Abstract: An adapter element is provided for interfacing with a card guide of a card cage system to enable ready definition of various card storage configurations within the card cage system. The adapter element is configured to be removably attached to a card guide so that different card storage configurations may be readily defined within a particular card storage level by removing one or more adapter elements from the corresponding card guides and/or positioning one or more adapter elements in corresponding card guides. Additionally, the adapter element is configured to engage the fasteners of a functional module so as to securely retain the functional module in position in the card cage assembly when the adapter element is attached to the card guide.

Abstract: An optical subassembly is used in connection with an optoelectronic package with a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part, and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract: A card cage system is provided that includes a middle card guide interposed between two end card guides in an electronic equipment enclosure. Each of the card guides includes one or more channels adapted to receive a card edge. The middle card guide includes a removable adapter element that, when present in the middle card guide, prevents insertion of double wide, or larger, cards while, at the same time, permitting insertion of two single wide cards in a side-by-side arrangement. When the adapter element is removed, a double-wide card can be received in the middle card guide such that it straddles the middle card guide. The edges of the double-wide card are received in the first and second end card guides. Thus, the card guide can be readily customized to accommodate a variety of card types and sizes, in various arrangements.

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include one or more stamped and bent conductors that are encased in a plurality of casings. The casings provide electrical insulation for the conductors in the lead frame connector as well as mechanical support for the finished component. The casing is also configured to extend between a top portion and a base portion of the transceiver module to direct forces applied to the transceiver module away from the optical sub-assembly and the printed circuit board.

Abstract: Discloses is a transceiver module having a box optical subassembly, a printed circuit board, and a connector extending from the box optical subassembly to the printed circuit board. The box optical subassembly includes a laser diode, a laser driver, and at least one pin receiving a driver signal for said laser driver. Optionally, the box optical subassembly includes a thermal electric cooler to cool one or more components within the box optical subassembly. The connector mounts to the at least one pin and is receivable by a pin header mounted to the printed circuit board to accommodate for variations in the orientation of the optical subassembly relative to the printed circuit board during optical alignment of the optical subassembly.

Abstract: In one example, an optical transceiver is provided that includes a ROSA and a TOSA received within a block portion of an OSA block. The OSA block also includes two groups of adjustable elements, one group for each of the ROSA and the TOSA. The adjustable elements of the first group engage the block portion so as to contact the ROSA, and the adjustable elements of the second group engage the block portion so as to contact the TOSA. The position of the adjustable elements in each respective group can then be varied as necessary to locate and/or maintain the ROSA and TOSA in desired positions and orientations relative to, for example, respective optical connector ports of the optical transceiver.

Abstract: Lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical sub-assemblies and transceiver printed circuit boards.

Abstract: A card guide is provided that is suitable for use in connection with a card cage system of an electronic equipment enclosure. The card guide includes one or more engagement elements configured to interact with corresponding structure of the chassis of the electronic equipment enclosure so that the card guide lacks any degree of freedom when the card guide is positioned within a fully assembled electronic equipment enclosure. At least one of the engagement elements is configured and arranged to enage the corresponding structure of the chassis in a permanent snap-fit type arrangement.

Abstract: An electronic module is provided that includes a housing having electrically conductive top and bottom housing portions in substantial contact with each other and cooperating with each other to define an opening. A printed circuit board is disposed within the housing and includes an edge connector at least partially extending through the opening in the housing. The printed circuit board also defines a non-conductive through opening configured and arranged so that the housing portions contact each other by way of the through opening. In this way, the housing portions cooperate to subdivide the opening defined by the housing into at least two relatively smaller openings that, as a result of their relatively small size, facilitate containment of electromagnetic emissions generated by the electronic module.

Abstract: Novel single-layer flexible circuits are provided including a top flexible substrate, a bottom flexible substrate, and a conductive layer disposed therebetween. Signal traces and ground traces can be located in the conductive layer.

Abstract: An optical transceiver module characterized by reduced electromagnetic interference (“EMI”) emissions for improved operation is disclosed. The transceiver includes a housing formed by top and bottom housing portions that are joined to define a cavity. A printed circuit board (“PCB”) is positioned within the cavity and includes an edge connector extending from one housing end. The PCB also includes two holes defined near the edge connector and lined with electrically conductive material. Conductive plates located on both the top and bottom housing portions electrically connect with the conductive holes to electrically interconnect the top and bottom housing portions. Two posts on the top housing portion are received into the conductive holes to align the PCB with the housing portions. A chassis ground from one or both of the housing portions extends through the plates and holes to create a “chassis ground fence,” preventing EMI emission from within the transceiver cavity.

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

Abstract: A shaped lead configuration for use with optoelectronic packages, such as optical subassemblies, is disclosed. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules are disclosed. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. Each of the conductors can then be secured in a fixed position with respect to each other. A casing having a first part and a second part can then be molded about the conductors such that each of the conductors forms an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The conductors can be bent into any desired position to allow the electrical contacts to be connected to the optical sub assembly and the contact points to be connected to the printed circuit board.

Abstract: An optical transceiver module for use in optical communications networks is disclosed. The transceiver features a simplified optical subassembly structure that facilitates the alignment and calibration of active optical components located thereon. The transceiver includes a shell that contains a transceiver printed circuit board and a transmitter/receiver optical subassembly (“TROSA”) connected to the printed circuit board via a TROSA connector. The TROSA includes a singular substrate on which a laser for producing optical signals and a photodetector for receiving optical signals are disposed. The laser and photodetector are precisely positioned on the TROSA substrate to have a specified spacing therebetween. So positioned, the laser and photodetector can be aligned with conduits of a sleeve assembly in a single alignment operation, thereby simplifying calibration of the transceiver module.