Patents by Inventor Dinesh Gupta
Dinesh Gupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040217464Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.Type: ApplicationFiled: May 2, 2003Publication date: November 4, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Steven Ostrander, Brenda L. Peterson, Mark V. Pierson, Eugen Schenfeld, Subhash L. Shinde
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Patent number: 6713686Abstract: A multi chip module substrate arranged with repair vias and repair lines extending between repair vias of the chip sites of the module by which repairs can be effected to overcome defects in the module circuits and a method for effecting the repairs of defects in the circuits of this module. A defect can occur in any one of a first signal via, a second signal via, and a circuit line extending between and intended to electrically connect the first signal via and the second signal via. After a defective circuit is identified, the signal vias of the circuit are isolated. Then, the first signal via of the defective circuit is electrically connected to that repair via of the chip site having the first signal via that is connected to that repair via of the chip site having the second signal via and the second signal via of the defective circuit is electrically connected to that repair via of the chip site having the second signal via that is connected to that repair via of the chip site having the first signal via.Type: GrantFiled: January 18, 2002Date of Patent: March 30, 2004Assignee: International Business Machines CorporationInventors: Wiren D. Becker, Dinesh Gupta, Sudipta K. Ray, Robert A. Rita, Herbert I. Stoller, Kathleen M. Wiley
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Patent number: 6662718Abstract: A screening mask having a stress-relieving area including an inner functional area having a pattern which is replicated on an underlying substrate, the inner functional area pattern having an one open area through which a paste is extruded and at least one tab, and an outer nonfunctional area distinct from the inner functional area, the outer nonfunctional area having a stress-relieving area adjacent to an edge of the screening mask that protects the at least one tab in the inner functional area from breaking.Type: GrantFiled: June 29, 2001Date of Patent: December 16, 2003Assignee: International Business Machines CorporationInventors: Evelyn Barrington, Jeffrey A. Brody, Harry David Cox, Lorraine Di Piero-Simmonds, John J. Garant, Dinesh Gupta, Edward J. Hassdenteufel, III, Hsichang Liu, Paul G. McLaughlin, Ahmed S. Shah, Charles Timothy Ryan, Richard C. Steger, John A. Trumpetto
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Patent number: 6631675Abstract: A screening mask for screening an article, the screening mask including a screening mask body having a screening side and a nonscreening side, an one opening through the mask for screening at least one feature from the screening side to the nonscreening side, and a blind opening for protecting a previously screened feature. The blind opening is blocked on the screening side and open on the nonscreening side. The screening mask is used in double pass screening so that a second feature may be formed on the article without damaging a previously formed feature.Type: GrantFiled: April 27, 2001Date of Patent: October 14, 2003Assignee: International Business Machines CorporationInventors: Jeffrey A. Brody, Harry D. Cox, John J. Garant, Dinesh Gupta, Dale W. Snowdon
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Publication number: 20030152814Abstract: A superalloy article is disclosed having a thermal barrier coating. The article comprises a superalloy substrate, an adherent alumina layer on the substrate, and a ceramic, thermally insulating layer on the alumina layer. The ceramic layer has an overall thickness and comprises a relatively strain tolerant, columnar grain ceramic on the alumina layer and relatively more thermally insulating ceramic on the columnar grain ceramic. The alumina layer may be formed using an alumina forming layer such as an overlay or aluminide bond coat, or the superalloy may comprise a material that is capable of forming an alumina layer. The ceramic layers may be formed of a stabilized zirconia or other suitable material, and may have the same or different compositions.Type: ApplicationFiled: February 11, 2002Publication date: August 14, 2003Inventors: Dinesh Gupta, David L. Lambert, Mladen F. Trubelja, Michael J. Maloney, Nicholas E. Ulion, David A. Litton
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Publication number: 20030136581Abstract: A multi chip module substrate arranged with repair vias and repair lines extending between repair vias of the chip sites of the module by which repairs can be effected to overcome defects in the module circuits and a method for effecting the repairs of defects in the circuits of this module. A defect can occur in any one of a first signal via, a second signal via, and a circuit line extending between and intended to electrically connect the first signal via and the second signal via. After a defective circuit is identified, the signal vias of the circuit are isolated. Then, the first signal via of the defective circuit is electrically connected to that repair via of the chip site having the first signal via that is connected to that repair via of the chip site having the second signal via and the second signal via of the defective circuit is electrically connected to that repair via of the chip site having the second signal via that is connected to that repair via of the chip site having the first signal via.Type: ApplicationFiled: January 18, 2002Publication date: July 24, 2003Applicant: International Business Machines CorporationInventors: Wiren D. Becker, Dinesh Gupta, Sudipta K. Ray, Robert A. Rita, Herbert I. Stoller, Kathleen M. Wiley
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Publication number: 20030004076Abstract: A screening mask having a stress-relieving area including an inner functional area having a pattern which is replicated on an underlying substrate, the inner functional area pattern having an one open area through which a paste is extruded and at least one tab, and an outer nonfunctional area distinct from the inner functional area, the outer nonfunctional area having a stress-relieving area adjacent to an edge of the screening mask that protects the at least one tab in the inner functional area from breaking.Type: ApplicationFiled: June 29, 2001Publication date: January 2, 2003Applicant: International Business Machines CorporationInventors: Evelyn Barrington, Jeffrey A. Brody, Harry David Cox, Lorraine Di Piero-Simmonds, John J. Garant, Dinesh Gupta, Edward J. Hassdenteufel, Hsichang Liu, Paul G. McLaughlin, Ahmed S. Shah, Charles Timothy Ryan, Richard C. Steger, John A. Trumpetto
