Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in a plurality of insert injection molded plastic casings. The plastic casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

Abstract: An optical transceiver module having improved heat dissipation characteristics is disclosed. The transceiver includes a transmitter optical subassembly (“TOSA”), comprising a hermetically sealed housing penetrated by a component platform that includes interior and exterior platform portions. The interior portion of the component platform supports a laser that produces optical signals for emission by the TOSA. A heat tongue is attached to the both the interior and exterior portions of the component platform and is configured to absorb heat that is produced by the laser and absorbed by the component platform. A heat spreader is positioned within the transceiver shell and includes a cavity defined adjacent the heat tongue. A slug is received into the cavity and is positioned to contact both the heat tongue and the heat spreader body. The slug enables heat from the tongue to be transmitted to the heat spreader and eventually to the transceiver shell.

Abstract: Lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical sub-assemblies and transceiver printed circuit boards.

Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. The conductors are bent as necessary and passed in a reel-to-reel manner through an insert injection molding process to form an electrically insulating casing about the conductors. After the molding process, the ribbon is singulated to obtain individual lead frame connectors. The individual conductors encased in the casing can be electrically separated by punching out a connecting conductive structure through a hole formed in the casing. The connecting conductive structure mechanically secures the conductors to each other during the molding process and, when punched out, substantially eliminate stubs that could otherwise degrade the RF performance of the lead frame connectors.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards. The lead frame connectors include a conductive lead structure that is encased in an insert injection molded plastic casing. The lead frame connector is aligned with the leads that protrude from the back end of the corresponding optical sub-assembly (OSA). The leads pass through corresponding holes in the lead frame connector and are soldered to the conductors of the lead frame assembly. Once the soldering has been performed, the combined OSA and lead frame connector becomes a surface mount device that can then be mounted to the PCB. Assembling an optical transceiver using the lead frame connectors is generally less expensive and more reliable compared to the use of conventional flexible printed circuit board connectors.

Abstract: An optical transceiver includes a transceiver housing configured to receive an optical sub-assembly insert. The optical sub-assembly insert includes duplex cavities configured to hold a transmit optical sub-assembly front end and a receive optical sub-assembly front end in a fixed spatial orientation for a given optical connector interface. The optical sub-assembly insert is configurable to fit inside a transceiver housing with a relatively wide range of X and Y dimensional tolerance. In one implementation, the X-Y position of the optical sub-assembly insert is dictated by the position of the transmit optical-sub assembly front end after its corresponding back end has been mounted to a heat dissipation element. Any gaps that form between the optical sub-assembly insert and the inside surface of the transceiver housing as a result of the transmit optical sub-assembly position can be accommodated with filler material.

Abstract: A transceiver module is provided that includes an optical subassembly having an extension with traces corresponding to traces defined on an associated transceiver substrate. A connector element including a flexible, non-electrically conductive substrate within which is disposed an array of conductors is placed between overlapping portions of the extension and the transceiver substrate so that upper ends of some of the conductors contact the traces of the extension, while lower ends of those same conductors contact the corresponding traces of the transceiver substrate. In this way, the connector element provides electrical communication between the optical subassembly and transceiver substrate, while also accommodating misalignment that may be present, or develop, in the transceiver module components.

Abstract: This disclosure concerns EMI control in electronics systems. In one example, an electromagnetic radiation containment system is provided for use in connection with functional modules and an associated card cage disposed in the chassis of an electronic equipment enclosure. The electromagnetic radiation containment system includes conductive elements uniformly distributed about the perimeter of a functional module configured to be received within the card cage, and further includes grounding elements in electrical communication with the chassis so that when the functional module is positioned within a slot of the card cage, at least some of the conductive elements are in electrical communication with the grounding elements. Electrical communication between the conductive elements and circuitry of the functional module facilitates EMI control in the electronic equipment enclosure.

Abstract: A latch mechanism for use with an electronic module, such as an opto-electronic transceiver module. The latch mechanism allows the user to selectively extract the transceiver module from the port by moving an attached bail between a first and second position. Specifically, the bail is connected to, and configured to translate, a pair of sliders that are configured and arranged to engage, and disengage from, corresponding structure of the port. When the bail is in the first position, the sliders releasably engage corresponding structure of the port. When the bail is moved from the first position to a second position, the sliders disengage from the corresponding structure of the port, thereby enabling unhindered extraction of the module from the port.

Abstract: A shield element for reducing electromagnetic interference (“EMI”) in an optical transceiver module assembly. The transceiver module assembly includes an optical transceiver received within a cage. The cage mounts to a host board and receives in one end thereof a right angle connector of the host board. A rear end of the optical transceiver includes an edge connector that electrically interfaces with a receptacle of the right angle connector. An EMI shield element is interposed between the rear end of the optical transceiver and the right angle connector. The EMI shield element includes a base that surrounds a portion of the right angle connector. Wall portions upwardly extend from the base around the right angle connector to form an angled shield seating surface that engages with a complementarily angled seating surface on the transceiver rear end, thereby forming an EMI shield when the optical transceiver is received into the cage.

