Patents by Inventor Do-Geun Kim

Do-Geun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11873552
    Abstract: A substrate including plasmonic continuous film with curved surface and a method for manufacturing the same. More particularly, a substrate for an ultrasensitive spectroscopic sensor includes bowl-shaped plasmonic curved nanodimples and spiked plasmonic nanotips formed at contact points between the nanodimples at the same time, thereby greatly increasing the total volume of hotspots and being capable of concentrating and analyzing an extremely small amount of a sample.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: January 16, 2024
    Assignee: KOREA INSTITUTE OF MATERIALS SCIENCE
    Inventors: Sung-Gyu Park, Do-Geun Kim, Seung-Hoon Lee, Dong-Ho Kim
  • Publication number: 20230384715
    Abstract: An example image forming apparatus includes a power device, a photosensitive drum, a transfer device to remove remaining toner based on a cleaning bias voltage, an optical sensor to detect remaining toner, and a processor to adjust the cleaning bias voltage based on a set offset bias voltage. The processor may change a surface potential of the photosensitive drum to a voltage of a set pattern using the power device, acquire a size ratio of a periodic component based on a frequency of a signal detected from the remaining toner using the optical sensor, and, based on the acquired size ratio of the periodic component being greater than or equal to a set size ratio, adjust the cleaning bias voltage based on an offset bias voltage corresponding to the size ratio of the periodic component and provide the adjusted cleaning bias voltage to the transfer device to remove remaining toner.
    Type: Application
    Filed: June 18, 2021
    Publication date: November 30, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jung Hun SONG, Do Geun KIM, Jeong Hwan KIM
  • Publication number: 20230151986
    Abstract: The present disclosure relates to an air conditioning system and method for disinfection of a public facility. More specifically, the present disclosure relates to an air conditioning system and method for disinfection of a public facility capable of sterilizing or inactivating bio-aerosols existing in interior space by using the air conditioning equipment installed in the public facility structures.
    Type: Application
    Filed: January 2, 2023
    Publication date: May 18, 2023
    Inventors: Seung-hoon LEE, Do-geun Kim, Chang-su Kim, Joo-young Park, Sung-hoon Jung, Joon-hwan Choi, Eun-yeon Byeon, Jong-man Lee, Jang-hoon Ha, Sang-jin Kim
  • Patent number: 11540380
    Abstract: The disclosure relates to a flexible active species generator comprising: a first electrode of a conductive metal thin film; a second electrode of a ground electrode; a flexible dielectric layer of an insulator formed between the first electrode and the second electrode; and a plasma resistant functional layer formed between the dielectric layer and the second electrode, wherein the first electrode and the second electrode are electrically connected to an external power supply to generate an atmospheric pressure plasma to generate active species. The flexible active species generator has a plasma resistant function to prevent deformation and decomposition of an insulator caused by the plasma as well as an active species generating function from atmospheric pressure plasma, and has durability and safety, which is thus applicable to articles, foods, garments and human body in various forms.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: December 27, 2022
    Assignee: KOREA INSTITUTE OF MATERIALS SCIENCE
    Inventors: Seung Hoon Lee, Do Geun Kim, Sung Hoon Jung, Yu Ri Lee, Doo Ho Choi, Byoung Joon Kim
  • Publication number: 20220406570
    Abstract: This disclosure relates to a plasma generator including a porous ceramic dielectric. More specifically, this disclosure relates to a plasma generator for air purification capable of effectively generating ozone for removing bacteria, viruses, etc., and minimizing pressure loss while increasing air purification capacity by including a porous ceramic dielectric coated with an antibacterial material.
    Type: Application
    Filed: October 14, 2020
    Publication date: December 22, 2022
    Inventors: Seung-hoon LEE, Do-geun KIM, Chang-su KIM, Hun-kwan PARK
  • Publication number: 20210112651
    Abstract: The disclosure relates to a flexible active species generator comprising: a first electrode of a conductive metal thin film; a second electrode of a ground electrode; a flexible dielectric layer of an insulator formed between the first electrode and the second electrode; and a plasma resistant functional layer formed between the dielectric layer and the second electrode, wherein the first electrode and the second electrode are electrically connected to an external power supply to generate an atmospheric pressure plasma to generate active species. The flexible active species generator has a plasma resistant function to prevent deformation and decomposition of an insulator caused by the plasma as well as an active species generating function from atmospheric pressure plasma, and has durability and safety, which is thus applicable to articles, foods, garments and human body in various forms.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 15, 2021
    Inventors: Seung Hoon LEE, Do Geun KIM, Sung Hoon JUNG, Yu Ri LEE, Doo Ho CHOI, Byoung Joon KIM
  • Publication number: 20210017638
    Abstract: The present invention relates to a substrate including plasmonic continuous film with curved surface and a method for manufacturing the same. More particularly, the present invention relates to a substrate for an ultrasensitive spectroscopic sensor, which includes bowl-shaped plasmonic curved nanodimples and spiked plasmonic nanotips formed at contact points between the nanodimples at the same time, thereby greatly increasing the total volume of hotspots and being capable of concentrating and analyzing an extremely small amount of a sample, and a method for manufacturing the same.