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Patent number: 6475555Abstract: A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.Type: GrantFiled: October 29, 1999Date of Patent: November 5, 2002Assignee: International Business Machines CorporationInventors: Jon A. Casey, Dinesh Gupta, Lester Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Brenda L. Peterson, Robert A. Rita
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Publication number: 20020157546Abstract: A screening mask for screening an article, the screening mask including a screening mask body having a screening side and a nonscreening side, an one opening through the mask for screening at least one feature from the screening side to the nonscreening side, and a blind opening for protecting a previously screened feature. The blind opening is blocked on the screening side and open on the nonscreening side. The screening mask is used in double pass screening so that a second feature may be formed on the article without damaging a previously formed feature.Type: ApplicationFiled: April 27, 2001Publication date: October 31, 2002Applicant: International Business Machines CorporationInventors: Jeffrey A. Brody, Harry D. Cox, John J. Garant, Dinesh Gupta, Dale W. Snowdon
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Publication number: 20020023779Abstract: A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.Type: ApplicationFiled: October 18, 2001Publication date: February 28, 2002Inventors: Dinesh Gupta, Lester Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Keith C. O'Neil, Brenda L. Peterson
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Patent number: 6341417Abstract: A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.Type: GrantFiled: September 23, 1999Date of Patent: January 29, 2002Assignee: International Business Machines CorporationInventors: Dinesh Gupta, Lester Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Keith C. O'Neil, Brenda L. Peterson
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Publication number: 20020009539Abstract: A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.Type: ApplicationFiled: October 29, 1999Publication date: January 24, 2002Inventors: JON A. CASEY, DINESH GUPTA, LESTER WYNN HERRON, JOHN U. KNICKERBOCKER, DAVID C. LONG, JAWAHAR P. NAYAK, BRENDA L. PETERSON, ROBERT A. RITA
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Patent number: 6245185Abstract: Disclosed is a method of making a multilayer ceramic product with thin layers, the method including the steps of: (a) providing a thick ceramic greensheet and a plurality of thin ceramic greensheets; (b) aligning and stacking the thin ceramic greensheet on the thick ceramic greensheet; (c) bonding the thin ceramic greensheet to the thick ceramic greensheet; (d) aligning and stacking one thin ceramic greensheet on the previous thin ceramic greensheet; (e) bonding the thin ceramic greensheet in step (d) to the previous thin ceramic greensheet; and (f) simultaneously forming at least one unfilled via in the stack of thick and thin ceramic greensheets.Type: GrantFiled: July 15, 1999Date of Patent: June 12, 2001Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, Dinesh Gupta, Govindarajan Natarajan
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Patent number: 6231707Abstract: In the formation of multilayer ceramic substrates, greensheets are utilized which have the same pattern and number of vias punched in each greensheet. Then, selected vias may be filled with metallic paste to form the internal connections of the multilayer ceramic substrate. The remaining vias may be filled with a fugitive material or left totally unfilled. Also disclosed is the multilayer ceramic substrate produced by this method.Type: GrantFiled: September 22, 1998Date of Patent: May 15, 2001Assignee: International Business Machines CorporationInventors: Dinesh Gupta, L. Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Robert A. Rita
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Patent number: 5655209Abstract: Process for producing multilayer ceramic substrates using greensheet technology and thin dielectric ceramic greensheets for miniaturization purposes. The process avoids the screening of the thin greensheets by forming self-supporting fusible particulate metal electrode layers, interposing them with the thin greensheets and sintering the assembly to form the multilayer substrates such as integrated capacitors.Type: GrantFiled: March 28, 1995Date of Patent: August 5, 1997Assignee: International Business Machines CorporationInventors: Jon Alfred Casey, John Paul Gauci, Dinesh Gupta, Robert Anthony Rita, Robert J. Sullivan
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Patent number: 5601672Abstract: Method for producing ceramic laminates from a plurality of greensheet layers which include one or more thin greensheet layers, e.g. having a thickness less than about 3 mils, with interposed patterned circuit layers and conductive vias, while avoiding the loss of strength and the distortion encountered when paste compositions are pre-applied to such thin greensheet layers. The invention avoids the aforementioned problems by the use of a plurality of greensheet layers including thicker, paste-resistant greensheet layers having a thickness greater than the thin greensheet layer, e.g., between 5 and 10 mils, each pair of the thicker greensheet layers confining therebetween an unscreened thin greensheet layer, one of the thicker greensheet layers also being screened with the circuit pattern layer normally applied to the interposed thin greensheet layer. Thereafter the superposed layers are laminated and sintered to form the composite.Type: GrantFiled: November 1, 1994Date of Patent: February 11, 1997Assignee: International Business Machines CorporationInventors: Jon A. Casey, Dinesh Gupta, James R. Wylder
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Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
Patent number: 5480503Abstract: Process for producing circuitized greensheets including multi-layer ceramic sub-laminates and composites comprising thin ceramic greensheets carrying and thin, fine line patterned conductive metal layers. The invention comprises releasably-supporting the thin greensheets on a temporary carrier support having an ablatable release layer, preferably over a patterned conductive layer, and filling the vias with conductive metal paste, whereby the thin greensheets are supported against warpage and distortion. The supported greensheets are formed as single layers, pairs and stacks thereof, as desired, and thereafter separated from the temporary support for use.Type: GrantFiled: December 30, 1993Date of Patent: January 2, 1996Assignee: International Business Machines CorporationInventors: Jon A. Casey, David B. Goland, Dinesh Gupta, Lester W. Herron, James N. Humenik, Thomas E. Lombardi, John U. Knickerbocker, Robert J. Sullivan, James R. Wylder