Abstract: A latch mechanism for use with an electronic module, such as an opto-electronic transceiver module. The latch mechanism allows the user to selectively extract the transceiver module from the port by moving an attached bail between a first and second position. Specifically, the bail is connected to, and configured to translate, a pair of sliders that are configured and arranged to engage, and disengage from, corresponding structure of the port. When the bail is in the first position, the sliders releasably engage corresponding structure of the port. When the bail is moved from the first position to a second position, the sliders disengage from the corresponding structure of the port, thereby enabling unhindered extraction of the module from the port.

Abstract: A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.

Abstract: Presented is a detachable module connector comprising a main body with a first section, a second section, and a first opening extending through the first section and the second section, wherein the inner dimensions of the opening in the first section are different from the inner dimensions of the opening in the second section and the opening in the first section is sized to fit around a printed circuit board. The detachable connector is used to couple an electronic module that includes a printed circuit board to a host device. Also presented is a method of building a module using this detachable connector. The detachable connector simplifies the module manufacturing process because the module does not involve the costly hand-soldering and pcb-turning steps of the conventional methods.

Abstract: Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.

Abstract: An optical transceiver module having improved heat dissipation characteristics is disclosed. The transceiver includes a transmitter optical subassembly (“TOSA”), comprising a hermetically sealed housing penetrated by a component platform that includes interior and exterior platform portions. The interior portion of the component platform supports a laser that produces optical signals for emission by the TOSA. A heat tongue is attached to the both the interior and exterior portions of the component platform and is configured to absorb heat that is produced by the laser and absorbed by the component platform. A heat spreader is positioned within the transceiver shell and includes a cavity defined adjacent the heat tongue. A slug is received into the cavity and is positioned to contact both the heat tongue and the heat spreader body. The slug enables heat from the tongue to be transmitted to the heat spreader and eventually to the transceiver shell.

Abstract: An optical transceiver module for use in optical communications networks is disclosed. The transceiver features a simplified optical subassembly structure that facilitates the alignment and calibration of active optical components located thereon. The transceiver includes a shell that contains a transceiver printed circuit board and a transmitter/receiver optical subassembly (“TROSA”) connected to the printed circuit board via a TROSA connector. The TROSA includes a singular substrate on which a laser for producing optical signals and a photodetector for receiving optical signals are disposed. The laser and photodetector are precisely positioned on the TROSA substrate to have a specified spacing therebetween. So positioned, the laser and photodetector can be aligned with conduits of a sleeve assembly in a single alignment operation, thereby simplifying calibration of the transceiver module.

Abstract: A latch mechanism for use with an electronic module, such as an opto-electronic transceiver module. The latch mechanism allows the user to selectively extract the transceiver module from the port by moving an attached bail between a first and second position. Specifically, the bail is connected to, and configured to translate, a pair of sliders that are configured and arranged to engage, and disengage from, corresponding structure of the port. When the bail is in the first position, the sliders releasably engage corresponding structure of the port. When the bail is moved from the first position to a second position, the sliders disengage from the corresponding structure of the port, thereby enabling unhindered extraction of the module from the port.

Abstract: A card cage system is provided that includes a middle card guide interposed between two end card guides in an electronic equipment enclosure. Each of the card guides includes one or more channels adapted to receive a card edge. The middle card guide includes a removable adapter element that can permit insertion of two single wide cards in a side-by-side arrangement. When the adapter element is removed, a double-wide card can be received in the middle card guide such that it straddles the middle card guide. One or more elongate members can also be inserted in any of the card guides to add vertical or lateral stability. Thus, the card guide can be readily customized to accommodate a variety of card types and sizes, in various arrangements.

Abstract: A module housing for minimizing electromagnetic radiation leakage and a transceiver module built with this housing are presented. The housing includes a cover and a base disengagably coupled to each other, and a first and second layer of sidewalls located between the cover and the base. The two layers of sidewalls have different dimensions from each other so that a printed circuit board is enclosed in a space formed by the base, the cover, and either only the second layer of sidewall or both the first and second layer of sidewalls, depending on the thickness of the board. Another aspect of the invention is a pcb coupled to a connector and a housing for the pcb that includes an electromagnetic radiation shield between electronic components on the pcb and the connector. The shield reduces the amount of radiation reaching the connector. Also disclosed is a method of building this module.

Abstract: A shield element for reducing electromagnetic interference (“EMI”) in an optical transceiver module assembly. The transceiver module assembly includes an optical transceiver received within a cage. The cage mounts to a host board and receives in one end thereof a right angle connector of the host board. A rear end of the optical transceiver includes an edge connector that electrically interfaces with a receptacle of the right angle connector. An EMI shield element is interposed between the rear end of the optical transceiver and the right angle connector. The EMI shield element includes a base that surrounds a portion of the right angle connector. Wall portions upwardly extend from the base around the right angle connector to form an angled shield seating surface that engages with a complementarily angled seating surface on the transceiver rear end, thereby forming an EMI shield when the optical transceiver is received into the cage.