    Type: Application
    Filed: January 23, 2020
    Publication date: January 21, 2021
    Applicant: Korea Institute of Machinery & Materials
    Inventors: Sung-Gyu PARK, Do-Geun KIM, Seung-Hoon LEE, Dong-Ho KIM
  • Patent number: 9601218
    Abstract: A memory system includes a read-only memory (ROM), a main memory and a processor. The ROM stores a basic input/output system (BIOS). The main memory includes a fail address table which stores at least one fail address designating a memory cell row having at least one defective cell. The processor receives fail information of the at least one fail address from the main memory and loads data associated with a booting operation of the memory system in a safe area of the main memory by avoiding a fail area corresponding to the at least one fail address during power-on operation while a power is applied to the memory system. The data associated with the booting operation is stored in a storage device.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: March 21, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bu-Il Jung, Ju-Yun Jung, Do-Geun Kim, Dong-Yang Lee, Min-Yeab Choo
  • Patent number: 9510457
    Abstract: Disclosed are methods of manufacturing a metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same. The method includes pre-treating a substrate by irradiating the plasma on the surface of the substrate (Step 1), forming a metal wiring on the pre-treated substrate in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the substrate including the metal wiring formed thereon in Step 2 and curing (Step 3), and separating the polymer layer formed in Step 3 from the substrate in Step 1 (Step 4). The metal wiring may be inserted into the flexible substrate, and the resistance of the wiring may be decreased. The metal wiring may be clearly separated from the substrate, and impurities on the substrate surface may be clearly removed. The flexible substrate may be easily separated by applying only physical force.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: November 29, 2016
    Assignee: Korea Institute of Machinery and Minerals
    Inventors: Jae Wook Kang, Do Geun Kim, Jong Kuk Kim, Sung Hun Jung, Seunghun Lee
  • Patent number: 9472305
    Abstract: A method of repairing a memory device including a boot memory region, a normal memory region, and a redundant memory region, the redundant memory region including a plurality of repair memory units, includes repairing the boot memory region by performing at least one of excluding first fault memory units of the boot memory region from use as storage and replacing the first fault memory units with boot repair memory units of the repair memory units, each of the first fault memory units having at least one fault memory cell; and after the repairing the boot memory region, repairing the normal memory region by performing at least one of excluding second fault memory units from use as storage and replacing the second fault memory units with normal repair memory units of the repair memory units.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: October 18, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Yeab Choo, Bu-Il Jung, Do-Geun Kim, Mi-Kyoung Park, Dong-Yang Lee, Sun-Young Lim, Ju-Yun Jung, Hyuk Han
  • Patent number: 9445504
    Abstract: Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate (Step 1), forming a metal wiring on the sacrificial layer in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing (Step 3) and separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 (Step 4).
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: September 13, 2016
    Assignee: Korea Institute of Machinery and Materials
    Inventors: Jae Wook Kang, Do Geun Kim, Jong Kuk Kim, Sung Hun Jung, Myungkwan Song, Dae Sung You, Chang Soo Kim, Kee Seok Nam
  • Publication number: 20160231941
    Abstract: In one aspect, data is stored in a solid state memory which includes first and second memory layers. A first assessment is executed to determine whether received data is hot data or cold data. Received data which is assessed as hot data during the first assessment is stored in the first memory layer, and received data which is first assessed as cold data during the first assessment is stored in the second memory layer. Further, a second assessment is executed to determine whether the data stored in the first memory layer is hot data or cold data. Data which is then assessed as cold data during the second assessment is migrated from the first memory layer to the second memory layer.
    Type: Application
    Filed: April 15, 2016
    Publication date: August 11, 2016
    Inventors: Moon-wook Oh, Do-geun Kim, Chan-ik Park
  • Patent number: 9208079
    Abstract: In one aspect, data is stored in a solid state memory which includes first and second memory layers. A first assessment is executed to determine whether received data is hot data or cold data. Received data which is assessed as hot data during the first assessment is stored in the first memory layer, and received data which is first assessed as cold data during the first assessment is stored in the second memory layer. Further, a second assessment is executed to determine whether the data stored in the first memory layer is hot data or cold data. Data which is then assessed as cold data during the second assessment is migrated from the first memory layer to the second memory layer.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: December 8, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-Wook Oh, Do-Geun Kim, Chan-Ik Park
  • Patent number: D794034
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: August 8, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo-jae Bang, Do-geun Kim, Hong-kyun Kim, Young-bok Jeon
  • Patent number: D794641
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: August 15, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo-jae Bang, Do-geun Kim, Hong-kyun Kim, Young-bok Jeon
  • Patent number: D794642
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: August 15, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo-jae Bang, Do-geun Kim, Hong-kyun Kim, Young-bok Jeon
  • Patent number: D794643
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: August 15, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo-jae Bang, Do-geun Kim, Hong-kyun Kim, Young-bok Jeon
  • Patent number: D794644
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: August 15, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo-jae Bang, Do-geun Kim, Hong-kyun Kim, Young-bok Jeon
  • Patent number: D795261
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: August 22, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo-jae Bang, Do-geun Kim, Hong-kyun Kim, Young-bok Jeon
  • Patent number: D795262
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: August 22, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo-jae Bang, Do-geun Kim, Hong-kyun Kim, Young-bok Jeon