Patents by Inventor Dominic Maier

Dominic Maier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11040872
    Abstract: The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: June 22, 2021
    Assignee: Infineon Technologies AG
    Inventors: Claus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier
  • Publication number: 20210172862
    Abstract: The present disclosure concerns an emitter package for a photoacoustic sensor, the emitter package comprising a MEMS infrared radiation source for emitting pulsed infrared radiation in a first wavelength range. The MEMS infrared radiation source may be arranged on a substrate. The emitter package may further comprise a rigid wall structure being arranged on the substrate and laterally surrounding a periphery of the MEMS infrared radiation source. The emitter package may further comprise a lid structure being attached to the rigid wall structure, the lid structure comprising a filter structure for filtering the infrared radiation emitted from the MEMS infrared radiation source and for providing a filtered infrared radiation in a reduced second wavelength range.
    Type: Application
    Filed: November 18, 2020
    Publication date: June 10, 2021
    Inventors: Siyuan Qi, Joachim Eder, Christoph Glacer, Dominic Maier, Mark Pavier
  • Patent number: 10626012
    Abstract: A semiconductor device having a lid, and method of making a semiconductor device having a lid is disclosed. The semiconductor device includes a substrate. A device is positioned at the substrate. A lid made of a semiconductor material is positioned over the device to form a protective cavity about the device. The lid is formed using a semiconductor process. In other examples, the lid may be made of a nonconductive material, such as a polymer material. The lids may be formed as part of a batch process.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: April 21, 2020
    Assignee: Infineon Technologies AG
    Inventors: Franz-Xaver Muehlbauer, Dominic Maier, Thomas Kilger
  • Patent number: 10600690
    Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: March 24, 2020
    Assignee: Infineon Technologies AG
    Inventors: Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol, Tobias Schmidt
  • Publication number: 20200051824
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
  • Publication number: 20200039820
    Abstract: The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
    Type: Application
    Filed: October 8, 2019
    Publication date: February 6, 2020
    Applicant: Infineon Technologies AG
    Inventors: Claus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier
  • Patent number: 10549985
    Abstract: A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: February 4, 2020
    Assignee: Infineon Technologies AG
    Inventors: Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Chee Yang Ng, Beng Keh See, Claus Waechter
  • Patent number: 10546752
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: January 28, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
  • Publication number: 20200023630
    Abstract: A device for debonding a structure from a main surface region of a carrier includes a tape for laminating to the structure, a first holder and a second holder for spanning the tape and to keep a tension of the tape. The second holder can be movable into a lifted position vertically offset to the main surface region of the carrier. The device can also include a deflecting-element for providing a deflection-line between the first holder and the second holder for deflecting the tape in response to moving the second holder into the lifted position. The deflecting-element can be moveable parallel to the carrier for moving the deflection-line parallel to the carrier and for debonding the structure, laminated to the tape, from the carrier.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 23, 2020
    Inventors: Alfred Sigl, Dominic Maier, Daniel Porwol
  • Publication number: 20190352175
    Abstract: A MEMS sensor includes a sensor package and a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side. The MEMS sensor includes a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion. The MEMS sensor includes a second opening in the sensor package, said second opening connecting the second partial volume to the external environment of the sensor package in an acoustically transparent fashion.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 21, 2019
    Inventors: David Tumpold, Dominic Maier
  • Patent number: 10435292
    Abstract: The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: October 8, 2019
    Assignee: Infineon Technologies AG
    Inventors: Claus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier
  • Publication number: 20190148253
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Application
    Filed: December 20, 2018
    Publication date: May 16, 2019
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
  • Publication number: 20190079055
    Abstract: Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.
    Type: Application
    Filed: November 14, 2018
    Publication date: March 14, 2019
    Inventors: Rui Miguel Moreira Araujo, Bernd Goller, Dominic Maier
  • Patent number: 10186468
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 22, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
  • Patent number: 10161908
    Abstract: Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: December 25, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Rui Miguel Moreira Araujo, Bernd Goller, Dominic Maier
  • Publication number: 20180350683
    Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.
    Type: Application
    Filed: August 13, 2018
    Publication date: December 6, 2018
    Inventors: Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol, Tobias Schmidt
  • Patent number: 10056295
    Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: August 21, 2018
    Assignee: Infineon Technologies AG
    Inventors: Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol, Tobias Schmidt
  • Patent number: 9988262
    Abstract: A method for fabricating an electronic device is disclosed. In one example, the method comprises providing a semiconductor wafer, forming a plurality of cavities into the semiconductor wafer, filling a stabilization material into the cavities, fabricating a temporary panel by applying a cap sheet onto the semiconductor wafer, the cap sheet covering the cavities, singulating the temporary panel into a plurality of semiconductor devices, fabricating an embedded wafer by embedding the semiconductor devices in an encapsulant, removing the cap sheet of each one of the semiconductor devices, and singulating the embedded wafer into a plurality of electronic devices.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: June 5, 2018
    Assignee: Infineon Technologies AG
    Inventors: Dominic Maier, Joachim Mahler, Daniel Porwol, Alfred Sigl
  • Publication number: 20180148322
    Abstract: A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.
    Type: Application
    Filed: August 31, 2017
    Publication date: May 31, 2018
    Inventors: Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Chee Yang Ng, Beng Keh See, Claus Waechter
  • Patent number: 9981843
    Abstract: A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of the chip. The cavities are filled or covered temporarily. The chips are then singulated. The singulated chips are embedded in an encapsulation material, and then the cavities are re-exposed.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: May 29, 2018
    Assignee: Infineon Technologies AG
    Inventors: Dominic Maier, Alfons Dehe, Thomas Kilger, Markus Menath, Franz Xaver Muehlbauer, Daniel Porwol, Juergen Wagner