Abstract: An organic light emitting display device secures an auxiliary electrode with a sufficient area without forming a passivation layer, an additional planarization film, an additional connection electrode and an auxiliary electrode. Accordingly, manufacturing of a top-emission organic light emitting display device may use three to four fewer masks, thus advantageously simplifying the process and reducing manufacturing costs, the thickness of the organic light emitting display device and the resistance of the second electrode.

Abstract: A display apparatus includes a plurality of pixels, each of the pixels including an organic light emitting diode, a first transistor providing a driving current to operate the organic light emitting diode, a second transistor including a gate electrode that receives a first scan signal, a first electrode that receives a data signal, and a second electrode electrically connected to the first electrode of the first transistor, a storage capacitor including a first electrode receiving a first power voltage and a second electrode electrically connected to the gate electrode of the first transistor, and a color accuracy enhancement transistor that applies a first back bias voltage to the first transistor in response to a color accuracy enhancement signal.

Abstract: Disclosed are a semiconductor device capable of reducing parasitic capacitance between adjacent conductive structures and a method for fabricating the same. The semiconductor device includes a plurality of bit line structures each comprising a first contact plug formed over a substrate and a bit line formed over the first contact plug. A spacer structure having air gaps is formed on sidewalls of the first contact plug and on sidewalls of the bit line. An plug isolation layer is formed between the plurality of bit line structures. The isolation layer includes an opening. A second contact plug is formed in the opening and a memory element is formed over the second contact plug.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Abstract: An organic light emitting diode display device includes a substrate, a driving transistor, and a sub-pixel structure. The substrate has a first trench. The driving transistor is inside the first trench of the substrate. The sub-pixel structure is on the driving transistor.

Abstract: A method of controlling a processor includes receiving from a command buffer a first command corresponding to a first instruction that is processed by a second processing core and starting processing of the first command by the first processing core, storing in the command buffer a second command corresponding to a second instruction that is processed by the second processing core before the processing of the first command is completed, and starting processing of a third instruction by the second processing core before the processing of the first command is completed.

Abstract: A quantum dot includes a seed and a core enclosing the seed. The core is grown from the seed to improve size uniformity of the core. The seed includes a first compound without Cd. The first compound may be GaP. The core may include a second compound including elements from group XIII and group XV. The second compound may be InP. The quantum dot may also include a first shell of a third compound enclosing the core. The third compound may be ZnSe or ZnS. The quantum dot may also include a second shell of a fourth compound enclosing the first shell. The fourth compound may be ZnS when the third compound is ZnSe. Embodiments also relate to a quantum dot including first to third elements selected from XIII group elements and XV group elements and fourth to sixth elements selected from XII group elements and XVI group elements.

Abstract: A method for distributing a load, according to one embodiment, includes: identifying characteristics of each of frames included in a received bit stream; and distributing loads of a plurality of cores based on the characteristics of each of the frames whenever the frames are decoded.

Abstract: A lithography apparatus is provided. The lithography apparatus a reticle having a first surface and a second surface facing each other, and a pattern region formed on the first surface, a reticle stage facing the second surface of the reticle, the reticle stage to chuck the reticle, a protection conductor within a chamber housing the reticle and the reticle stage; and a power source to supply a voltage to the protection conductor.

Abstract: A printed circuit board (PCB) includes a first insulating layer, a pad disposed on the first insulating layer, and a first reference layer on which the first insulating layer is disposed, the first reference layer including a dielectric passage for forming a return path of a signal that is transmitted to the pad, and a conductive line disposed in the dielectric passage and disposed to form a transmission path of the signal. The PCB further includes a second insulating layer on which the first reference layer is disposed, and a second reference layer on which the second insulating layer is disposed, the second reference layer further forming the return path. A capacitance of the pad corresponds to a distance between the pad and the second reference layer.

Abstract: Provided is a method of manufacturing a semiconductor package, the method including forming sawing grooves by sawing a wafer along individual chip boundaries in a downward direction from a top surface of the wafer by a thickness less than a wafer thickness, filling the sawing grooves with a molding material, forming a redistribution pattern, a passivation pattern, and an under bump metal (UBM) pattern on the wafer, bonging solder balls onto the UBM pattern, thinning the wafer based on a backgrinding process, and dividing the wafer into individual chips by sawing the molding material filled in the sawing grooves, in a downward direction.

