Abstract: A method includes receiving a training dataset that includes one or more spoken training utterances for training an automatic speech recognition (ASR) model. Each spoken training utterance in the training dataset paired with a corresponding transcription and a corresponding target sequence of auxiliary tokens. For each spoken training utterance, the method includes generating a speech recognition hypothesis for a corresponding spoken training utterance, determining a speech recognition loss based on the speech recognition hypothesis and the corresponding transcription, generating a predicted auxiliary token for the corresponding spoken training utterance, and determining an auxiliary task loss based on the predicted auxiliary token and the corresponding target sequence of auxiliary tokens. The method also includes the ASR model jointly on the speech recognition loss and the auxiliary task loss determined for each spoken training utterance.

Abstract: Aspects of the disclosure provide a method, an apparatus, and a non-transitory computer-readable storage medium for video decoding. The apparatus can include processing circuitry. The processing circuitry is configured to receive an image or video comprising one or more blocks. The processing circuitry can decode a first post-filtering parameter in the image or video corresponding to the one or more blocks to be reconstructed. The first post-filtering parameter applies to at least one of the one or more blocks and has been updated by a post-filtering module in a post-filtering neural network (NN) that is trained based on a training dataset. The processing circuitry can determine the post-filtering NN in a video decoder corresponding to the one or more blocks based on the first post-filtering parameter. The processing circuitry can decode the one or more blocks based on the determined post-filtering NN corresponding to the one or more blocks.

Abstract: The present disclosure relates generally to aromatic derivatives that are inhibitors of FGFR4 and are useful in treating FGFR4-associated diseases or conditions. Compositions containing the compounds of the present disclosure are also provided.

Abstract: The present application provides bicyclic amines of Formula (I): and their pharmaceutically acceptable salts thereof, that are inhibitors of cyclin-dependent kinase 2 (CDK2), as well as pharmaceutical compositions thereof, and methods of treating cancer using the same.

Abstract: Embodiments of the disclosure disclose a store system, and a method and an apparatus for processing information of clothing items for try-on. The store system comprises: a first device, deployed in a back warehouse area of a store and configured to obtain corresponding relationship between a user and information of one or more clothing items for try-on; and provide preparation prompt information based on the corresponding relationship to prepare the one or more clothing items for the user; and a fitting room, the fitting room comprising a first door and a second door, the first door configured for the user to enter and exit the fitting room, and the second door configured for delivering the one or more clothing items for try-on corresponding to the user from the back warehouse area to the fitting room.

Abstract: The present disclosure relates to a combined pharmaceutical composition containing a CDK4/6 inhibitor and a use thereof, and specifically relates to a combined pharmaceutical composition comprising a compound of formula (I) or a pharmaceutically acceptable salt thereof and fulvestrant. The present disclosure further relates to a use of the combined pharmaceutical composition in treating breast cancer. The combined pharmaceutical composition of the present disclosure produces better therapeutic effects in reducing tumor growth or even eliminating tumors.

Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: A method and apparatus for neural network based cross component prediction with scaling factors during encoding or decoding of an image frame or a video sequence, which may include training a deep neural network (DNN) cross component prediction (CCP) model with at least one or more scaling factors, wherein the at least one or more scaling factors are learned by optimizing a rate-distortion loss based on an input video sequence comprising a luma component, and reconstructing a chroma component based on the luma component using the trained DNN CCP model with the at least one or more scaling factors for chroma prediction. The trained DNN CCP may be updated for chroma prediction of the input video sequence using the one or more scaling factors, and performing chroma prediction of the input video sequence using the updated DNN CCP model with the one or more scaling factors.

Abstract: The present invention relates to extended recombinant polypeptide (XTEN) compositions, conjugate compositions comprising XTEN and XTEN linked to cross-linkers useful for conjugation to pharmacologically active payloads, methods of making highly purified XTEN, methods of making XTEN-linker and XTEN-payload conjugates, and methods of using the XTEN-cross-linker and XTEN-payload compositions.

Abstract: The present application provides tricyclic triazolo compounds that modulate the activity of diacylglycerol kinase (DGK), which are useful in the treatment of various diseases, including cancer.

