Abstract: According to embodiments of the present invention, a method of manufacturing an organic semiconductor device includes forming a first organic semiconductor layer on a substrate, and forming a self-assembled monolayer by providing a self-assembly precursor onto the first organic semiconductor layer. The first organic semiconductor layer has a reactive group on a top surface of the first organic semiconductor layer. The forming of the self-assembled monolayer includes forming a chemical bond between the self-assembly precursor and the reactive group of the first organic semiconductor layer.

Abstract: A light emitting device according to an embodiment includes a body having a recess; a light emitting chip disposed in the recess; and a first dampproof layer sealing the light emitting chip and extended from a surface of the light emitting chip to a bottom of the recess, wherein the light emitting chip includes a wavelength range of 100 nm to 280 nm, and the first dampproof layer includes a fluororesin-based material.

Abstract: Disclosed herein are a protective film having a structure capable of protecting an adherend and an electronic appliance including the same. The protective film includes a protection layer comprising polyolefin, and an adhesive layer laminated on the protection layer and comprising a silicone adhesive.

Abstract: A light emitting device and a manufacturing method therefor are provided, and the light emitting device includes an active layer including a light emitting material, an ionic material, and a polymer matrix, and the active layer is capable of being compressed and elongated and formed to be changed in luminous intensity depending on at least one of a pressure for the active layer and an elongation percentage of the active layer.

Abstract: A light emitting device according to an embodiment includes a body having a recess; a light emitting chip disposed in the recess; and a first dampproof layer sealing the light emitting chip and extended from a surface of the light emitting chip to a bottom of the recess, wherein the light emitting chip includes a wavelength range of 100 nm to 280 nm, and the first dampproof layer includes a fluororesin-based material.

Abstract: A light source unit disclosed in an embodiment includes a first cover which has an open region; a second cover which is coupled to the first cover; a light source module which is disposed between the first cover and the second cover, and has a light-emitting device disposed on the open region and a circuit board on which the light-emitting device is disposed; a fixing frame which is disposed between the second cover and the circuit board; and a resin member which is filled in an region between the first cover and the second cover and supports the light source module and the fixing frame. The light source module includes a moisture-proof film which covers an upper surface and side surfaces of the light-emitting device and extends to an upper surface of the circuit board.

Abstract: A light emitting device according to an embodiment includes a body having a recess; a light emitting chip disposed in the recess; and a first dampproof layer sealing the light emitting chip and extended from a surface of the light emitting chip to a bottom of the recess, wherein the light emitting chip includes a wavelength range of 100 nm to 280 nm, and the first dampproof layer includes a fluororesin-based material.

Abstract: Disclosed are an organic semiconductor compound that exhibits chemical resistance and etch resistance while maintaining electrical characteristics and thus is applicable to an existing photolithography process, thereby increasing process efficiency, and an organic semiconductor device using the same.

Abstract: An image sensor, comprising: a pixel array in which a plurality of pixels are arranged, wherein at least one of the plurality of pixels includes: a substrate including a photoelectric transformation element having a light receiving region and a light shielding region; and a first hafnium-containing layer formed to contact the substrate corresponding to the light shielding region.

Abstract: A bicycle transmission hub includes: a hub shaft to input a rotation force is input, the hub shaft having first pawls arranged on the outer peripheral surface thereof; a transmission controller for controlling the first pawls to appear and disappear; driving gears, each having a ratchet formed on the inner peripheral surface thereof to receive a rotation force by the first pawls, the driving gears having a different number of teeth, the hub shaft extending through the center of each driving gear; driven gears engaged with the driving gears, respectively, having a different number of teeth, and rotating; an output wheel rotating while being coupled to a driving gear adjacent thereto among the driving gears and having a second pawl disposed on the outer peripheral surface thereof; and a hub shell having a ratchet formed on the inner peripheral surface thereof to receive a rotation force by the second pawl.

Abstract: A light source unit disclosed in an embodiment includes a first cover which has an open region; a second cover which is coupled to the first cover; a light source module which is disposed between the first cover and the second cover, and has a light-emitting device disposed on the open region and a circuit board on which the light-emitting device is disposed; a fixing frame which is disposed between the second cover and the circuit board; and a resin member which is filled in an region between the first cover and the second cover and supports the light source module and the fixing frame. The light source module includes a moisture-proof film which covers an upper surface and side surfaces of the light-emitting device and extends to an upper surface of the circuit board.

