Abstract: An electrical connector having an electrical interface assembly electrical processing circuitry, and an EMI barrier. The electrical interface assembly has a plurality of electrical contacts for interfacing with a receptacle when the electrical connector is connected to a corresponding receptacle. The electrical processing circuitry is for processing electrical signals received from at least some of the plurality of electrical contacts and/or to be sent to the plurality of electrical contacts. The EMI barrier substantially contains the electrical processing circuitry except at a number of EMI barrier openings. The largest of these EMI barrier openings is where the electrical contacts pass through the connector.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part, and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract: In one example embodiment, a host device includes a front panel, a bezel assembly, a floating PCB, and two host guides. The front panel defines an opening configured to receive a pluggable module in a plugging direction. The bezel assembly defines an opening configured to align with the front panel opening and to receive the pluggable module, the bezel assembly rigidly secured to the front panel. The host guides are rigidly secured to the floating PCB and are configured to guide the pluggable module when it is plugged into the host device. The host guides and bezel assembly operate together to allow the floating PCB to float with respect to the front panel in the plugging direction while remaining substantially aligned with the front panel in directions normal to the plugging direction.

Abstract: A transceiver module is provided that includes an optical subassembly having an extension with traces corresponding to traces defined on an associated transceiver substrate. A connector element including a flexible, non-electrically conductive substrate within which is disposed an array of conductors is placed between overlapping portions of the extension and the transceiver substrate so that upper ends of some of the conductors contact the traces of the extension, while lower ends of those same conductors contact the corresponding traces of the transceiver substrate. In this way, the connector element provides electrical communication between the optical subassembly and transceiver substrate, while also accommodating misalignment that may be present, or develop, in the transceiver module components.

Abstract: In one example embodiment, a pluggable optoelectronic module includes a shell with a front, back, and first and second sides. A first guiderail protrudes from the first side and extends from the front of the shell to the back of the shell. A second guiderail protrudes from the second side and also extends from the front of the shell to the back of the shell. A first thumbscrew runs the length of the module and is housed within the first guiderail. A second thumbscrew also runs the length of the module and is housed within the second guiderail. The two thumbscrews are configured to secure the module to a host device when the module is plugged into the host device.

Abstract: The principles of the present invention provide for a plastic ROSA that has a metallic EMI shroud covering a portion of the plastic ROSA. The combination of the plastic ROSA and the EMI shroud provides the unexpected result of having EMI shielding substantially similar to a metal ROSA.

Abstract: An optical transceiver includes a transceiver housing configured to receive an optical sub-assembly insert. The optical sub-assembly insert includes duplex cavities configured to hold a transmit optical sub-assembly front end and a receive optical sub-assembly front end in a fixed spatial orientation for a given optical connector interface. The optical sub-assembly insert is configurable to fit inside a transceiver housing with a relatively wide range of X and Y dimensional tolerance. In one implementation, the X-Y position of the optical sub-assembly insert is dictated by the position of the transmit optical-sub assembly front end after its corresponding back end has been mounted to a heat dissipation element. Any gaps that form between the optical sub-assembly insert and the inside surface of the transceiver housing as a result of the transmit optical sub-assembly position can be accommodated with filler material.

Abstract: In one example, an optical subassembly positioning plate is provided that includes a substantially flat body that defines at least one edge. A port is defined in the body. The port is configured to receive and secure an optical subassembly in an x-direction and a y-direction when said optical subassembly positioning plate is positioned within an optoelectronic transceiver module. A plurality of fingers is defined along at least one edge of the body. Each of the plurality of fingers is configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the optical subassembly is substantially retained in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.

Abstract: Integrated optical subassemblies (OSA) such as integrated transmit and receive optical subassemblies that may be implemented with an optical transceiver module that includes a molded body. The integrated OSA includes a mounting surface defined on a vertical portion of the molded body, a wall extending about the mounting surface, at least one optoelectronic device, such as a laser diode or a photodiode mounted on a transimpendence amplifier, positioned on the mounting surface, a plurality of bond pads included on the mounting surface in electrical connection with the at least one optoelectronic device, a plurality of conductive feedthroughs defined through the mounting surface, each feedthrough being in electrical communication with a corresponding one of the bond pads; and an optical fiber port that engages the wall extending about the mounting surface, wherein the optical fiber port is configured for receiving an optical fiber cable.

