Patents by Inventor Dinesh Gupta

Dinesh Gupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040217464
    Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.
    Type: Application
    Filed: May 2, 2003
    Publication date: November 4, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Steven Ostrander, Brenda L. Peterson, Mark V. Pierson, Eugen Schenfeld, Subhash L. Shinde
  • Patent number: 6713686
    Abstract: A multi chip module substrate arranged with repair vias and repair lines extending between repair vias of the chip sites of the module by which repairs can be effected to overcome defects in the module circuits and a method for effecting the repairs of defects in the circuits of this module. A defect can occur in any one of a first signal via, a second signal via, and a circuit line extending between and intended to electrically connect the first signal via and the second signal via. After a defective circuit is identified, the signal vias of the circuit are isolated. Then, the first signal via of the defective circuit is electrically connected to that repair via of the chip site having the first signal via that is connected to that repair via of the chip site having the second signal via and the second signal via of the defective circuit is electrically connected to that repair via of the chip site having the second signal via that is connected to that repair via of the chip site having the first signal via.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: March 30, 2004
    Assignee: International Business Machines Corporation
    Inventors: Wiren D. Becker, Dinesh Gupta, Sudipta K. Ray, Robert A. Rita, Herbert I. Stoller, Kathleen M. Wiley
  • Patent number: 6662718
    Abstract: A screening mask having a stress-relieving area including an inner functional area having a pattern which is replicated on an underlying substrate, the inner functional area pattern having an one open area through which a paste is extruded and at least one tab, and an outer nonfunctional area distinct from the inner functional area, the outer nonfunctional area having a stress-relieving area adjacent to an edge of the screening mask that protects the at least one tab in the inner functional area from breaking.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: December 16, 2003
    Assignee: International Business Machines Corporation
    Inventors: Evelyn Barrington, Jeffrey A. Brody, Harry David Cox, Lorraine Di Piero-Simmonds, John J. Garant, Dinesh Gupta, Edward J. Hassdenteufel, III, Hsichang Liu, Paul G. McLaughlin, Ahmed S. Shah, Charles Timothy Ryan, Richard C. Steger, John A. Trumpetto
  • Patent number: 6631675
    Abstract: A screening mask for screening an article, the screening mask including a screening mask body having a screening side and a nonscreening side, an one opening through the mask for screening at least one feature from the screening side to the nonscreening side, and a blind opening for protecting a previously screened feature. The blind opening is blocked on the screening side and open on the nonscreening side. The screening mask is used in double pass screening so that a second feature may be formed on the article without damaging a previously formed feature.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: October 14, 2003
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey A. Brody, Harry D. Cox, John J. Garant, Dinesh Gupta, Dale W. Snowdon
  • Publication number: 20030152814
    Abstract: A superalloy article is disclosed having a thermal barrier coating. The article comprises a superalloy substrate, an adherent alumina layer on the substrate, and a ceramic, thermally insulating layer on the alumina layer. The ceramic layer has an overall thickness and comprises a relatively strain tolerant, columnar grain ceramic on the alumina layer and relatively more thermally insulating ceramic on the columnar grain ceramic. The alumina layer may be formed using an alumina forming layer such as an overlay or aluminide bond coat, or the superalloy may comprise a material that is capable of forming an alumina layer. The ceramic layers may be formed of a stabilized zirconia or other suitable material, and may have the same or different compositions.
    Type: Application
    Filed: February 11, 2002
    Publication date: August 14, 2003
    Inventors: Dinesh Gupta, David L. Lambert, Mladen F. Trubelja, Michael J. Maloney, Nicholas E. Ulion, David A. Litton
  • Publication number: 20030136581
    Abstract: A multi chip module substrate arranged with repair vias and repair lines extending between repair vias of the chip sites of the module by which repairs can be effected to overcome defects in the module circuits and a method for effecting the repairs of defects in the circuits of this module. A defect can occur in any one of a first signal via, a second signal via, and a circuit line extending between and intended to electrically connect the first signal via and the second signal via. After a defective circuit is identified, the signal vias of the circuit are isolated. Then, the first signal via of the defective circuit is electrically connected to that repair via of the chip site having the first signal via that is connected to that repair via of the chip site having the second signal via and the second signal via of the defective circuit is electrically connected to that repair via of the chip site having the second signal via that is connected to that repair via of the chip site having the first signal via.
    Type: Application
    Filed: January 18, 2002
    Publication date: July 24, 2003
    Applicant: International Business Machines Corporation
    Inventors: Wiren D. Becker, Dinesh Gupta, Sudipta K. Ray, Robert A. Rita, Herbert I. Stoller, Kathleen M. Wiley
  • Publication number: 20030004076
    Abstract: A screening mask having a stress-relieving area including an inner functional area having a pattern which is replicated on an underlying substrate, the inner functional area pattern having an one open area through which a paste is extruded and at least one tab, and an outer nonfunctional area distinct from the inner functional area, the outer nonfunctional area having a stress-relieving area adjacent to an edge of the screening mask that protects the at least one tab in the inner functional area from breaking.