Abstract: A visco-poroelastic elastomer-based capacitor type tactile sensor includes a first electrode, an active layer formed on a top surface of the first electrode and made of a visco-poroelastic elastomer, a second electrode formed on a top surface of the active layer, and a controller configured to provide an electric field generated orthogonal to an extension direction of the first electrode and the second electrode between the first electrode and the second electrode. In proportion to an external pressure applied to the tactile sensor, a concentration of effective ions present at the interfaces between the active layer and the first and second electrodes is increased.

Abstract: An organic semiconductor compound and a method for manufacturing the same is provided. The method for manufacturing the organic semiconductor compound may include stirring a solated organic semiconductor and a solated organometallic precursor. Herein, the manufacturing the organic semiconductor compound includes: forming a three-dimensional organic semiconductor compound by allowing the solated organic semiconductor to orthogonally penetrate one or more gaps in a lattice structure of a gelated organometallic precursor formed by stirring the solated organometallic precursor.

Abstract: A capacitor type tactile sensor and a method of manufacturing the capacitor type tactile sensor are provided. To elaborate, the device includes a first electrode, an active layer formed on a top surface of the first electrode, and a second electrode formed on a top surface of the active layer. The active layer is made of ionic elastomer, and a concentration of effective ions within the active layer is adjusted by an external pressure.

Abstract: A light emitting device and a manufacturing method therefor are provided, and the light emitting device includes an active layer including a light emitting material, an ionic material, and a polymer matrix, and the active layer is capable of being compressed and elongated and formed to be changed in luminous intensity depending on at least one of a pressure for the active layer and an elongation percentage of the active layer.

Abstract: According to embodiments of the present invention, a method of manufacturing an organic semiconductor device includes forming a first organic semiconductor layer on a substrate, and forming a self-assembled monolayer by providing a self-assembly precursor onto the first organic semiconductor layer. The first organic semiconductor layer has a reactive group on a top surface of the first organic semiconductor layer. The forming of the self-assembled monolayer includes forming a chemical bond between the self-assembly precursor and the reactive group of the first organic semiconductor layer.

Abstract: An image sensor is described. The image sensor may include a substrate including a pixel area, a logic area, and a guard area disposed between the pixel area and the logic area. The guard area may substantially prevent transfer of heat generated in the logic area from reaching the pixel area.

Abstract: Provided is a nanofiber based composite false twist yarn that is obtained by producing a nanofiber tape yarn by precisely slitting a nanofiber membrane produced by electrospinning and then twisting a nanofiber-only twist yarn that is obtained by twisting the nanofiber tape yarn or composite-twisting a nanofiber-only twist yarn and a natural fiber or synthetic fiber. The nanofiber based composite false twist yarn includes: a nanofiber tape yarn including at least one bonding portion or a false twist yarn which is obtained by false twisting the nanofiber tape yarn; and a natural fiber yarn or a synthetic fiber yarn that is composite-false-twisted with the nanofiber tape yarn or the false twist yarn, wherein the nanofiber tape yarn is made of a nanofiber web that is obtained by integrating polymer nanofibers made of a fiber-forming polymer material and having an average diameter of less than 1 ?m thereby having fine pores.

Abstract: An image sensor may include a pixel array where a plurality of unit pixels are arranged in a two dimensional matrix, wherein each of the unit pixels includes: a substrate including a photoelectric conversion element; one or more depletion inducing layers formed in the photoelectric conversion element; an inter-layer dielectric layer formed over the substrate; and one or more floating electrodes formed in the inter-layer dielectric layer to overlap each of the depletion inducing layers.

Abstract: A lighting device may be provided that includes: a heat sink which includes a base and a member extending from the base; a light source module which is disposed on a lateral surface of the member; and a reflector which is disposed on the member and has a disposition recess exposing the light source module, wherein the at least two light source modules are provided and the light source module includes a terminal plate which electrically connects the at least two light source modules, and wherein the terminal plate is disposed on the reflector.