based on the MFI and SQ) in the frame status table is maintained by the write logic for each member. The read logic scans the frame status table to identify the earliest frame number for which data is available in SDRAM. Based on the frame status and the address pointer offset, the read logic maintains a state table entry for each VCG member and a state for each VCG. According to the preferred embodiment, the read logic is provided in two parts separated by a temporary buffer. The first part of the read logic performs the functions described above and writes chunk data into the temporary buffer. The second part of the read logic reads byte data from the temporary buffer according to a selectable leak rate.

Abstract: A refractory metal core for use in a casting system has a coating for providing oxidation resistance during shell fire and protection against reaction/dissolution during casting. In a first embodiment, the coating includes at least one oxide and a silicon containing material. In a second embodiment, the coating includes an oxide selected from the group of calcia, magnesia, alumina, zirconia, chromia, yttria, silica, hafnia, and mixtures thereof. In a third embodiment, the coating includes a nitride selected from the group of silicon nitride, sialon, titanium nitride, and mixtures thereof. Other coating embodiments are described in the disclosure.

Abstract: Combined hardware and software processing is applied in an end node of the network which includes mapping/demapping and deskewing. Most of the LCAS procedure is implemented in software so that it can be modified easily. Some of the procedure is implemented in hardware to meet stringent timing requirements. In particular, the handshaking protocol is implemented in software and the procedure for actually changing of the link capacity in response to the handshaking is implemented in hardware. The hardware and software communicate via a shared memory which includes a receive packet FIFO, receive control and status registers, a transmit packet FIFO, transmit control and status registers, and a transmit time slot interchange table.

Abstract: A refractory metal core for use in a casting system has a coating for providing oxidation resistance during shell fire and protection against reaction/dissolution during casting. In a first embodiment, the coating includes at least one oxide and a silicon containing material. In a second embodiment, the coating includes an oxide selected from the group of calcia, magnesia, alumina, zirconia, chromia, yttria, silica, hafnia, and mixtures thereof. In a third embodiment, the coating includes a nitride selected from the group of silicon nitride, sialon, titanium nitride, and mixtures thereof. Other coating embodiments are described in the disclosure.

Abstract: Combined hardware and software processing is applied in an end node of the network which includes mapping/demapping and deskewing. Most of the LCAS procedure is implemented in software so that it can be modified easily. Some of the procedure is implemented in hardware to meet stringent timing requirements. In particular, the handshaking protocol is implemented in software and the procedure for actually changing of the link capacity in response to the handshaking is implemented in hardware. The hardware and software communicate via a shared memory which includes a receive packet FIFO, receive control and status registers, a transmit packet FIFO, transmit control and status registers, and a transmit time slot interchange table.

Abstract: Write logic and read logic are coupled to SDRAM and a frame status table. VCG members are written into SDRAM by the write logic and an entry (based on the MFI and SQ) in the frame status table is maintained by the write logic for each member. The read logic scans the frame status table to identify the earliest frame number for which data is available in SDRAM. Based on the frame status and the address pointer offset, the read logic maintains a state table entry for each VCG member and a state for each VCG. According to the preferred embodiment, the read logic is provided in two parts separated by a temporary buffer. The first part of the read logic performs the functions described above and writes chunk data into the temporary buffer. The second part of the read logic reads byte data from the temporary buffer according to a selectable leak rate.

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.