    Type: Application
    Filed: June 29, 2001
    Publication date: January 2, 2003
    Applicant: International Business Machines Corporation
    Inventors: Evelyn Barrington, Jeffrey A. Brody, Harry David Cox, Lorraine Di Piero-Simmonds, John J. Garant, Dinesh Gupta, Edward J. Hassdenteufel, Hsichang Liu, Paul G. McLaughlin, Ahmed S. Shah, Charles Timothy Ryan, Richard C. Steger, John A. Trumpetto
  • Patent number: 6475555
    Abstract: A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: November 5, 2002
    Assignee: International Business Machines Corporation
    Inventors: Jon A. Casey, Dinesh Gupta, Lester Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Brenda L. Peterson, Robert A. Rita
  • Publication number: 20020157546
    Abstract: A screening mask for screening an article, the screening mask including a screening mask body having a screening side and a nonscreening side, an one opening through the mask for screening at least one feature from the screening side to the nonscreening side, and a blind opening for protecting a previously screened feature. The blind opening is blocked on the screening side and open on the nonscreening side. The screening mask is used in double pass screening so that a second feature may be formed on the article without damaging a previously formed feature.
    Type: Application
    Filed: April 27, 2001
    Publication date: October 31, 2002
    Applicant: International Business Machines Corporation
    Inventors: Jeffrey A. Brody, Harry D. Cox, John J. Garant, Dinesh Gupta, Dale W. Snowdon
  • Publication number: 20020023779
    Abstract: A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.
    Type: Application
    Filed: October 18, 2001
    Publication date: February 28, 2002
    Inventors: Dinesh Gupta, Lester Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Keith C. O'Neil, Brenda L. Peterson
  • Patent number: 6341417
    Abstract: A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: January 29, 2002
    Assignee: International Business Machines Corporation
    Inventors: Dinesh Gupta, Lester Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Keith C. O'Neil, Brenda L. Peterson
  • Publication number: 20020009539
    Abstract: A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.
    Type: Application
    Filed: October 29, 1999
    Publication date: January 24, 2002
    Inventors: JON A. CASEY, DINESH GUPTA, LESTER WYNN HERRON, JOHN U. KNICKERBOCKER, DAVID C. LONG, JAWAHAR P. NAYAK, BRENDA L. PETERSON, ROBERT A. RITA
  • Patent number: 6245185
    Abstract: Disclosed is a method of making a multilayer ceramic product with thin layers, the method including the steps of: (a) providing a thick ceramic greensheet and a plurality of thin ceramic greensheets; (b) aligning and stacking the thin ceramic greensheet on the thick ceramic greensheet; (c) bonding the thin ceramic greensheet to the thick ceramic greensheet; (d) aligning and stacking one thin ceramic greensheet on the previous thin ceramic greensheet; (e) bonding the thin ceramic greensheet in step (d) to the previous thin ceramic greensheet; and (f) simultaneously forming at least one unfilled via in the stack of thick and thin ceramic greensheets.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: June 12, 2001
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Dinesh Gupta, Govindarajan Natarajan
  • Patent number: 6231707
    Abstract: In the formation of multilayer ceramic substrates, greensheets are utilized which have the same pattern and number of vias punched in each greensheet. Then, selected vias may be filled with metallic paste to form the internal connections of the multilayer ceramic substrate. The remaining vias may be filled with a fugitive material or left totally unfilled. Also disclosed is the multilayer ceramic substrate produced by this method.
    Type: Grant
    Filed: September 22, 1998
    Date of Patent: May 15, 2001
    Assignee: International Business Machines Corporation
    Inventors: Dinesh Gupta, L. Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Robert A. Rita
  • Patent number: 5655209
    Abstract: Process for producing multilayer ceramic substrates using greensheet technology and thin dielectric ceramic greensheets for miniaturization purposes. The process avoids the screening of the thin greensheets by forming self-supporting fusible particulate metal electrode layers, interposing them with the thin greensheets and sintering the assembly to form the multilayer substrates such as integrated capacitors.
    Type: Grant
    Filed: March 28, 1995
    Date of Patent: August 5, 1997
    Assignee: International Business Machines Corporation
    Inventors: Jon Alfred Casey, John Paul Gauci, Dinesh Gupta, Robert Anthony Rita, Robert J. Sullivan
  • Patent number: 5601672
    Abstract: Method for producing ceramic laminates from a plurality of greensheet layers which include one or more thin greensheet layers, e.g. having a thickness less than about 3 mils, with interposed patterned circuit layers and conductive vias, while avoiding the loss of strength and the distortion encountered when paste compositions are pre-applied to such thin greensheet layers. The invention avoids the aforementioned problems by the use of a plurality of greensheet layers including thicker, paste-resistant greensheet layers having a thickness greater than the thin greensheet layer, e.g., between 5 and 10 mils, each pair of the thicker greensheet layers confining therebetween an unscreened thin greensheet layer, one of the thicker greensheet layers also being screened with the circuit pattern layer normally applied to the interposed thin greensheet layer. Thereafter the superposed layers are laminated and sintered to form the composite.
    Type: Grant
    Filed: November 1, 1994
    Date of Patent: February 11, 1997
    Assignee: International Business Machines Corporation
    Inventors: Jon A. Casey, Dinesh Gupta, James R. Wylder
  • Patent number: 5480503
    Abstract: Process for producing circuitized greensheets including multi-layer ceramic sub-laminates and composites comprising thin ceramic greensheets carrying and thin, fine line patterned conductive metal layers. The invention comprises releasably-supporting the thin greensheets on a temporary carrier support having an ablatable release layer, preferably over a patterned conductive layer, and filling the vias with conductive metal paste, whereby the thin greensheets are supported against warpage and distortion. The supported greensheets are formed as single layers, pairs and stacks thereof, as desired, and thereafter separated from the temporary support for use.
    Type: Grant
    Filed: December 30, 1993
    Date of Patent: January 2, 1996
    Assignee: International Business Machines Corporation
    Inventors: Jon A. Casey, David B. Goland, Dinesh Gupta, Lester W. Herron, James N. Humenik, Thomas E. Lombardi, John U. Knickerbocker, Robert J. Sullivan, James R. Wylder