Abstract: A method of manufacturing a semiconductor device includes alternately stacking sacrificial layers and interlayer insulating layers on a substrate, to form a stack structure; forming channels penetrating through the stack structure; forming separation regions penetrating through the stack structure; forming lateral openings by removing the sacrificial layers through the separation regions; and forming gate electrodes in the lateral openings. Forming the gate electrodes may include forming a nucleation layer in the lateral openings by supplying a source gas and a first reaction gas, and forming a bulk layer on the nucleation layer to fill the lateral openings by supplying the source gas and a second reaction gas, different from the first reaction gas. The first reaction gas may be supplied from a first reaction gas source, stored in a gas charging unit, and supplied from the gas charging unit.

Abstract: Disclosed is an apparatus and method of segmenting an object. An object segmentation method according to the present disclosure includes: receiving an input image; receiving an user input indicating at least one piece of information on a foreground region and a background region included in the input image; generating at least one among a foreground pixel list and a background pixel list using the received user input; calculating Gaussian distribution of at least one pixel that makes up the input image using at least one among the generated foreground pixel list and background pixel list; and determining whether the at least one pixel is a foreground pixel or a background pixel using the calculated Gaussian distribution.

Abstract: Disclosed herein is a ventilation seat of a vehicle, wherein since an adhesive material includes a through hole corresponding to an air flow path of a seat pad, when the seat pad and the adhesive material are joined to each other, an area disjoined between the seat pad and the adhesive material is prevented from occurring. Accordingly, noise caused by a gap that may occur between the seat pad and the adhesive material is prevented, which eliminates discomfort and displeasure due to the noise when a driver is seated in the seat and improves marketability of the ventilation seat.

Abstract: A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may be removed thereby exposing a second surface of the first redistribution layer. A dummy film may be temporarily affixed to the exposed second surface of the redistribution layer and a second encapsulant layer may be formed on the exposed top surface of the semiconductor die, a top surface and side edges of the first encapsulant layer, and side edges of the first redistribution layer. The dummy film may be removed to again expose the second surface of the first redistribution layer, and a second redistribution layer may be formed on the first redistribution layer and on the second encapsulant layer.

Abstract: A compressor control system includes a compressor compressing a fluid, an anti-surge valve preventing backflow in the compressor, the anti-surge valve being arranged on a line connecting an inlet and an outlet of the compressor and operated by a first signal, an inlet guide vane controlling an opening area of the inlet, the inlet guide vane being arranged at the inlet and operated by a second signal, and a controller connected to the anti-surge valve and the inlet guide vane and generating the first signal to control the anti-surge valve, a vane control signal to control the inlet guide vane, a pressure compensation signal to control the inlet guide vane to compensate for a change in pressure at the outlet of the compressor according to the first signal, and the second signal by combining the pressure compensation signal with the vane control signal.

Abstract: A method of inspecting a semiconductor substrate includes measuring light intensity of light reflected on the rotating semiconductor substrate, analyzing a frequency distribution of the measured light intensity, and determining a state of the semiconductor substrate by using the frequency distribution. The analyzing of the frequency distribution of the measured light intensity includes extracting a plurality of frequency components corresponding respectively to a plurality of frequencies from the measured light intensity.

Abstract: A defroster nozzle of a vehicle installed below a windshield of the vehicle and discharging conditioned air toward the windshield, the defroster nozzle generating vortex during discharging is disclosed. The defroster nozzle may include a housing formed in a cylindrical shape and having an inlet formed at one end of the housing through which the conditioned air is introduced, and an outlet formed adjacent to the windshield through which the air is discharged, and a vortex generator configured to protrude from an inner side surface of the housing to discharge the air introduced into the housing as vortex in the inner side surface of the housing.

Abstract: Restoring an image is achieved by restoring a block by executing at least one first restoring function and at least one second restoring function. The first restoring function may be implemented using software, and the second restoring function may be implemented using hardware. By assigning restoring functions to be either first restoring functions or second restoring functions, even an image having high resolution can be restored and reproduced in real-time.

Abstract: A method of preventing a bank conflict in a memory includes determining processing timing of each of threads of function units to access a first memory bank in which occurrence of a bank conflict is expected, setting a variable latency of each of the threads for sequential access of the threads according to the determined processing timing, sequentially storing the threads in a data memory queue according to the determined processing timing, and performing an operation by allowing the threads stored in the data memory queue to sequentially access the first memory bank whenever the variable latency of each of the threads passes.