Abstract: In one example embodiment, a host device includes a host bezel, first and second guides, and a host connector. The host bezel defines an opening configured to receive a pluggable module. A first cutout on one side of the opening and a second cutout on the opposite side of the opening are adapted to receive corresponding guiderails on the module. The first and second guides are coupled to the host bezel and to a host printed circuit board. Each of the first and second guides defines a channel configured to receive the first and second guiderails of the module. The host connector is coupled to the host printed circuit board and is disposed at the back end of the first and second guides. The host connector includes a recessed slot configured to receive a module connector to electrically couple the module to the host printed circuit board.

Abstract: In one example embodiment, a pluggable optoelectronic module includes a shell with a front, back, and first and second sides. A first guiderail protrudes from the first side and extends from the front of the shell to the back of the shell. A second guiderail protrudes from the second side and also extends from the front of the shell to the back of the shell. A first thumbscrew runs the length of the module and is housed within the first guiderail. A second thumbscrew also runs the length of the module and is housed within the second guiderail. The two thumbscrews are configured to secure the module to a host device when the module is plugged into the host device.

Abstract: An electromagnetic interference (“EMI”) shield that can help control the emission of electromagnetic radiation from an optoelectronic module in which the EMI shield is positioned. In one example embodiment, an EMI shield includes a base and plurality of flanges extending from a perimeter of the base. The base defines an optical subassembly (“OSA”) opening and a plurality of complementary structures. The OSA opening is configured to receive an OSA. Each complementary structure is configured to engage a complementary structure of an OSA connector block.

Abstract: One example of a single-layer flexible circuit may include a top flexible substrate, a bottom flexible substrate, and a conductive layer disposed therebetween. Signal traces and ground traces can be located in the conductive layer.

Abstract: A communications device may include a connector block. The connector block may include a port. The port may be sized and configured to couple an optical fiber plug. The communications device may include an optical subassembly that may be connected to the connector block. The connector block may include a mount. The mount may be sized and configured to align the connector block and the optical subassembly. The mount may be configured as an EMI shield.

Abstract: In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably mounting a modular heatsink to the host system such that the host system directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot. The means for removably mounting has a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arranged can be removably mounted to the host system.

Abstract: An electrical connector receptacle that includes receptacle-side electrical contacts, a socket, and a receptacle shield. The socket is configured such that a connector may be inserted therein allowing the electrical contacts of the connector to interface with the receptacle-side electrical contacts. The receptacle shield is placed in the back of the receptacle, and is composed of an Electro-Magnetic Interference barrier material. In one embodiment, the receptacle shield is configured to interface with an EMI barrier of the connector, and includes separate slots through which electrical connections may pass.

Abstract: A fiber optic cable that includes one or more optical fibers, and one or more strength members spanning the length of the cable. The cable also includes a protective jacket protecting the cable across all, or at least substantially all of its length. One or more ends of the cable (and potentially as much as the entire length of the cable), includes a jacket portion that surrounds the strength member(s), and a jacket portion that surrounds the optical fiber(s). These jacket portions are connected by a peelable separation portion. Accordingly, when the optical fiber portion of the jacket is pulled relative to the strength member portion of the jacket, the separation portion ruptures permitting the strength member portion and the optical fiber portion to be peeled away from each other. This allows for independent control of the termination of the strength member(s) relative to the optical fiber(s).

Abstract: In one example embodiment, a collar clip includes a body that is sized and configured to partially encircle a shell of an optoelectronic transceiver module. Each extended element in a pair of the extended elements is separated from the other extended element in the pair by a cavity. Each cavity is configured to receive a portion of a corresponding structure of the shell.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards. The lead frame connectors include a conductive lead structure that is encased in an insert injection molded plastic casing. The lead frame connector is aligned with the leads that protrude from the back end of the corresponding optical sub-assembly (OSA). The leads pass through corresponding holes in the lead frame connector and are soldered to the conductors of the lead frame assembly. Once the soldering has been performed, the combined OSA and lead frame connector becomes a surface mount device that can then be mounted to the PCB. Assembling an optical transceiver using the lead frame connectors is generally less expensive and more reliable compared to the use of conventional flexible printed circuit board connectors.

Abstract: Discloses is a transceiver module having a box optical subassembly, a printed circuit board, and a connector extending from the box optical subassembly to the printed circuit board. The box optical subassembly includes a laser diode, a laser driver, and at least one pin receiving a driver signal for said laser driver. Optionally, the box optical subassembly includes a thermal electric cooler to cool one or more components within the box optical subassembly. The connector mounts to the at least one pin and is receivable by a pin header mounted to the printed circuit board to accommodate for variations in the orientation of the optical subassembly relative to the printed circuit board during optical alignment of the optical subassembly.