Abstract: The present disclosure relates to methods for production of (Z)-11-hexadecen-1-ol in a yeast cell. Also disclosed are methods for production of (Z)-11-hexadecenal in a yeast cell. Also disclosed are methods for production of (Z)-11-hexadecen-1-yl acetate in a yeast cell. The disclosure also provides for nucleic acid constructs and yeast cells useful for performing the present methods, as well as to pheromone compositions.

Abstract: A semiconductor structure includes a composite redistribution structure, a first interconnect device and an integrated circuit (IC) package component. The composite redistribution structure includes a first redistribution structure, a second redistribution structure and a third redistribution structure. The second redistribution structure is located between the first redistribution structure and the third redistribution structure. The first interconnect device is embedded in the second redistribution structure. The first interconnect device includes a plurality of metal connectors leveled with a surface of the second redistribution structure and electrically connected to the third redistribution structure. The IC package component is disposed over the third redistribution structure and electrically connected to the first interconnect device via the third redistribution structure.

Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.

Abstract: Aspects of the disclosure provide a method and an apparatus for video encoding. The apparatus includes processing circuitry configured to generate an initial feature representation from an input image to be encoded and perform an iterative update of values of a plurality of elements in the initial feature representation. The iterative update includes generate a coded representation corresponding to a final feature representation based on the final feature representation that has been updated from the initial feature representation by a number of iterations of the iterative update. A reconstructed image corresponding to the final feature representation is generated based on the coded representation. An encoded image corresponding to the final feature representation having updated values of the plurality of elements is generated. One of (i) a rate-distortion loss corresponding to the final feature representation or (ii) the number of iterations of the iterative update satisfies a pre-determined condition.

Abstract: A package structure includes a substrate component, a redistribution structure, a package structure, and a probe head. The substrate component is laterally covered by an insulating encapsulation. The redistribution structure is disposed over the substrate component and the insulating encapsulation and electrically connected with the substrate component at a first side, wherein the redistribution structure comprises: a dielectric layer at a second side opposite to the first side; at least one conductive pad disposed in the dielectric layer, wherein a portion of the at least one conductive pad is exposed by the dielectric layer; and at least one conductive pattern in contact with the portion of the at least one conductive pad, wherein a hardness of the at least one conductive pattern is greater than a hardness of the at least one conductive pad. The probe head is electrically connected with the at least one conductive pattern and the at least one conductive pad.

Abstract: A registration method applied in a terminal device includes sending a first request, where the first request is used to request to register in a first cell, receiving a first message, where the first message is used to indicate that the terminal device is successfully registered in the first cell, when the first message does not carry a first network slice identifier and the terminal device cannot establish a protocol data unit (PDU) session on a first network slice corresponding to the first network slice identifier, sending a second request, where the second request is used to request to register in a second cell, receiving a second message, where the second message carries a second network slice identifier, and establishing the PDU session on a second network slice corresponding to the second network slice identifier.

Abstract: A method of forming an inductor including forming a first redistribution structure on a substrate, forming a first conductive via over and electrically connected to the first redistribution structure, depositing a first magnetic material over a top surface and sidewalls of the first conductive via, coupling a first die and a second die to the first redistribution structure, encapsulating the first die, the second die, and the first conductive via in an encapsulant, and planarizing the encapsulant and the first magnetic material to expose the top surface of the first conductive via while a remaining portion of the first magnetic material remains on sidewalls of the first conductive via, where the first conductive via and the remaining portion of the first magnetic material provide an inductor.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes an integrated substrate and a package component. The integrated substrate includes a substrate component laterally covered by an insulating encapsulation, a redistribution structure disposed over the substrate component and the insulating encapsulation, first conductive joints coupling the redistribution structure to the substrate component, and a buffer layer disposed on a lowermost dielectric layer of the redistribution structure and extending downwardly to cover an upper portion of each of the first conductive joints. A lower portion of each of the first conductive joints connected to the upper portion is covered by the insulating encapsulation. The package component disposed over and electrically coupled to the redistribution structure includes a semiconductor die laterally covered by an encapsulant.

Abstract: A method includes forming an inductor die, which includes forming a metal via over a substrate, forming a magnetic shell encircling the metal via, with the metal via and the magnetic shell collectively forming an inductor, and depositing a dielectric layer around the magnetic shell. The method further includes placing the inductor die over a carrier, encapsulating the inductor die in an encapsulant, forming redistribution lines electrically connecting to the inductor, and bonding a device die to the redistribution lines. The device die is electrically coupled to the inductor through the redistribution lines.